JPS60162544A - ねじ転造機におけるねじのスベリ不良検出装置 - Google Patents

ねじ転造機におけるねじのスベリ不良検出装置

Info

Publication number
JPS60162544A
JPS60162544A JP1447584A JP1447584A JPS60162544A JP S60162544 A JPS60162544 A JP S60162544A JP 1447584 A JP1447584 A JP 1447584A JP 1447584 A JP1447584 A JP 1447584A JP S60162544 A JPS60162544 A JP S60162544A
Authority
JP
Japan
Prior art keywords
die
screw
thread
fixed die
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1447584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649897B2 (enrdf_load_stackoverflow
Inventor
Hisao Ishii
久夫 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topura Co Ltd
Original Assignee
Topura Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topura Co Ltd filed Critical Topura Co Ltd
Priority to JP1447584A priority Critical patent/JPS60162544A/ja
Publication of JPS60162544A publication Critical patent/JPS60162544A/ja
Publication of JPS649897B2 publication Critical patent/JPS649897B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21H—MAKING PARTICULAR METAL OBJECTS BY ROLLING, e.g. SCREWS, WHEELS, RINGS, BARRELS, BALLS
    • B21H9/00—Feeding arrangements for rolling machines or apparatus manufacturing articles dealt with in this subclass
    • B21H9/02—Feeding arrangements for rolling machines or apparatus manufacturing articles dealt with in this subclass for screw-rolling machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP1447584A 1984-01-31 1984-01-31 ねじ転造機におけるねじのスベリ不良検出装置 Granted JPS60162544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1447584A JPS60162544A (ja) 1984-01-31 1984-01-31 ねじ転造機におけるねじのスベリ不良検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1447584A JPS60162544A (ja) 1984-01-31 1984-01-31 ねじ転造機におけるねじのスベリ不良検出装置

Publications (2)

Publication Number Publication Date
JPS60162544A true JPS60162544A (ja) 1985-08-24
JPS649897B2 JPS649897B2 (enrdf_load_stackoverflow) 1989-02-20

Family

ID=11862082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1447584A Granted JPS60162544A (ja) 1984-01-31 1984-01-31 ねじ転造機におけるねじのスベリ不良検出装置

Country Status (1)

Country Link
JP (1) JPS60162544A (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
JP2007523994A (ja) 2003-06-18 2007-08-23 アプライド　マテリアルズ　インコーポレイテッド バリヤ物質の原子層堆積

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818981U (ja) * 1981-07-30 1983-02-05 株式会社デサント 伸縮性細巾織物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818981U (ja) * 1981-07-30 1983-02-05 株式会社デサント 伸縮性細巾織物

Also Published As

Publication number Publication date
JPS649897B2 (enrdf_load_stackoverflow) 1989-02-20

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