JP2765098B2 - Wire bonding apparatus and wire bonding method - Google Patents
Wire bonding apparatus and wire bonding methodInfo
- Publication number
- JP2765098B2 JP2765098B2 JP1242752A JP24275289A JP2765098B2 JP 2765098 B2 JP2765098 B2 JP 2765098B2 JP 1242752 A JP1242752 A JP 1242752A JP 24275289 A JP24275289 A JP 24275289A JP 2765098 B2 JP2765098 B2 JP 2765098B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- external circuit
- wire
- wire bonding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、極細金線等とICチップとを接続させるため
のワイアーボンディング装置に関する。Description: TECHNICAL FIELD The present invention relates to a wire bonding apparatus for connecting an ultrafine gold wire or the like to an IC chip.
ワイアーボンディング装置は、概略以下に示す装置に
よって構成される。すなわち、外部回路基板搬出装置
１、外部回路基板収納装置２、外部回路基板搬送装置
３、およびボンディングヘッド部13である。ボンディン
グヘッド部13は、ICチップ４上の外部接続用パッド６と
外部回路（または外部回路基板）５との位置関係を認識
するための位置認識用センサー装置９、認識状況を視覚
的に確認するための位置認識モニター10、認識した位置
関係に適性な補正を与えるための位置認識演算装置11と
記憶装置12、および極細金線等のボンディングワイアー
７を用いてICチップ４上の外部接続用パッド６との外部
回路５とを接続するボンディングツール部８によって構
成される。The wire bonding apparatus is generally constituted by an apparatus described below. That is, the external circuit board unloading device 1, the external circuit board storage device 2, the external circuit board transfer device 3, and the bonding head unit 13. The bonding head unit 13 is a position recognition sensor device 9 for recognizing the positional relationship between the external connection pads 6 on the IC chip 4 and the external circuit (or external circuit board) 5, and visually confirms the recognition status. Recognition monitor 10, a position recognition arithmetic unit 11 and a storage device 12 for giving an appropriate correction to the recognized positional relationship, and a pad for external connection on the IC chip 4 using a bonding wire 7 such as a fine gold wire. 6 and an external circuit 5.
実際のワイアーボンディングは、以下に示す動作から
成る。すなわち、外部回路基板搬出装置１内に収納され
ている外部回路５が外部回路基板搬送装置３へ送られ
る。外部回路５にはすでにICチップ４が装着されてい
る。外部回路基板搬送装置３は、ボンディングヘッド部
13の下部の位置まで外部回路５が搬送する。すると位置
認識用センサー装置９が、ICチップ４上の外部接続用パ
ッド６と外部回路５の位置関係を認識してその情報を位
置認識演算装置11へ送る。位置認識モニター10には、位
置認識用センサー装置９より得られた画像情報が映し出
される。位置認識演算装置11は得られた位置情報を、記
憶装置12に収納されている基準位置情報と比較して補正
量を計算し、その補正量だけボンディングヘッド部13を
移動される。その後記憶装置12に収納されている情報ど
おりにボンディングツール部８がICチップ４上の外部接
続用パッド６と外部回路５の間をボンディングワイアー
７でボンディングを行なう。ボンディングがすべて終了
すると、外部回路基板搬送装置３が外部回路５を外部回
路基板収納装置２に送り収納する。The actual wire bonding consists of the following operations. That is, the external circuit 5 housed in the external circuit board carrying-out device 1 is sent to the external circuit board carrying device 3. The IC chip 4 is already mounted on the external circuit 5. The external circuit board transfer device 3 includes a bonding head unit.
The external circuit 5 conveys to a position below 13. Then, the position recognition sensor device 9 recognizes the positional relationship between the external connection pad 6 on the IC chip 4 and the external circuit 5 and sends the information to the position recognition operation device 11. The position recognition monitor 10 displays image information obtained from the position recognition sensor device 9. The position recognition operation device 11 compares the obtained position information with reference position information stored in the storage device 12, calculates a correction amount, and moves the bonding head unit 13 by the correction amount. Thereafter, the bonding tool unit 8 performs bonding between the external connection pad 6 on the IC chip 4 and the external circuit 5 with the bonding wire 7 according to the information stored in the storage device 12. When all the bonding is completed, the external circuit board transfer device 3 sends the external circuit 5 to the external circuit board storage device 2 for storage.
