JPS5999440U - 半導体フレ−ム押え部材 - Google Patents

半導体フレ−ム押え部材

Info

Publication number
JPS5999440U
JPS5999440U JP1982199284U JP19928482U JPS5999440U JP S5999440 U JPS5999440 U JP S5999440U JP 1982199284 U JP1982199284 U JP 1982199284U JP 19928482 U JP19928482 U JP 19928482U JP S5999440 U JPS5999440 U JP S5999440U
Authority
JP
Japan
Prior art keywords
holding member
semiconductor
frame holding
inner lead
semiconductor frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982199284U
Other languages
English (en)
Japanese (ja)
Other versions
JPH019159Y2 (online.php
Inventor
別部　政司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1982199284U priority Critical patent/JPS5999440U/ja
Publication of JPS5999440U publication Critical patent/JPS5999440U/ja
Application granted granted Critical
Publication of JPH019159Y2 publication Critical patent/JPH019159Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982199284U 1982-12-23 1982-12-23 半導体フレ−ム押え部材 Granted JPS5999440U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982199284U JPS5999440U (ja) 1982-12-23 1982-12-23 半導体フレ−ム押え部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982199284U JPS5999440U (ja) 1982-12-23 1982-12-23 半導体フレ−ム押え部材

Publications (2)

Publication Number Publication Date
JPS5999440U true JPS5999440U (ja) 1984-07-05
JPH019159Y2 JPH019159Y2 (online.php) 1989-03-13

Family

ID=30424825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982199284U Granted JPS5999440U (ja) 1982-12-23 1982-12-23 半導体フレ−ム押え部材

Country Status (1)

Country Link
JP (1) JPS5999440U (online.php)

Also Published As

Publication number Publication date
JPH019159Y2 (online.php) 1989-03-13

Similar Documents

Publication Publication Date Title
JPS59195829U (ja) 圧電振動子の保持構造
JPS60183558U (ja) ブラシ保持装置
JPS59146963U (ja) リ−ドフレ−ム
JPS6142855U (ja) 半導体装置
JPS60176842U (ja) リ−ド線成型器
JPS5968352U (ja) 歯科用ｘ線フイルム支持具
JPS606246U (ja) 半導体装置用リ−ドフレ−ム
JPS59107135U (ja) リ−ドフレ−ム
JPS60156657U (ja) 走査電子顕微鏡用試料ステ−ジ
JPS60117933U (ja) 線状体止め用具
JPS6135568U (ja) ブラシホルダサポ−ト
JPS60132024U (ja) 圧電振動子の支持固定構造
JPS5989548U (ja) 半導体装置用リ−ドフレ−ム
JPS611844U (ja) ワイヤボンデイング装置
JPS6133636U (ja) クランプ
JPS6142840U (ja) 半導体装置
JPS6048250U (ja) リ−ドフレ−ム
JPS611919U (ja) メカニカル・フイルタ
JPS60181048U (ja) 半導体装置用リ−ドフレ−ム
JPS5971571U (ja) タ−ミナルにおける接続機構
JPS5895865U (ja) バスケツトリング
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS60167423U (ja) セラミツク振動子支持構造
JPS5937748U (ja) 半導体装置用リ−ドフレ−ム
JPS60167638U (ja) ブラケツト位置決め装置