JPS60118242U - Icチツプ用パツケ−ジ - Google Patents
Icチツプ用パツケ−ジInfo
- Publication number
- JPS60118242U JPS60118242U JP549384U JP549384U JPS60118242U JP S60118242 U JPS60118242 U JP S60118242U JP 549384 U JP549384 U JP 549384U JP 549384 U JP549384 U JP 549384U JP S60118242 U JPS60118242 U JP S60118242U
- Authority
- JP
- Japan
- Prior art keywords
- chip package
- thickness
- conductor pattern
- ground conductor
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP549384U JPS60118242U (ja) | 1984-01-19 | 1984-01-19 | Icチツプ用パツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP549384U JPS60118242U (ja) | 1984-01-19 | 1984-01-19 | Icチツプ用パツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60118242U true JPS60118242U (ja) | 1985-08-09 |
JPH0121564Y2 JPH0121564Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-27 |
Family
ID=30482047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP549384U Granted JPS60118242U (ja) | 1984-01-19 | 1984-01-19 | Icチツプ用パツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60118242U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-01-19 JP JP549384U patent/JPS60118242U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0121564Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-27 |
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