従来のワイアーボンディング装置には、一つのボンデ
ィングヘッド部13が配置されていた。In the conventional wire bonding apparatus, one bonding head unit 13 was arranged.
しかし、前述の従来技術では、ICチップ４上の外部接
続用パッド６と外部回路５との接続数すなわちワイアー
ボンディング数が増加すると、ICチップ４一個をボンデ
ィングするのに必要とする時間が増加するという問題点
があった。However, in the above-described conventional technique, when the number of connections between the external connection pads 6 on the IC chip 4 and the external circuit 5, that is, the number of wire bondings increases, the time required for bonding one IC chip 4 increases. There was a problem.
一般的にこの時間はワイアーボンディング数に比例し
て増加する。１ワイアー分ボンディングするのに通常約
0.1〜0.5秒かかるので、100ワイアーの場合10秒〜50
秒、200ワイアーの場合20秒〜１分40秒、300ワイアーの
場合30秒〜２分30秒もの時間がかかることになる。Generally, this time increases in proportion to the number of wire bonds. Usually about 1 wire bonding
It takes 0.1 to 0.5 seconds, so 10 seconds to 50 for 100 wires
It takes 20 seconds to 1 minute and 40 seconds for seconds and 200 wires, and 30 seconds to 2 minutes and 30 seconds for 300 wires.
そこで本発明はこのような問題点を解決するもので、
その目的とするところはICチップ４のワイアーボンディ
ング数が増加しても、ボンディングするのに必要とする
時間をある時間内に収められることのできるワイアーボ
ンディング装置を提供するところにある。Therefore, the present invention solves such a problem,
An object of the present invention is to provide a wire bonding apparatus capable of keeping the time required for bonding within a certain time even if the number of wire bonding of the IC chip 4 increases.
本発明ワイアーボンディング装置は、ICチップをワイ
アーボンディングする複数のボンディングヘッドを有す
るワイアーボンディング装置であって、前記複数のボン
ディングヘッドは、一つのICチップ内の異なる箇所をワ
イアーボンディングし、前記複数のボンディングヘッド
のワイアーボンディングが終了したことを検出する検出
手段を有することを特徴とする。The wire bonding apparatus of the present invention is a wire bonding apparatus having a plurality of bonding heads for wire bonding an IC chip, wherein the plurality of bonding heads perform wire bonding at different locations within one IC chip, and It has a detecting means for detecting that the wire bonding of the head has been completed.
また、本発明のワイアーボンディング方法は、搬送手
段により、複数のICチップを複数のボンディングヘッド
の下部にそれぞれ配置する第１の工程と、前記複数のボ
ンディングヘッドにより、それぞれの前記ICチップに対
しワイアーボンディングする第２の工程と、全ての前記
複数のボンディングヘッドによるワイアーボンディング
が終了したことを検出する第３の工程と、搬送手段によ
り、前記複数のICチップを次のボンディングヘッドの下
部にそれぞれ配置する第４の工程とを有することを特徴
とする。The wire bonding method according to the present invention further includes a first step of arranging a plurality of IC chips below the plurality of bonding heads by a transport unit, and a step of wire-bonding each of the IC chips by the plurality of bonding heads. A second step of bonding, a third step of detecting completion of wire bonding by all of the plurality of bonding heads, and disposing the plurality of IC chips under a next bonding head by a transporting means, respectively. And a fourth step of performing the above.
第１図は本発明の実施例を示す図である。本実施例で
はボンディングヘッド部13を２つ配置している。第２図
はボンディングヘッド部13の構成を示した図である。第
５図は、本実施例のワイアーボンディング装置でボンデ
ィングする時のボンディング区分けの一例を示す図であ
る。同図において、領域Ａが最初のボンディングヘッド
部13aでボンディングされる領域、領域Ｂが２番目のボ
ンディングヘッド部13bでボンディングされる領域とす
る。なおこの区分けはほんの一例であり、二分できるも
のであればどのような区分けでもよい。FIG. 1 is a diagram showing an embodiment of the present invention. In this embodiment, two bonding heads 13 are arranged. FIG. 2 is a diagram showing a configuration of the bonding head unit 13. As shown in FIG. FIG. 5 is a diagram showing an example of bonding division when bonding with the wire bonding apparatus of this embodiment. In the figure, a region A is a region to be bonded by the first bonding head 13a, and a region B is a region to be bonded by the second bonding head 13b. Note that this division is only an example, and any division that can be divided into two may be used.
