JPH08110218A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE: To prevent a defective product from occurring due to erroneous setting of a lead frame. CONSTITUTION: In a semiconductor manufacturing apparatus for transferring a lead frame 12 to a position of a means for electrically connecting an electrode on a semiconductor chip with an inner lead, electrically connecting the electrode on the semiconductor chip with the inner lead and sealing it with resin, a guide rail 13 for the frame 12 is provided, a camera 15 and an ultrasonic image pickup device 16 for detecting a pattern of an upper face or a lower face of the frame 12 on the rail 13 are provided, and a lead frame erroneous setting detecting means for detecting erroneous setting of the frame 12 based on the pattern detected by the camera 15 and the device 16 is provided. The frame erroneous setting detecting means comprises a means for storing reference patterns of various lead frames in a memory in advance, comparing the pattern detected by the pattern detecting means with the reference patterns of the various lead frames and detecting erroneous setting of the lead frame 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a lead frame erroneous device which is provided with a pattern detecting means having a camera and an ultrasonic device and detects erroneous setting of the lead frame based on the detected pattern. The present invention relates to a semiconductor manufacturing apparatus provided with setting detection means.

[0002]

2. Description of the Related Art In a recent semiconductor manufacturing apparatus such as VLSI, in a packaging process, for example, a plastic packaging process, an assembling process starts from the backside grinding of a wafer, and the wafer is made into chips by dicing. Next, the chip is die-bonded to the package substrate, the pads (electrodes) and the leads (inner leads) of the chip are wire bonded and electrically connected, and then sealed with resin. When the die bonding and the wire bonding are performed, the positions of the positioning holes and the positions of the positioning pins existing on both sides of the lead frame are detected to align the semiconductor chip with the lead frame.

A plurality of lead frames are housed in a carrier magazine manually or mechanically. Then, the transport magazine is set (set) in the semiconductor manufacturing apparatus, the lead frame is taken out from the transport magazine, and set on the transport guide rail.

A pattern recognition means using a camera is used as a means for preventing erroneous lead frame orientation.

The technology of the plastic packaging process is described, for example, in "Practical course VLSI packaging technology (below)", pages 9 to 53, issued by Nikkei BP, May 31, 1993. .

[0006]

The present inventor has found the following problems as a result of examining the above-mentioned prior art.

When the lead frame is stored in the transport magazine manually or mechanically, there are problems such as the orientation of the lead frame in the working process and reverse frame bonding due to a setting mistake on the front and back of the lead frame.

Further, the above-described conventional lead frame orientation error preventing means is too simple and unsatisfactory, and therefore has problems such as time loss and erroneous detection at the camera location.

An object of the present invention is to provide a technique capable of preventing the generation of defective products due to incorrect setting of the lead frame.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

The following is a brief description of the outline of the typical inventions among the inventions disclosed in the present application.

The lead frame is conveyed to the position of the means for electrically connecting the electrode on the semiconductor chip and the inner lead of the lead, and the electrode on the semiconductor chip and the inner lead are electrically connected, and the resin is connected to the lead frame. In the semiconductor manufacturing apparatus for sealing with, a guide rail of the lead frame is provided, and a pattern detecting means having a camera for detecting a pattern on the upper surface or the lower surface of the lead frame on the rail and an ultrasonic imaging device is provided, and the pattern detection is performed. There is provided lead frame erroneous setting detection means for detecting erroneous setting of the lead frame based on the pattern detected by the means.

The lead frame erroneous setting detection means stores the reference patterns of various lead frames in a storage device in advance, and compares the patterns detected by the pattern detection means with the reference patterns of the various lead frames. Then, the lead frame is erroneously set.

[0014]

According to the above-mentioned means, the guide rail of the lead frame is provided, the pattern of the upper surface or the lower surface of the lead frame on the rail is detected by both the camera and the ultrasonic imaging device, and the detected lead frame is detected. Of the lead frame and the reference pattern of the various lead frames stored in the storage device in advance to confirm the setting of the lead frame and detect an erroneous setting. It is possible to accurately recognize the front and back sides of the lead frame and accurately detect an erroneous setting of the lead frame. Since the conveyance device is controlled by detecting the erroneous setting of the lead frame, it is possible to prevent defective products due to the erroneous setting of the lead frame.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and repeated description will be omitted.

FIG. 1 is a plan view showing a schematic structure of a semiconductor manufacturing apparatus according to an embodiment of the present invention. 11 is a loader magazine rack, 12 is a lead frame, and 13 is a guide rail for carrying the lead frame 12. , 14 is an unloader magazine rack, 15 is a camera, and 16 is an ultrasonic imaging apparatus.

