JPS60111497A - チップキャリアの塔載接続方法とその装置 - Google Patents
チップキャリアの塔載接続方法とその装置Info
- Publication number
- JPS60111497A JPS60111497A JP21908683A JP21908683A JPS60111497A JP S60111497 A JPS60111497 A JP S60111497A JP 21908683 A JP21908683 A JP 21908683A JP 21908683 A JP21908683 A JP 21908683A JP S60111497 A JPS60111497 A JP S60111497A
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- heating
- wiring board
- board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000969 carrier Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908683A JPS60111497A (ja) | 1983-11-21 | 1983-11-21 | チップキャリアの塔載接続方法とその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908683A JPS60111497A (ja) | 1983-11-21 | 1983-11-21 | チップキャリアの塔載接続方法とその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60111497A true JPS60111497A (ja) | 1985-06-17 |
| JPH0472398B2 JPH0472398B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-11-18 |
Family
ID=16730037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21908683A Granted JPS60111497A (ja) | 1983-11-21 | 1983-11-21 | チップキャリアの塔載接続方法とその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60111497A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
| JPS567786A (en) * | 1979-06-20 | 1981-01-27 | Hoffmann La Roche | Novel quinazoline compound |
| JPS5735081U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1980-08-04 | 1982-02-24 |
-
1983
- 1983-11-21 JP JP21908683A patent/JPS60111497A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
| JPS567786A (en) * | 1979-06-20 | 1981-01-27 | Hoffmann La Roche | Novel quinazoline compound |
| JPS5735081U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1980-08-04 | 1982-02-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472398B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-11-18 |
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