第１図の実施例によれば、外部回路基板搬出装置１内
の外部回路５は外部回路基板搬送装置３によって、ボン
ディングヘッド部13aの下部の位置まで送られる。この
時点でボンディングヘッド部13aが外部回路５の領域Ａ
の部分のボンディングを開始する。このボンディングが
終了すると、外部回路５は外部回路基板搬送装置３によ
ってボンディングヘッド部13bの下部の位置まで送られ
る。同時に次の外部回路５が、外部回路基板搬送装置３
によって同様にボンディングヘッド部13aの下部の位置
まで送られる。この時点でボンディングヘッド部13aお
よびボンディングヘッド部13bは、同時にそれぞれの下
部の外部回路５のボンディングを開始する。この時、ボ
ンディングヘッド部13aは外部回路５の領域Ａの部分の
みを、ボンディングヘッド部13bは外部回路５の領域Ｂ
の部分のみをボンディングする。このボンディングが終
了すると、ボンディングヘッド部13bの下部にある外部
回路５は外部回路基板搬送装置３によって外部回路基板
収納装置２に送られて収納される。同時に、ボンディン
グヘッド部13aの下部にある外部回路５は外部回路基板
搬送装置３によってボンディングヘッド部13bの下部の
位置まで送られる。以下この繰り返しである。According to the embodiment of FIG. 1, the external circuit 5 in the external circuit board unloading device 1 is sent by the external circuit board transporting device 3 to a position below the bonding head 13a. At this point, the bonding head 13a is moved to the area A of the external circuit 5.
Start bonding of the part. When the bonding is completed, the external circuit 5 is sent by the external circuit board transport device 3 to a position below the bonding head 13b. At the same time, the next external circuit 5 is
Is similarly sent to a position below the bonding head 13a. At this point, the bonding head 13a and the bonding head 13b simultaneously start bonding the lower external circuits 5 respectively. At this time, the bonding head portion 13a covers only the region A of the external circuit 5, and the bonding head portion 13b covers the region B of the external circuit 5.
Is bonded only. When the bonding is completed, the external circuit 5 below the bonding head 13b is sent to and stored in the external circuit board storage device 2 by the external circuit board transfer device 3. At the same time, the external circuit 5 below the bonding head 13a is sent by the external circuit board transport device 3 to a position below the bonding head 13b. Hereinafter, this is repeated.
ボンディングが終了して外部回路基板搬送装置３が外
部回路５を搬送し始めるタイミングは、ボンディング時
間の最も長いボンディングヘッド部13の時間に設定する
必要があるが、この時間はワイアーボンディング数によ
り、あるいは領域ＡおよびＢの区分けのやりかたにより
変化するので、設定はかなり困難である。しかし、ここ
で同期装置14を設置することによりこの問題は解決する
ことができる。すなわち、ボンディングヘッド部13aお
よび13bはそれぞれのボンディングが終了した時点で終
了情報を同期装置14へ送る。同期装置14はすべてのボン
ディングヘッド部13の終了情報を管理していてすべての
終了情報を受けた時点で搬送開始情報を外部回路基板搬
送装置３に送る。以上の方法によって、ワイアーボンデ
ィング数や領域ＡおよびＢの区分けのやりかたにかかわ
らず自動的に正しいタイミングで、外部回路基板搬送装
置３が外部回路５を搬送し始めることができる。The timing at which the external circuit board transfer device 3 starts transferring the external circuit 5 after the bonding needs to be set to the time of the bonding head unit 13 having the longest bonding time. This time is determined by the number of wire bondings or The setting is quite difficult because it changes depending on how the areas A and B are divided. However, this problem can be solved by installing the synchronization device 14 here. That is, the bonding head units 13a and 13b send end information to the synchronizer 14 when the respective bondings are completed. The synchronizer 14 manages the end information of all the bonding head units 13 and sends the transfer start information to the external circuit board transfer device 3 when all the end information is received. According to the above method, the external circuit board transfer device 3 can start to transfer the external circuit 5 automatically and at the correct timing regardless of the number of wire bonds and the manner of dividing the areas A and B.
