JPS611844U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS611844U
JPS611844U JP1984086396U JP8639684U JPS611844U JP S611844 U JPS611844 U JP S611844U JP 1984086396 U JP1984086396 U JP 1984086396U JP 8639684 U JP8639684 U JP 8639684U JP S611844 U JPS611844 U JP S611844U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding equipment
directly below
abstract
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984086396U
Other languages
English (en)
Inventor
勉 青木
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984086396U priority Critical patent/JPS611844U/ja
Publication of JPS611844U publication Critical patent/JPS611844U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案による一実施例の全体を示す断面図、第
２図は装置上部からの外観図、第３図はフレーム位置決
め方法を示している模式的断面図である。 １・・・ペレット、２・・・リード、３・・・アイラン
ド、４・・・つりピン、５・・・フレーム押さえ、６・
・・スリット、７・・・ヒータプレート、８・・・位置
決めピン、９・・・ばね機構、１０・・・ボンディング
ワイヤー。 −

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームを固定するヒータプレート部分をアイラ
    ンド直下の部分とリード直下部分をそれぞれ独立させて
    位置決めすることを特徴とするワイヤボンデイング装置
    。
JP1984086396U 1984-06-11 1984-06-11 ワイヤボンデイング装置 Pending JPS611844U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984086396U JPS611844U (ja) 1984-06-11 1984-06-11 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984086396U JPS611844U (ja) 1984-06-11 1984-06-11 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS611844U true JPS611844U (ja) 1986-01-08

Family

ID=30637667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984086396U Pending JPS611844U (ja) 1984-06-11 1984-06-11 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS611844U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (ja) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd ボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012654A (ja) * 1996-06-27 1998-01-16 Nec Yamaguchi Ltd ボンディング装置

Similar Documents

Publication Publication Date Title
JPS611844U (ja) ワイヤボンデイング装置
JPS60181051U (ja) リ−ドフレ−ムの構造
JPS5840887U (ja) プリント基板取付用間座柱
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS59145047U (ja) 半導体装置
JPS5871465U (ja) 半田ワイヤ−供給機構
JPS5858388U (ja) リ−ドクランパ−
JPS5995422U (ja) 薄膜磁気ヘツド装置
JPS60181884U (ja) 発熱体基板の保持フレ−ム
JPS5920632U (ja) 半導体装置
JPS5844842U (ja) 半導体装置
JPS6020820U (ja) セツト装置付笠
JPS583038U (ja) リ−ドフレ−ム
JPS58171435U (ja) 畳の隙間閉鎖具
JPS605120U (ja) リ−ドフレ−ムの位置決め送り機構
JPS5872844U (ja) Ｌｓｉパツケ−ジ
JPS6049848U (ja) 腰痛帯用固定支柱
JPS58187961U (ja) 真空装置内試料変位装置
JPS587350U (ja) リ−ドタイプ半導体素子の冷却構造
JPS58191652U (ja) 半導体装置用フレ−ム
JPS5925365U (ja) 自動はんだ付け装置
JPS59161803U (ja) 心電計用電極導線の固定具
JPS5837148U (ja) トランジスタ用取付座
JPS5996837U (ja) 半導体装置
JPS58138336U (ja) ワイヤボンデイング装置