JPS60105225A - 半導体基板処理方法 - Google Patents
半導体基板処理方法Info
- Publication number
- JPS60105225A JPS60105225A JP21245483A JP21245483A JPS60105225A JP S60105225 A JPS60105225 A JP S60105225A JP 21245483 A JP21245483 A JP 21245483A JP 21245483 A JP21245483 A JP 21245483A JP S60105225 A JPS60105225 A JP S60105225A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- etching
- processing method
- substrate processing
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21245483A JPS60105225A (ja) | 1983-11-14 | 1983-11-14 | 半導体基板処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21245483A JPS60105225A (ja) | 1983-11-14 | 1983-11-14 | 半導体基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60105225A true JPS60105225A (ja) | 1985-06-10 |
| JPH0151054B2 JPH0151054B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-11-01 |
Family
ID=16622886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21245483A Granted JPS60105225A (ja) | 1983-11-14 | 1983-11-14 | 半導体基板処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105225A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1983
- 1983-11-14 JP JP21245483A patent/JPS60105225A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0151054B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-11-01 |
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