JPS6015939A - 異物検査装置 - Google Patents

異物検査装置

Info

Publication number
JPS6015939A
JPS6015939A JP12321783A JP12321783A JPS6015939A JP S6015939 A JPS6015939 A JP S6015939A JP 12321783 A JP12321783 A JP 12321783A JP 12321783 A JP12321783 A JP 12321783A JP S6015939 A JPS6015939 A JP S6015939A
Authority
JP
Japan
Prior art keywords
foreign
optical system
matter
coordinates
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12321783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0441497B2 (enrdf_load_stackoverflow
Inventor
Masakuni Akiba
秋葉　政邦
Hiroto Nagatomo
長友　宏人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12321783A priority Critical patent/JPS6015939A/ja
Publication of JPS6015939A publication Critical patent/JPS6015939A/ja
Publication of JPH0441497B2 publication Critical patent/JPH0441497B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP12321783A 1983-07-08 1983-07-08 異物検査装置 Granted JPS6015939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12321783A JPS6015939A (ja) 1983-07-08 1983-07-08 異物検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12321783A JPS6015939A (ja) 1983-07-08 1983-07-08 異物検査装置

Publications (2)

Publication Number Publication Date
JPS6015939A true JPS6015939A (ja) 1985-01-26
JPH0441497B2 JPH0441497B2 (enrdf_load_stackoverflow) 1992-07-08

Family

ID=14855094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12321783A Granted JPS6015939A (ja) 1983-07-08 1983-07-08 異物検査装置

Country Status (1)

Country Link
JP (1) JPS6015939A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211140A (ja) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6211148A (ja) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6275336A (ja) * 1985-09-30 1987-04-07 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6276732A (ja) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd 異物検査装置
JPH0326944A (ja) * 1989-06-26 1991-02-05 Ulvac Japan Ltd 基板上の異物検査装置
US5814828A (en) * 1994-10-07 1998-09-29 Kabushiki Kaisha Topcon Apparatus for defining the location of a foreign object on a rotary body in terms of a coordinate system
WO2007141857A1 (ja) * 2006-06-08 2007-12-13 Olympus Corporation 外観検査装置
TWI408361B (zh) * 2004-12-10 2013-09-11 Olympus Corp 外觀檢查裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101390A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Foreign matter inspector
JPS54102837A (en) * 1978-01-28 1979-08-13 Nippon Telegr & Teleph Corp <Ntt> Pattern check system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101390A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Foreign matter inspector
JPS54102837A (en) * 1978-01-28 1979-08-13 Nippon Telegr & Teleph Corp <Ntt> Pattern check system

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211140A (ja) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6211148A (ja) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6275336A (ja) * 1985-09-30 1987-04-07 Hitachi Electronics Eng Co Ltd 異物検査装置
JPS6276732A (ja) * 1985-09-30 1987-04-08 Hitachi Electronics Eng Co Ltd 異物検査装置
JPH0326944A (ja) * 1989-06-26 1991-02-05 Ulvac Japan Ltd 基板上の異物検査装置
US5814828A (en) * 1994-10-07 1998-09-29 Kabushiki Kaisha Topcon Apparatus for defining the location of a foreign object on a rotary body in terms of a coordinate system
TWI408361B (zh) * 2004-12-10 2013-09-11 Olympus Corp 外觀檢查裝置
WO2007141857A1 (ja) * 2006-06-08 2007-12-13 Olympus Corporation 外観検査装置
JPWO2007141857A1 (ja) * 2006-06-08 2009-10-15 オリンパス株式会社 外観検査装置

Also Published As

Publication number Publication date
JPH0441497B2 (enrdf_load_stackoverflow) 1992-07-08

Similar Documents

Publication Publication Date Title
JP5171524B2 (ja) 物体表面の欠陥検査装置および方法
JP5469839B2 (ja) 物体表面の欠陥検査装置および方法
US11366069B2 (en) Simultaneous multi-directional laser wafer inspection
US20060007436A1 (en) Appearance inspection apparatus and projection method for projecting image of sample under inspection
JP2007071803A (ja) 欠陥観察方法及びその装置
JPH0318708A (ja) 表面検査方法及び装置
JPWO2008139735A1 (ja) 表面検査装置および表面検査方法
JP2008166806A (ja) プロービング装置で焦点を合わせて多平面画像を取得する装置と方法
JPS6015939A (ja) 異物検査装置
JPH09252035A (ja) 半導体ウェーハの外観検査方法および装置
US20090316981A1 (en) Method and device for inspecting a disk-shaped object
US7242467B2 (en) Method and apparatus for high-resolution defect location and classification
JPH0636016A (ja) 物体表面の欠陥の光学的検査法とその装置
JPH0458622B2 (enrdf_load_stackoverflow)
JP3586970B2 (ja) 微細パターンの検査方法および検査装置
JPS6196644A (ja) 外観検査装置
KR20170087328A (ko) 비전검사모듈 및 비전검사방법
JPH04348050A (ja) 材料表面検査装置
JP4586272B2 (ja) 基板検査装置と基板検査方法、及び液晶表示装置の製造方法
JP3644997B2 (ja) レーザ加工装置
JP2004347525A (ja) 半導体チップ外観検査方法およびその装置
JPH07333160A (ja) 被検査物の表面性状観察装置
JP3184640B2 (ja) ボンディングワイヤ検査装置
JPH04239149A (ja) 結晶劈開面検査用顕微鏡システム
TW200401879A (en) Microscope arrangement for inspecting a substrate