JPS6010698A - 多層配線基板およびその製造方法 - Google Patents
多層配線基板およびその製造方法Info
- Publication number
- JPS6010698A JPS6010698A JP11922183A JP11922183A JPS6010698A JP S6010698 A JPS6010698 A JP S6010698A JP 11922183 A JP11922183 A JP 11922183A JP 11922183 A JP11922183 A JP 11922183A JP S6010698 A JPS6010698 A JP S6010698A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- hole
- ceramic substrate
- layer
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims description 36
- 239000000919 ceramic Substances 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 description 17
- 229920001721 polyimide Polymers 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11922183A JPS6010698A (ja) | 1983-06-29 | 1983-06-29 | 多層配線基板およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11922183A JPS6010698A (ja) | 1983-06-29 | 1983-06-29 | 多層配線基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6010698A true JPS6010698A (ja) | 1985-01-19 |
JPH0239878B2 JPH0239878B2 (enrdf_load_stackoverflow) | 1990-09-07 |
Family
ID=14755951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11922183A Granted JPS6010698A (ja) | 1983-06-29 | 1983-06-29 | 多層配線基板およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6010698A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01262696A (ja) * | 1988-03-11 | 1989-10-19 | Internatl Business Mach Corp <Ibm> | 絶縁性基板を製造する方法 |
JPH01312886A (ja) * | 1988-06-10 | 1989-12-18 | Hitachi Ltd | セラミック積層回路基板及びその製造方法並びに前記基板の用途 |
JPH02119164A (ja) * | 1989-09-20 | 1990-05-07 | Hitachi Ltd | 半導体モジユール |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5120699A (enrdf_load_stackoverflow) * | 1974-08-13 | 1976-02-19 | Toyota Motor Co Ltd | |
JPS5237588A (en) * | 1975-09-19 | 1977-03-23 | Matsushita Electric Ind Co Ltd | Catalyst |
JPS557957A (en) * | 1978-07-03 | 1980-01-21 | Nippon Denso Co Ltd | Fuel injection valve for engine |
JPS5873193A (ja) * | 1981-10-28 | 1983-05-02 | 株式会社日立製作所 | 多層配線基板の製造方法 |
-
1983
- 1983-06-29 JP JP11922183A patent/JPS6010698A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5120699A (enrdf_load_stackoverflow) * | 1974-08-13 | 1976-02-19 | Toyota Motor Co Ltd | |
JPS5237588A (en) * | 1975-09-19 | 1977-03-23 | Matsushita Electric Ind Co Ltd | Catalyst |
JPS557957A (en) * | 1978-07-03 | 1980-01-21 | Nippon Denso Co Ltd | Fuel injection valve for engine |
JPS5873193A (ja) * | 1981-10-28 | 1983-05-02 | 株式会社日立製作所 | 多層配線基板の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01262696A (ja) * | 1988-03-11 | 1989-10-19 | Internatl Business Mach Corp <Ibm> | 絶縁性基板を製造する方法 |
JPH01312886A (ja) * | 1988-06-10 | 1989-12-18 | Hitachi Ltd | セラミック積層回路基板及びその製造方法並びに前記基板の用途 |
JPH02119164A (ja) * | 1989-09-20 | 1990-05-07 | Hitachi Ltd | 半導体モジユール |
Also Published As
Publication number | Publication date |
---|---|
JPH0239878B2 (enrdf_load_stackoverflow) | 1990-09-07 |
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