JPS6015438A - ガラス繊維基材エポキシ樹脂シ−ト - Google Patents
ガラス繊維基材エポキシ樹脂シ−トInfo
- Publication number
- JPS6015438A JPS6015438A JP12283283A JP12283283A JPS6015438A JP S6015438 A JPS6015438 A JP S6015438A JP 12283283 A JP12283283 A JP 12283283A JP 12283283 A JP12283283 A JP 12283283A JP S6015438 A JPS6015438 A JP S6015438A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- glass fiber
- curing agent
- phosphonium salt
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 18
- 239000011521 glass Substances 0.000 title abstract description 9
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 150000004714 phosphonium salts Chemical class 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000011282 treatment Methods 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000003607 modifier Substances 0.000 abstract 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12283283A JPS6015438A (ja) | 1983-07-06 | 1983-07-06 | ガラス繊維基材エポキシ樹脂シ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12283283A JPS6015438A (ja) | 1983-07-06 | 1983-07-06 | ガラス繊維基材エポキシ樹脂シ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6015438A true JPS6015438A (ja) | 1985-01-26 |
| JPH0363981B2 JPH0363981B2 (enrdf_load_stackoverflow) | 1991-10-03 |
Family
ID=14845741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12283283A Granted JPS6015438A (ja) | 1983-07-06 | 1983-07-06 | ガラス繊維基材エポキシ樹脂シ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6015438A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62283695A (ja) * | 1986-06-02 | 1987-12-09 | 松下電器産業株式会社 | フレキシブル配線基板 |
| US5099902A (en) * | 1989-05-30 | 1992-03-31 | Bridgestone/Firestone, Inc. | Offset wound helical bead for pneumatic tires |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50130000A (enrdf_load_stackoverflow) * | 1974-03-25 | 1975-10-14 | ||
| JPS5553564A (en) * | 1978-10-13 | 1980-04-19 | Hitachi Chemical Co Ltd | Preparation of thermal hardening resin laminated plate |
-
1983
- 1983-07-06 JP JP12283283A patent/JPS6015438A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50130000A (enrdf_load_stackoverflow) * | 1974-03-25 | 1975-10-14 | ||
| JPS5553564A (en) * | 1978-10-13 | 1980-04-19 | Hitachi Chemical Co Ltd | Preparation of thermal hardening resin laminated plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62283695A (ja) * | 1986-06-02 | 1987-12-09 | 松下電器産業株式会社 | フレキシブル配線基板 |
| US5099902A (en) * | 1989-05-30 | 1992-03-31 | Bridgestone/Firestone, Inc. | Offset wound helical bead for pneumatic tires |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0363981B2 (enrdf_load_stackoverflow) | 1991-10-03 |
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