JPH019159Y2 - - Google Patents
Info
- Publication number
- JPH019159Y2 JPH019159Y2 JP1982199284U JP19928482U JPH019159Y2 JP H019159 Y2 JPH019159 Y2 JP H019159Y2 JP 1982199284 U JP1982199284 U JP 1982199284U JP 19928482 U JP19928482 U JP 19928482U JP H019159 Y2 JPH019159 Y2 JP H019159Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- holding member
- inner lead
- bonding
- needle fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982199284U JPS5999440U (ja) | 1982-12-23 | 1982-12-23 | 半導体フレ−ム押え部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982199284U JPS5999440U (ja) | 1982-12-23 | 1982-12-23 | 半導体フレ−ム押え部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5999440U JPS5999440U (ja) | 1984-07-05 |
| JPH019159Y2 true JPH019159Y2 (online.php) | 1989-03-13 |
Family
ID=30424825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982199284U Granted JPS5999440U (ja) | 1982-12-23 | 1982-12-23 | 半導体フレ−ム押え部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999440U (online.php) |
-
1982
- 1982-12-23 JP JP1982199284U patent/JPS5999440U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5999440U (ja) | 1984-07-05 |
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