JPS60105243A - Fully automatic wire bonding equipment for multichip - Google Patents

Abstract

PURPOSE:To prevent the increase of total wire bonding time and the reduction of the operation rate of an equipment by separating a position detection section and a bonding section and enabling multi-operations of the position detection section and the bonding section. CONSTITUTION:A position detection section 2' is provided in a fully automatic wire bonding equipment separating from a bonding section 3 and multi-operations are made possible. The pattern of a programed bonding part 4' on a substrate and the reference bonding position of a semiconductor chip are detected by the position detection section 2' and a position detection head 5', the displacement of a position is stored temporarily in a memory, the displacement of the position of a bonding part 4'' is detected and corrected in two places in the pattern on the substrate, the position of a wire bonding point is corrected and a wire bonding is carried out by the bonding section 3 and a bonding head 6. The time of detecting the displacement of position is very short and the operation rate of the equipment can drastically be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fully automatic wire bonding apparatus for multi-chip in which a position detection section and a bonding section are separated to enable multiple operations.

Conventionally, in wire bonding for hybrid integrated circuits, etc., a large number of semiconductor chips are mounted on the same substrate, which increases the number of times the positions of the semiconductor chips and patterns on the substrate are detected, so the detection time is shorter than the time required for wire bonding. However, the drawbacks are an increase in the total wire bonding time including the long detection time and a decrease in the actual operating rate of the device. The present invention aims to solve such problems.

According to the present invention, when automatically connecting a large number of semiconductor chips mounted on a substrate to a pattern on the substrate by wire bonding, a reference is made between a large number of semiconductor chips that have been programmed in advance and a pattern on the substrate. It has a position detection section that detects and stores the amount of bonding positional deviation between a large number of semiconductor chips and the pattern on the substrate based on the bonding position, and a function to detect and correct the amount of positional deviation of the substrate using the pattern on the substrate. The bonding section that corrects the amount of bonding position deviation memorized by the detection section using the reference bonding position and automatically performs wire bonding between multiple semiconductor chips and patterns on the substrate is separated, and the A fully automatic wire bonding device for multi-chip, which is characterized by its operability, is obtained.

A detailed explanation will be given below using the drawings.

FIG. 1 shows a schematic configuration of a conventional fully automatic wire bonding apparatus, which includes a loader section 1 that supplies a bonding component 4, a pattern on a substrate (not shown) to which the bonding component is bonded, and a semiconductor chip (not shown). After the amount of positional deviation from the reference bonding position (not shown) is detected by the position detection unit 2 and the position detection unit 5, the bonding unit 3 and bonding head 6, which operate integrally with the position detection unit, detect the substrate pattern and After correcting the position of the semiconductor chip and performing each bonding, the semiconductor chip is stored in the unloader section 4. For example, when multiple semiconductor chips are mounted on the same substrate such as a hybrid integrated circuit,
There was a runner-up in which wire bonding could not be performed until the position detection of all semiconductor chips was completed.

FIG. 2 shows an analysis of the time required for conventional wire bonding. As the number of semiconductor pellets increases, the proportion of the detection time [1] increases compared to the bonding time t2, and the total bonding time T1 = tt - 1
There was a drawback that -tz increased.

FIG. 3 shows a schematic configuration diagram of a fully automatic wire bonding device according to the present invention. A position detection section 2' is further added to the conventional fully automatic wire bonding device and is separated from the bonding section 3, allowing multi-operation. The position detecting section 2' and the position detecting head 5' detect the pre-programmed pattern on the board of the bonding component 4' and the reference bonding position of the semiconductor chip, and temporarily store the amount of positional deviation in the memory. Furthermore, the position detection unit 2, which is separated from the position detection unit and performs multiple operations, detects and corrects the amount of positional deviation of the bonding component 4 using the position detection unit at two locations on the pattern on the board, and furthermore, the position detection unit 2 performs multiple operations and detects and corrects the positional deviation of the bonding component 4 at two locations on the pattern on the board. Correction is performed using the amount of deviation corresponding to the bonding part detected by the part, and then the bonding part 3 and the bonding head 6 perform wire bonding.

Furthermore, FIG. 4 shows an analysis diagram of the time required for wire bonding according to the present invention, in which the detection time t1 of the substrate pattern and semiconductor chip is compared with the bonding time t2 by operating the position detection section and the bonding section in multiple ways. can be ignored.

Furthermore, since the detection time t3 of the amount of positional deviation is very small compared to tl, the total bonding time T2=t'3+
The present invention provides a fully automatic wire bonding device for multi-type chips, which is expressed as t2 and can dramatically improve the operating rate of the device compared to the conventional method.

Although the present invention has been described above with reference to one embodiment, the position detection function etc. based on this invention are not limited to the above embodiment, and the patent rights related to the present invention are reserved for all claims. It extends to.

[Brief explanation of the drawing]

Fig. 1 is an example of a schematic configuration of a conventional fully automatic wire bonding device, Fig. 2 is an analysis diagram of the time required for conventional wire bonding, and Fig. 3 is a fully automatic wire bonding system for multi-chip chips according to the present invention. FIG. 4, which is an embodiment of the schematic configuration of the apparatus, is an analysis diagram of the time required for fully automatic wire bonding for multi-chip according to the present invention. 1...Loader section, 2. i, 2...Position detection section,...to bonding, C, 7...
Unloader section. foil l concave 3rd 4th vJ

Claims (1)

[Claims] When automatically wire bonding a large number of semiconductor chips mounted on a board to a pattern on the board, a large number of semiconductor chips mounted on a board are connected based on pre-programmed reference bonding positions between the semiconductor chips and the pattern on the board. It has a position detecting section that detects and stores the amount of bonding positional deviation between the semiconductor chip and the pattern on the substrate, and a function of detecting and correcting the amount of positional deviation of the substrate using the pattern on the substrate, and the bonding position stored in the position detecting section. The bonding section, which automatically wire-bonds multiple semiconductor chips to the patterns on the substrate by correcting the amount of deviation at the reference bonding position, is separated, and is characterized by the ability to perform multiple operations with the position detection section and the bonding section. Fully automatic wire bonding equipment for multi-chip.