JPS60100460A - リードフレーム処理装置用自己整列装置 - Google Patents

リードフレーム処理装置用自己整列装置

Info

Publication number
JPS60100460A
JPS60100460A JP59161497A JP16149784A JPS60100460A JP S60100460 A JPS60100460 A JP S60100460A JP 59161497 A JP59161497 A JP 59161497A JP 16149784 A JP16149784 A JP 16149784A JP S60100460 A JPS60100460 A JP S60100460A
Authority
JP
Japan
Prior art keywords
lead frame
actuator
semiconductor
frame
processing devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59161497A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543183B2 (enExample
Inventor
サイド・フサイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JPS60100460A publication Critical patent/JPS60100460A/ja
Publication of JPH0543183B2 publication Critical patent/JPH0543183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Automatic Assembly (AREA)
JP59161497A 1983-08-31 1984-07-31 リードフレーム処理装置用自己整列装置 Granted JPS60100460A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US528016 1983-08-31
US06/528,016 US4505225A (en) 1983-08-31 1983-08-31 Self-aligning apparatus for semiconductor lead frame processing means

Publications (2)

Publication Number Publication Date
JPS60100460A true JPS60100460A (ja) 1985-06-04
JPH0543183B2 JPH0543183B2 (enExample) 1993-06-30

Family

ID=24103916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59161497A Granted JPS60100460A (ja) 1983-08-31 1984-07-31 リードフレーム処理装置用自己整列装置

Country Status (5)

Country Link
US (1) US4505225A (enExample)
JP (1) JPS60100460A (enExample)
DE (1) DE3431837C2 (enExample)
FR (1) FR2551584B1 (enExample)
GB (1) GB2148542A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364334A (ja) * 1986-09-04 1988-03-22 Matsushita Electronics Corp ワイヤ−ボンデイング装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297712A (en) * 1987-10-06 1994-03-29 Kabushiki Kaisha Toshiba System for feeding and positioning articles being processed
JPH0198541A (ja) * 1987-10-06 1989-04-17 Toshiba Corp 物品搬送装置
US5114557A (en) * 1991-02-20 1992-05-19 Tooltek Engineering Corp. Selective plating apparatus with optical alignment sensor
US5410124A (en) * 1993-04-01 1995-04-25 Micron Technology, Inc. Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip
KR100372115B1 (ko) * 2000-09-20 2003-02-14 성우전자 주식회사 뒤집힘 감지구조를 갖는 리드프레임 은도금 장치
EP1882469A1 (en) * 2006-07-28 2008-01-30 3M Innovative Properties Company Polyether-based preparations and use thereof
EP2923774B1 (en) * 2014-03-24 2019-02-13 Sulzer Mixpac AG Dispenser
CN106238273B (zh) * 2016-09-30 2018-08-21 山东才聚电子科技有限公司 一种引线框架刮胶机及其工作过程
CN112221876B (zh) * 2020-09-28 2022-06-21 苏州天准科技股份有限公司 传送设备及点胶系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735362U (enExample) * 1980-07-31 1982-02-24

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2977924A (en) * 1954-03-16 1961-04-04 Patent & Licensing Corp Device for accurately placing lanes of granules on moving web
US3104986A (en) * 1960-08-08 1963-09-24 Robert L Goman Fluid dispensing system
US3562036A (en) * 1967-07-07 1971-02-09 Electro Connective Systems Inc Continuous method of making indefinite lengths of flexible flat conductor cable and circuits
CA1052912A (en) * 1975-07-07 1979-04-17 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
US3999506A (en) * 1975-07-15 1976-12-28 Jones & Laughlin Steel Corporation Vapor deposition apparatus
JPS5826828B2 (ja) * 1978-04-26 1983-06-06 新光電気工業株式会社 テ−プキヤリアの製造方法
US4364977A (en) * 1981-07-06 1982-12-21 National Semiconductor Corporation Automatic self-adjusting processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735362U (enExample) * 1980-07-31 1982-02-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364334A (ja) * 1986-09-04 1988-03-22 Matsushita Electronics Corp ワイヤ−ボンデイング装置

Also Published As

Publication number Publication date
JPH0543183B2 (enExample) 1993-06-30
GB2148542A (en) 1985-05-30
GB8416784D0 (en) 1984-08-08
FR2551584B1 (fr) 1987-08-21
DE3431837C2 (de) 1994-05-26
DE3431837A1 (de) 1985-03-14
US4505225A (en) 1985-03-19
FR2551584A1 (fr) 1985-03-08

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EXPY Cancellation because of completion of term