JPS5999794A - 厚膜回路装置 - Google Patents

厚膜回路装置

Info

Publication number
JPS5999794A
JPS5999794A JP57208892A JP20889282A JPS5999794A JP S5999794 A JPS5999794 A JP S5999794A JP 57208892 A JP57208892 A JP 57208892A JP 20889282 A JP20889282 A JP 20889282A JP S5999794 A JPS5999794 A JP S5999794A
Authority
JP
Japan
Prior art keywords
thick film
electrode
circuit device
wiring conductor
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57208892A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237097B2 (en:Method
Inventor
崇 長坂
園部　俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP57208892A priority Critical patent/JPS5999794A/ja
Publication of JPS5999794A publication Critical patent/JPS5999794A/ja
Publication of JPH0237097B2 publication Critical patent/JPH0237097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/20—
    • H10W90/724—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
JP57208892A 1982-11-29 1982-11-29 厚膜回路装置 Granted JPS5999794A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57208892A JPS5999794A (ja) 1982-11-29 1982-11-29 厚膜回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57208892A JPS5999794A (ja) 1982-11-29 1982-11-29 厚膜回路装置

Publications (2)

Publication Number Publication Date
JPS5999794A true JPS5999794A (ja) 1984-06-08
JPH0237097B2 JPH0237097B2 (en:Method) 1990-08-22

Family

ID=16563849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57208892A Granted JPS5999794A (ja) 1982-11-29 1982-11-29 厚膜回路装置

Country Status (1)

Country Link
JP (1) JPS5999794A (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163891A (ja) * 1983-03-08 1984-09-14 富士通株式会社 セラミツク配線板
JPS62154648A (ja) * 1985-12-26 1987-07-09 Toshiba Corp バンプ形成方法
JPH0362537A (ja) * 1989-07-29 1991-03-18 Ibiden Co Ltd 電子部品塔載用基板
JP2009267428A (ja) * 2005-01-25 2009-11-12 Seiko Epson Corp デバイス実装方法
WO2016114358A1 (ja) * 2015-01-16 2016-07-21 株式会社村田製作所 基板、基板の製造方法及び弾性波装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259571A (en) * 1975-11-11 1977-05-17 Oki Electric Ind Co Ltd Substrate for face down bonding
JPS54137661A (en) * 1978-04-18 1979-10-25 Ngk Spark Plug Co Method of producing integrated circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259571A (en) * 1975-11-11 1977-05-17 Oki Electric Ind Co Ltd Substrate for face down bonding
JPS54137661A (en) * 1978-04-18 1979-10-25 Ngk Spark Plug Co Method of producing integrated circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163891A (ja) * 1983-03-08 1984-09-14 富士通株式会社 セラミツク配線板
JPS62154648A (ja) * 1985-12-26 1987-07-09 Toshiba Corp バンプ形成方法
JPH0362537A (ja) * 1989-07-29 1991-03-18 Ibiden Co Ltd 電子部品塔載用基板
JP2009267428A (ja) * 2005-01-25 2009-11-12 Seiko Epson Corp デバイス実装方法
WO2016114358A1 (ja) * 2015-01-16 2016-07-21 株式会社村田製作所 基板、基板の製造方法及び弾性波装置
JPWO2016114358A1 (ja) * 2015-01-16 2017-08-17 株式会社村田製作所 基板、基板の製造方法及び弾性波装置
CN107113967A (zh) * 2015-01-16 2017-08-29 株式会社村田制作所 基板、基板的制造方法以及弹性波装置
CN107113967B (zh) * 2015-01-16 2019-08-06 株式会社村田制作所 基板、基板的制造方法以及弹性波装置
US10797218B2 (en) 2015-01-16 2020-10-06 Murata Manufacturing Co., Ltd. Substrate, method for manufacturing substrate, and elastic wave device

Also Published As

Publication number Publication date
JPH0237097B2 (en:Method) 1990-08-22

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