JPS60153137A - 半導体装置の寸法測定方法 - Google Patents
半導体装置の寸法測定方法Info
- Publication number
- JPS60153137A JPS60153137A JP59009086A JP908684A JPS60153137A JP S60153137 A JPS60153137 A JP S60153137A JP 59009086 A JP59009086 A JP 59009086A JP 908684 A JP908684 A JP 908684A JP S60153137 A JPS60153137 A JP S60153137A
- Authority
- JP
- Japan
- Prior art keywords
- length
- electrodes
- layer
- resistance
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000005259 measurement Methods 0.000 title claims abstract description 12
- 238000009792 diffusion process Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims 3
- 230000000873 masking effect Effects 0.000 claims 2
- 239000011229 interlayer Substances 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 6
- 238000000691 measurement method Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59009086A JPS60153137A (ja) | 1984-01-20 | 1984-01-20 | 半導体装置の寸法測定方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59009086A JPS60153137A (ja) | 1984-01-20 | 1984-01-20 | 半導体装置の寸法測定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60153137A true JPS60153137A (ja) | 1985-08-12 |
JPH033943B2 JPH033943B2 (enrdf_load_stackoverflow) | 1991-01-21 |
Family
ID=11710802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59009086A Granted JPS60153137A (ja) | 1984-01-20 | 1984-01-20 | 半導体装置の寸法測定方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60153137A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100336792B1 (ko) * | 2000-05-25 | 2002-05-16 | 박종섭 | 실리사이드막 제조공정의 평가를 위한 시험 패턴의 구조 |
KR100819558B1 (ko) | 2006-09-04 | 2008-04-07 | 삼성전자주식회사 | 반도체 저항소자들 및 그의 형성방법들 |
US9153260B1 (en) * | 2008-03-27 | 2015-10-06 | Western Digital (Fremont), Llc | Electronic lapping guide in a magnetic recording transducer |
-
1984
- 1984-01-20 JP JP59009086A patent/JPS60153137A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100336792B1 (ko) * | 2000-05-25 | 2002-05-16 | 박종섭 | 실리사이드막 제조공정의 평가를 위한 시험 패턴의 구조 |
KR100819558B1 (ko) | 2006-09-04 | 2008-04-07 | 삼성전자주식회사 | 반도체 저항소자들 및 그의 형성방법들 |
US7838966B2 (en) | 2006-09-04 | 2010-11-23 | Samsung Electronics Co., Ltd. | Semiconductor devices including resistor elements comprising a bridge and base elements and related methods |
US9153260B1 (en) * | 2008-03-27 | 2015-10-06 | Western Digital (Fremont), Llc | Electronic lapping guide in a magnetic recording transducer |
Also Published As
Publication number | Publication date |
---|---|
JPH033943B2 (enrdf_load_stackoverflow) | 1991-01-21 |
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