JPS58191652U - 半導体装置用フレ−ム - Google Patents

半導体装置用フレ−ム

Info

Publication number
JPS58191652U
JPS58191652U JP9059582U JP9059582U JPS58191652U JP S58191652 U JPS58191652 U JP S58191652U JP 9059582 U JP9059582 U JP 9059582U JP 9059582 U JP9059582 U JP 9059582U JP S58191652 U JPS58191652 U JP S58191652U
Authority
JP
Japan
Prior art keywords
frame
lead
semiconductor devices
semiconductor element
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9059582U
Other languages
English (en)
Inventor
哲司 山口
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP9059582U priority Critical patent/JPS58191652U/ja
Publication of JPS58191652U publication Critical patent/JPS58191652U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは従来の半導体装置用フ、レームの平面図、第
１図すは同じくその正面図、第２図ａは本考案による半
導体装置用フレームの一実施例を示す平面図、第２図す
は同じ−くその正面図である。 なお、図中同一符号は同・−または相当部分を示す。図
中、１．　２．　３・・・外部導出リード、４・・・半
導体素子、５・・・金線、６・・・段差。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を固着するリードと、このリードに並設され
    前記半導体素子の各電極に金属細線を接続する外部導出
    リードとを備える半導体装置用フレームにおいて、前記
    半導体素子が固着されるリードの周囲に段差を設けたこ
    とを特徴とする半導体装置用フレーム。
JP9059582U 1982-06-15 1982-06-15 半導体装置用フレ−ム Pending JPS58191652U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9059582U JPS58191652U (ja) 1982-06-15 1982-06-15 半導体装置用フレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9059582U JPS58191652U (ja) 1982-06-15 1982-06-15 半導体装置用フレ−ム

Publications (1)

Publication Number Publication Date
JPS58191652U true JPS58191652U (ja) 1983-12-20

Family

ID=30099086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9059582U Pending JPS58191652U (ja) 1982-06-15 1982-06-15 半導体装置用フレ−ム

Country Status (1)

Country Link
JP (1) JPS58191652U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5496366A (en) * 1978-01-17 1979-07-30 Toshiba Corp Semiconductor device
JPS5516450A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Semiconductor device
JPS5619646A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin sealing type semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5496366A (en) * 1978-01-17 1979-07-30 Toshiba Corp Semiconductor device
JPS5516450A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Semiconductor device
JPS5619646A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin sealing type semiconductor device

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