JPS60154646A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60154646A
JPS60154646A JP59010179A JP1017984A JPS60154646A JP S60154646 A JPS60154646 A JP S60154646A JP 59010179 A JP59010179 A JP 59010179A JP 1017984 A JP1017984 A JP 1017984A JP S60154646 A JPS60154646 A JP S60154646A
Authority
JP
Japan
Prior art keywords
bonding
lead
leads
semiconductor device
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59010179A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0481859B2 (cs
Inventor
Hiroshi Tate
宏 舘
Takayuki Okinaga
隆幸 沖永
Kanji Otsuka
寛治 大塚
Masayuki Shirai
優之 白井
Ken Okuya
謙 奥谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP59010179A priority Critical patent/JPS60154646A/ja
Publication of JPS60154646A publication Critical patent/JPS60154646A/ja
Publication of JPH0481859B2 publication Critical patent/JPH0481859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59010179A 1984-01-25 1984-01-25 半導体装置 Granted JPS60154646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59010179A JPS60154646A (ja) 1984-01-25 1984-01-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59010179A JPS60154646A (ja) 1984-01-25 1984-01-25 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6042256A Division JP2527530B2 (ja) 1994-03-14 1994-03-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS60154646A true JPS60154646A (ja) 1985-08-14
JPH0481859B2 JPH0481859B2 (cs) 1992-12-25

Family

ID=11743057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59010179A Granted JPS60154646A (ja) 1984-01-25 1984-01-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS60154646A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1321983A3 (en) * 2001-12-06 2006-04-05 Sanyo Electric Co., Ltd. Wiring board and semiconductor device
JP2019190721A (ja) * 2018-04-24 2019-10-31 株式会社日立産機システム 安全キャビネット

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53119862U (cs) * 1977-02-28 1978-09-22
JPS55108745U (cs) * 1979-01-23 1980-07-30
JPS5868951A (ja) * 1981-10-21 1983-04-25 Hitachi Ltd 半導体装置
JPS58110063A (ja) * 1981-12-23 1983-06-30 Nec Corp 集積回路装置
JPS58169949A (ja) * 1982-03-30 1983-10-06 Matsushita Electronics Corp 半導体装置
JPS6020524A (ja) * 1983-07-14 1985-02-01 Toshiba Corp 半導体集積回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53119862U (cs) * 1977-02-28 1978-09-22
JPS55108745U (cs) * 1979-01-23 1980-07-30
JPS5868951A (ja) * 1981-10-21 1983-04-25 Hitachi Ltd 半導体装置
JPS58110063A (ja) * 1981-12-23 1983-06-30 Nec Corp 集積回路装置
JPS58169949A (ja) * 1982-03-30 1983-10-06 Matsushita Electronics Corp 半導体装置
JPS6020524A (ja) * 1983-07-14 1985-02-01 Toshiba Corp 半導体集積回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1321983A3 (en) * 2001-12-06 2006-04-05 Sanyo Electric Co., Ltd. Wiring board and semiconductor device
JP2019190721A (ja) * 2018-04-24 2019-10-31 株式会社日立産機システム 安全キャビネット
WO2019207840A1 (ja) * 2018-04-24 2019-10-31 株式会社日立産機システム 安全キャビネット

Also Published As

Publication number Publication date
JPH0481859B2 (cs) 1992-12-25

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