以上、ボンディングヘッド部13を２つ配置したことに
よって、ワイアーボンディング数が同じであれば従来の
ワイアーボンディング装置に比べてほぼ1/2の時間でボ
ンディングを行なうことできる。また、ワイアーボンデ
ィング数が２倍になった場合のボンディング時間が、従
来では２倍になるのに比べほぼ同時間で済み、３倍にな
った場合従来では３倍になるのに比べて1.5倍の時間で
済む。As described above, by arranging two bonding heads 13, bonding can be performed in approximately half the time as compared with a conventional wire bonding apparatus if the number of wire bondings is the same. Also, when the number of wire bondings doubles, the bonding time is almost the same as compared with the conventional case of doubling, and when the number is three times, the bonding time is 1.5 times as compared with the conventional case. Time.
ボンディングヘッド部13をさらに増して配置すること
により、この効果がさらに一層発揮されることは明白で
ある。It is clear that this effect can be further enhanced by arranging the bonding head 13 further.
以上述べたように本発明のワイアーボンディング装置
によれば、実際に接続を行なう部分であるボンディング
ヘッド部を２つ、あるいはそれ以上の個数を配置した、
あるいは前記ワイアーボンディング装置において、それ
ぞれのボンディングヘッド部のボンディング終了時を検
知して、その次に行なわれるボンディングまでの動作を
同期させるための同期装置を配置したことにより、ICチ
ップのワイアーボンディング数が増加しても、ボンディ
ングするのに必要とする時間をある時間内に収められる
という効果を有する。As described above, according to the wire bonding apparatus of the present invention, two or more bonding heads, which are parts to be actually connected, are arranged.
Alternatively, in the wire bonding apparatus, a synchronization device for detecting the completion of bonding of each bonding head unit and synchronizing the operation until the next bonding is arranged, so that the number of wire bonding of the IC chip is reduced. Even if it increases, the time required for bonding can be kept within a certain time.
また、ボンディングの終了を検出して、搬送手段が搬
送を始めるため、搬送手段の搬送開始のタイミングを設
定する必要はない。よって、ワイアーボンディング数の
変更等があっても、設定変更事項が少なくなるという効
果を有する。In addition, since the end of the bonding is detected and the transfer means starts the transfer, there is no need to set the transfer start timing of the transfer means. Therefore, even if the number of wire bondings is changed, there is an effect that the number of setting change items is reduced.
第１図は本発明のワイアーボンディング装置の一実施例
を示す図。 第２図はボンディングヘッド部の構成を示した図。 第３図はICチップと外部回路とのワイアーボンディング
を示す図。 第４図は従来のワイアーボンディング装置を示す図。 第５図は第１図の実施例のワイアーボンディング装置で
ボンディングする時のボンディング区分けの一例を示す
図。 １……外部回路基板搬出装置 ２……外部回路基板収納装置 ３……外部回路基板搬送装置 ４……ICチップ ５……外部回路（または外部回路基板） ６……外部接続用パッド ７……ボンディングワイアー ８……ボンディングツール部 ９……位置認識用センサー装置 10……位置認識モニター 11……位置認識演算装置 12……記憶装置 13……ボンディングヘッド部 14……同期装置FIG. 1 is a diagram showing an embodiment of a wire bonding apparatus according to the present invention. FIG. 2 is a diagram showing a configuration of a bonding head unit. FIG. 3 is a diagram showing wire bonding between an IC chip and an external circuit. FIG. 4 is a diagram showing a conventional wire bonding apparatus. FIG. 5 is a diagram showing an example of bonding division when bonding with the wire bonding apparatus of the embodiment of FIG. 1; DESCRIPTION OF SYMBOLS 1 ... External circuit board unloading device 2 ... External circuit board storage device 3 ... External circuit board conveying device 4 ... IC chip 5 ... External circuit (or external circuit board) 6 ... External connection pad 7 ... Bonding wire 8: Bonding tool unit 9: Position recognition sensor device 10: Position recognition monitor 11: Position recognition arithmetic unit 12: Storage device 13: Bonding head unit 14: Synchronizing device
Claims (2)
のボンディングヘッドを有するワイアーボンディング装
置であって、 前記複数のボンディングヘッドは、一つのICチップ内の
異なる箇所をワイアーボンディングし、 前記複数のボンディングヘッドのワイアーボンディング
が終了したことを検出する検出手段を有することを特徴
とするワイアーボンディング装置。1. A wire bonding apparatus having a plurality of bonding heads for wire-bonding an IC chip, wherein the plurality of bonding heads wire-bond different portions within one IC chip. A wire bonding apparatus, comprising: detecting means for detecting completion of wire bonding.
