JPS6016493A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS6016493A JPS6016493A JP11046783A JP11046783A JPS6016493A JP S6016493 A JPS6016493 A JP S6016493A JP 11046783 A JP11046783 A JP 11046783A JP 11046783 A JP11046783 A JP 11046783A JP S6016493 A JPS6016493 A JP S6016493A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- layer
- adhesive
- manufacturing
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 235000011962 puddings Nutrition 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11046783A JPS6016493A (ja) | 1983-06-20 | 1983-06-20 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11046783A JPS6016493A (ja) | 1983-06-20 | 1983-06-20 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016493A true JPS6016493A (ja) | 1985-01-28 |
| JPH041518B2 JPH041518B2 (enExample) | 1992-01-13 |
Family
ID=14536443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11046783A Granted JPS6016493A (ja) | 1983-06-20 | 1983-06-20 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016493A (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56125890A (en) * | 1980-03-07 | 1981-10-02 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
-
1983
- 1983-06-20 JP JP11046783A patent/JPS6016493A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56125890A (en) * | 1980-03-07 | 1981-10-02 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041518B2 (enExample) | 1992-01-13 |
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