JPS6015438A - ガラス繊維基材エポキシ樹脂シ−ト - Google Patents

ガラス繊維基材エポキシ樹脂シ−ト

Info

Publication number
JPS6015438A
JPS6015438A JP58122832A JP12283283A JPS6015438A JP S6015438 A JPS6015438 A JP S6015438A JP 58122832 A JP58122832 A JP 58122832A JP 12283283 A JP12283283 A JP 12283283A JP S6015438 A JPS6015438 A JP S6015438A
Authority
JP
Japan
Prior art keywords
epoxy resin
glass fiber
curing agent
fiber base
phosphonium salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58122832A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363981B2 (enrdf_load_stackoverflow
Inventor
Eiichi Tsunashima
瑛一 綱島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58122832A priority Critical patent/JPS6015438A/ja
Publication of JPS6015438A publication Critical patent/JPS6015438A/ja
Publication of JPH0363981B2 publication Critical patent/JPH0363981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
JP58122832A 1983-07-06 1983-07-06 ガラス繊維基材エポキシ樹脂シ−ト Granted JPS6015438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58122832A JPS6015438A (ja) 1983-07-06 1983-07-06 ガラス繊維基材エポキシ樹脂シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58122832A JPS6015438A (ja) 1983-07-06 1983-07-06 ガラス繊維基材エポキシ樹脂シ−ト

Publications (2)

Publication Number Publication Date
JPS6015438A true JPS6015438A (ja) 1985-01-26
JPH0363981B2 JPH0363981B2 (enrdf_load_stackoverflow) 1991-10-03

Family

ID=14845741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58122832A Granted JPS6015438A (ja) 1983-07-06 1983-07-06 ガラス繊維基材エポキシ樹脂シ−ト

Country Status (1)

Country Link
JP (1) JPS6015438A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283695A (ja) * 1986-06-02 1987-12-09 松下電器産業株式会社 フレキシブル配線基板
US5099902A (en) * 1989-05-30 1992-03-31 Bridgestone/Firestone, Inc. Offset wound helical bead for pneumatic tires

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130000A (enrdf_load_stackoverflow) * 1974-03-25 1975-10-14
JPS5553564A (en) * 1978-10-13 1980-04-19 Hitachi Chemical Co Ltd Preparation of thermal hardening resin laminated plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130000A (enrdf_load_stackoverflow) * 1974-03-25 1975-10-14
JPS5553564A (en) * 1978-10-13 1980-04-19 Hitachi Chemical Co Ltd Preparation of thermal hardening resin laminated plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283695A (ja) * 1986-06-02 1987-12-09 松下電器産業株式会社 フレキシブル配線基板
US5099902A (en) * 1989-05-30 1992-03-31 Bridgestone/Firestone, Inc. Offset wound helical bead for pneumatic tires

Also Published As

Publication number Publication date
JPH0363981B2 (enrdf_load_stackoverflow) 1991-10-03

Similar Documents

Publication Publication Date Title
US3700538A (en) Polyimide resin-fiberglass cloth laminates for printed circuit boards
US6187416B1 (en) Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
JP2512762B2 (ja) 多層プリント配線用基板
JPS6015438A (ja) ガラス繊維基材エポキシ樹脂シ−ト
US5206074A (en) Adhesives on polymide films and methods of preparing them
JPH08157621A (ja) プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム
JPH01222950A (ja) 積層板
JP3125582B2 (ja) 金属箔張り積層板の製造法
JPH0892394A (ja) 積層板成形用プリプレグおよび積層板
JPH04208597A (ja) 多層プリント配線板および多層プリント配線板の製造方法
JP2894496B2 (ja) 印刷回路用積層板の製造方法
JPH11204944A (ja) 多層印刷配線板の製造方法
JP3227874B2 (ja) 積層板の製造方法
JPS63219562A (ja) セラミツクコ−ト積層板の製造方法
JPH0356583B2 (enrdf_load_stackoverflow)
JP2567357B2 (ja) プリント配線用基板
JPH11228669A (ja) エポキシ樹脂組成物、プリプレグ、銅張り積層板、多層積層板
JP2935329B2 (ja) 金属箔張り積層板の製造法
JPS6324695A (ja) 多層プリント配線板の製造方法
JPS63297420A (ja) 層間絶縁樹脂組成物
JPH02308595A (ja) エポキシ樹脂多層銅張積層板
JPS60263497A (ja) プリント回路板の製法
JPH08231738A (ja) プリプレグ及び積層板
JPH01118539A (ja) 銅張積層板の製造法
JPS60236278A (ja) 配線用板