FIG. 2 is a block diagram showing the schematic arrangement of the lead frame erroneous setting detection means of this embodiment. Reference numeral 21 is an analog / digital converter (A / D), and 22 is an information processing device (CPU) including a computer. ). The information processing device (CPU) 22 includes a processing unit 22A and a memory unit 22.
B, and the manufacturing apparatus control unit 22C. The reference patterns of various lead frames are stored in advance in the memory unit 22B. The respective reference patterns of the various lead frames may be stored in advance in an external storage device such as a disk or a ROM, read out and set in the memory unit 22B.

In the semiconductor manufacturing apparatus of this embodiment, as shown in FIG. 1, the lead frame 12 is transported to a position where the electrodes on the semiconductor chip and the inner leads of the leads are electrically connected, and the semiconductor device is mounted on the semiconductor chip. In the semiconductor manufacturing apparatus for electrically connecting the electrode of FIG. 1 and the inner lead and sealing it with resin, the guide rail 13 of the lead frame 12 is provided, and the lead frame 1 is provided on the rail 13.
A camera 15 and an ultrasonic imaging device 16 are provided for detecting the pattern on the upper surface or the lower surface of 2.

The lead frame 12 taken out from the loader magazine rack 11 is
The lead frame 12 is guided by the carrying guide rails 13 and is carried to the position of a means for electrically connecting the electrodes on the semiconductor chip and the inner leads. During the transportation, as shown in FIG. 2, the pattern of the set lead frame 12 is imaged by the camera 15 and the ultrasonic imaging apparatus 16, and the imaged patterns are respectively converted by the analog / digital converter (A / D) 21. Converted to digital signal,
It is input to the processing unit 22A of the information processing device (CPU) 22. The processing unit 22A sequentially reads the reference patterns of various lead frames stored in the memory unit 22B, compares them with the patterns of the set lead frame 12, and determines whether the set lead frame 12 is a predetermined lead frame. If the predetermined lead frame pattern does not match the orientation of the reference pattern or the front and back patterns of the lead frame, the manufacturing device controller 22C sends a transport device stop signal, an error signal, etc. to each device. It is like this.

As can be seen from the above description, according to this embodiment, both the camera 15 and the ultrasonic imaging device 16 provided above the transport guide rail 13 of the lead frame 12 have the upper surface of the lead frame. Alternatively, a pattern on the lower surface is detected, and the detected lead frame 12
Of the lead frame 12 and the front and back of the lead frame 12 by confirming the setting of the lead frame 12 by comparing the pattern of the lead frame 12 with the reference patterns of various lead frames stored in advance in the memory 22B. Since the recognition can be performed accurately, erroneous setting of the lead frame 12 can be detected accurately. This lead frame 1
Since the conveyance device is controlled by detecting the erroneous setting of No. 2, it is possible to prevent defective products due to the erroneous setting of the lead frame 12.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0023]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Both the camera and the ultrasonic imaging device can accurately recognize various lead frame patterns by detecting the set lead frame orientation and the upper surface or lower surface pattern. The setting can be detected accurately. Since the conveyance device is controlled by detecting the erroneous setting of the lead frame, it is possible to prevent defective products due to the erroneous setting of the lead frame.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic configuration of an embodiment according to the present invention.

FIG. 2 is a block diagram showing a schematic configuration of lead frame erroneous setting detection means of the present embodiment.

[Explanation of symbols]

11 ... loader magazine rack, 12 ... lead frame,
13 ... Lead frame 12 ... Guide rail, 14 ... Unloader magazine rack, 15 ... Camera, 16 ... Ultrasonic imaging device, 21 ... Analog-digital converter (A / D), 22 ... Information processing device (CPU), 22A ... Processing unit, 22B ... Memory unit, 2
2C ... Manufacturing device control unit.

Claims (2)

[Claims] 1. A lead frame is carried to a position of a means for electrically connecting an electrode on a semiconductor chip and an inner lead of a lead, and the electrode on the semiconductor chip and an inner lead are electrically connected, In a semiconductor manufacturing apparatus for sealing with a resin, a guide rail of the lead frame is provided, and pattern detection means having a camera for detecting a pattern on the upper surface or the lower surface of the lead frame on the rail and an ultrasonic imaging device is provided, A semiconductor manufacturing apparatus, comprising: lead frame erroneous setting detection means for detecting erroneous setting of a lead frame based on the pattern detected by the pattern detecting means. 2. The lead frame erroneous setting detection means,
Reference patterns of various lead frames are stored in a storage device in advance, and the means for detecting erroneous lead frame settings by comparing the patterns detected by the pattern detection means with the reference patterns of the various lead frames. The semiconductor manufacturing apparatus according to claim 1, wherein: