JPS60132347A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60132347A
JPS60132347A JP58239740A JP23974083A JPS60132347A JP S60132347 A JPS60132347 A JP S60132347A JP 58239740 A JP58239740 A JP 58239740A JP 23974083 A JP23974083 A JP 23974083A JP S60132347 A JPS60132347 A JP S60132347A
Authority
JP
Japan
Prior art keywords
pressure
sealing
cap
semiconductor device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58239740A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455332B2 (cg-RX-API-DMAC10.html
Inventor
Takashi Ishida
尚 石田
Kanji Otsuka
寛治 大塚
Masatoshi Seki
関　正俊
Masayuki Shirai
優之 白井
Yasuyuki Yamazaki
康行 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58239740A priority Critical patent/JPS60132347A/ja
Publication of JPS60132347A publication Critical patent/JPS60132347A/ja
Publication of JPH0455332B2 publication Critical patent/JPH0455332B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58239740A 1983-12-21 1983-12-21 半導体装置の製造方法 Granted JPS60132347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58239740A JPS60132347A (ja) 1983-12-21 1983-12-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58239740A JPS60132347A (ja) 1983-12-21 1983-12-21 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60132347A true JPS60132347A (ja) 1985-07-15
JPH0455332B2 JPH0455332B2 (cg-RX-API-DMAC10.html) 1992-09-03

Family

ID=17049224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58239740A Granted JPS60132347A (ja) 1983-12-21 1983-12-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60132347A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6643919B1 (en) * 2000-05-19 2003-11-11 Siliconware Precision Industries Co., Ltd. Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808933B (zh) 2015-12-18 2023-07-21 德商何瑞斯廓格拉斯公司 石英玻璃體、二氧化矽顆粒、光導、施照體、及成型體及其製備方法
JP7224967B2 (ja) 2019-03-05 2023-02-20 株式会社マキタ アップライト集じん機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6643919B1 (en) * 2000-05-19 2003-11-11 Siliconware Precision Industries Co., Ltd. Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame

Also Published As

Publication number Publication date
JPH0455332B2 (cg-RX-API-DMAC10.html) 1992-09-03

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