HK6585A - Method and apparatus for controlling electroless plating bath - Google Patents

Method and apparatus for controlling electroless plating bath

Info

Publication number
HK6585A
HK6585A HK65/85A HK6585A HK6585A HK 6585 A HK6585 A HK 6585A HK 65/85 A HK65/85 A HK 65/85A HK 6585 A HK6585 A HK 6585A HK 6585 A HK6585 A HK 6585A
Authority
HK
Hong Kong
Prior art keywords
electroless plating
plating bath
controlling
controlling electroless
bath
Prior art date
Application number
HK65/85A
Other languages
English (en)
Inventor
Ken Araki
Yutaka Sugiura
Hiromitsu Sakai
Original Assignee
Uemura Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemura Kogyo Kk filed Critical Uemura Kogyo Kk
Publication of HK6585A publication Critical patent/HK6585A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D21/00—Control of chemical or physico-chemical variables, e.g. pH value
    • G05D21/02—Control of chemical or physico-chemical variables, e.g. pH value characterised by the use of electric means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
HK65/85A 1979-12-29 1985-01-24 Method and apparatus for controlling electroless plating bath HK6585A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54172961A JPS6016517B2 (ja) 1979-12-29 1979-12-29 無電解めつき制御方法

Publications (1)

Publication Number Publication Date
HK6585A true HK6585A (en) 1985-02-01

Family

ID=15951561

Family Applications (1)

Application Number Title Priority Date Filing Date
HK65/85A HK6585A (en) 1979-12-29 1985-01-24 Method and apparatus for controlling electroless plating bath

Country Status (7)

Country Link
US (2) US4350717A (xx)
JP (1) JPS6016517B2 (xx)
DE (1) DE3043065C3 (xx)
GB (1) GB2066510B (xx)
HK (1) HK6585A (xx)
MY (1) MY8500516A (xx)
SG (1) SG19384G (xx)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor
DE3404267A1 (de) * 1984-02-03 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zur vollautomatischen steuerung der galvanischen abscheidung von kupferueberzuegen aus sauren kupferbaedern
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5200047A (en) * 1985-02-28 1993-04-06 C. Uyemura & Co., Ltd. Plating solution automatic control
JPS61199069A (ja) * 1985-02-28 1986-09-03 C Uyemura & Co Ltd めっき液濃度自動連続管理装置
US4755744A (en) * 1986-01-21 1988-07-05 Rohrback Corporation Plated sensor for monitoring corrosion or electroplating
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4882537A (en) * 1988-05-09 1989-11-21 Rohrback Cosasco Systems, Inc. Method and apparatus for reducing interference in an electrical resistance probe during electrolytic plating
US5117370A (en) * 1988-12-22 1992-05-26 Ford Motor Company Detection system for chemical analysis of zinc phosphate coating solutions
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
US5993892A (en) * 1996-09-12 1999-11-30 Wasserman; Arthur Method of monitoring and controlling electroless plating in real time
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
KR100828482B1 (ko) * 2000-05-22 2008-05-13 우에무라 고교 가부시키가이샤 무전해 복합 도금액의 자동분석·관리장치
US6524642B1 (en) 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
JP3704054B2 (ja) * 2001-05-01 2005-10-05 東京エレクトロン株式会社 処理液の濃度を変更する方法及び処理液供給装置
US6500482B1 (en) * 2001-08-31 2002-12-31 Boules H. Morcos Electroless nickel plating solution and process for its use
US7341634B2 (en) * 2002-08-27 2008-03-11 Ebara Corporation Apparatus for and method of processing substrate
WO2004031446A1 (en) * 2002-10-01 2004-04-15 Omg Americas, Inc. Electroless metal-plating baths
US6773760B1 (en) * 2003-04-28 2004-08-10 Yuh Sung Method for metallizing surfaces of substrates
US7465358B2 (en) * 2003-10-15 2008-12-16 Applied Materials, Inc. Measurement techniques for controlling aspects of a electroless deposition process
TWI250614B (en) * 2005-04-08 2006-03-01 Chung Cheng Inst Of Technology Method for preparing copper interconnections of ULSI
KR20120034104A (ko) * 2009-07-16 2012-04-09 램 리써치 코포레이션 무전해 성막 용액 및 프로세스 제어
JP6863170B2 (ja) * 2016-12-21 2021-04-21 住友金属鉱山株式会社 無電解めっき液のめっき処理時間の測定方法、無電解めっき液を評価するための試料を作製する試料作製方法、および無電解めっき液の評価方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872353A (en) * 1954-01-12 1959-02-03 Gen Am Transport Processes of continuous chemical nickel plating
GB1011703A (en) 1962-11-06 1965-12-01 Jaroslav Prusek Aparatus for regulating the composition of electrolytes
FR1551275A (xx) 1966-12-19 1968-12-27
CH563000A5 (xx) 1973-03-09 1975-06-13 Plascon Ag
DE2538817C3 (de) * 1975-09-01 1980-11-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Bad und Verfahren zum stromlosen Vernickeln von Metall und Metallegierungen, insbesondere Aluminium und Aluminiumlegierungen
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
CA1093911A (en) * 1976-04-08 1981-01-20 George A. Butter Electroless copper plating
US4152164A (en) * 1976-04-26 1979-05-01 Michael Gulla Electroless nickel plating

Also Published As

Publication number Publication date
US4350717A (en) 1982-09-21
JPS5696065A (en) 1981-08-03
DE3043065A1 (de) 1981-07-02
DE3043065C2 (xx) 1993-11-18
JPS6016517B2 (ja) 1985-04-25
MY8500516A (en) 1985-12-31
GB2066510A (en) 1981-07-08
DE3043065C3 (de) 1993-11-18
GB2066510B (en) 1983-11-02
SG19384G (en) 1985-01-04
US4406250A (en) 1983-09-27

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Legal Events

Date Code Title Description
PE Patent expired