ボンディングヘッドの下部にそれぞれ配置する第１の工
程と、 前記複数のボンディングヘッドにより、それぞれの前記
ICチップに対しワイアーボンディングをする第２の工程
と、 全ての前記複数のボンディングヘッドによるワイアーボ
ンディングが終了したことを検出する第３の工程と、 搬送手段により、前記複数のICチップを次のボンディン
グヘッドの下部にそれぞれ配置する第４の工程とを有す
ることを特徴とするワイアーボンディング方法。2. A first step of arranging a plurality of IC chips under a plurality of bonding heads by a transporting means, respectively;
A second step of performing wire bonding on the IC chip; a third step of detecting that wire bonding by all of the plurality of bonding heads has been completed; and a next bonding of the plurality of IC chips by a transport unit. And a fourth step of arranging the wires under the head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1242752A JP2765098B2 (en) | 1989-09-19 | 1989-09-19 | Wire bonding apparatus and wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1242752A JP2765098B2 (en) | 1989-09-19 | 1989-09-19 | Wire bonding apparatus and wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03104245A JPH03104245A (en) | 1991-05-01 |
| JP2765098B2 true JP2765098B2 (en) | 1998-06-11 |
Family
ID=17093743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1242752A Expired - Fee Related JP2765098B2 (en) | 1989-09-19 | 1989-09-19 | Wire bonding apparatus and wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2765098B2 (en) |
-
1989
- 1989-09-19 JP JP1242752A patent/JP2765098B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03104245A (en) | 1991-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2005017968A3 (en) | Semiconductor device package and method for manufacturing same | |
| JPH10144705A (en) | Die bonding apparatus having multiple bonding system | |
| EP0981152A3 (en) | High speed flip-chip dispensing | |
| EP0737935A3 (en) | Non-contact IC card and process for its production | |
| JP2765098B2 (en) | Wire bonding apparatus and wire bonding method | |
| JP2003347345A (en) | Semiconductor device, its manufacturing method and its manufacturing apparatus | |
| JP2534912B2 (en) | Wire bonding equipment | |
| JPS61159746A (en) | Wire bonding method for ic module | |
| JPH03157947A (en) | Tab bonding device | |
| JPS62194634A (en) | Confirmation of position of die bonding of semiconductor chip | |
| JP2685137B2 (en) | Wire bonder | |
| KR100237324B1 (en) | Inner lead clamp construction of wire bonding system for manufacturing semiconductor package and wire bonding method thereof | |
| JP2849519B2 (en) | Semiconductor device bonding equipment | |
| JPH07142525A (en) | Semiconductor device, connection wire bonding and bonding area bonding | |
| JPH08110218A (en) | Semiconductor manufacturing apparatus | |
| JP2002164361A (en) | Semiconductor manufacturing apparatus and method of manufacturing the same | |
| JPH05136195A (en) | Wire bonding apparatus | |
| JPH06310569A (en) | Face-down bonding method of semiconductor element | |
| JPH01241138A (en) | Wire bonding of semiconductor device | |
| JP3356259B2 (en) | Wire-bonding method | |
| JPS60105243A (en) | Fully automatic wire bonding equipment for multichip | |
| JPH04368139A (en) | Bonding position information detector | |
| EP0376924A3 (en) | Gold compression bonding | |
| JP2818515B2 (en) | Semiconductor manufacturing equipment | |
| JPH0330345A (en) | Manufacture of semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080403 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090403 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |