JPS5994427A - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS5994427A
JPS5994427A JP57203311A JP20331182A JPS5994427A JP S5994427 A JPS5994427 A JP S5994427A JP 57203311 A JP57203311 A JP 57203311A JP 20331182 A JP20331182 A JP 20331182A JP S5994427 A JPS5994427 A JP S5994427A
Authority
JP
Japan
Prior art keywords
magazine
lead frame
endless
semiconductor manufacturing
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57203311A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0150099B2 (enExample
Inventor
Hiroaki Kobayashi
弘明 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57203311A priority Critical patent/JPS5994427A/ja
Publication of JPS5994427A publication Critical patent/JPS5994427A/ja
Publication of JPH0150099B2 publication Critical patent/JPH0150099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/07178—
    • H10W72/075—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57203311A 1982-11-19 1982-11-19 半導体製造装置 Granted JPS5994427A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57203311A JPS5994427A (ja) 1982-11-19 1982-11-19 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57203311A JPS5994427A (ja) 1982-11-19 1982-11-19 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS5994427A true JPS5994427A (ja) 1984-05-31
JPH0150099B2 JPH0150099B2 (enExample) 1989-10-27

Family

ID=16471923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57203311A Granted JPS5994427A (ja) 1982-11-19 1982-11-19 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS5994427A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218124A (ja) * 1992-02-05 1993-08-27 Kaijo Corp ボンダー及びこれを装備した自動ボンディング装置
KR20000043743A (ko) * 1998-12-29 2000-07-15 정동용 점용접을 이용한 릴타입 리드프레임 자재의 연속공급방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467976A (en) * 1977-11-08 1979-05-31 Toshiba Seiki Kk Apparatus for supplying and receiving article
JPS5749387U (enExample) * 1980-09-08 1982-03-19
JPS582105A (ja) * 1981-06-25 1983-01-07 Shinkawa Ltd マガジン移送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467976A (en) * 1977-11-08 1979-05-31 Toshiba Seiki Kk Apparatus for supplying and receiving article
JPS5749387U (enExample) * 1980-09-08 1982-03-19
JPS582105A (ja) * 1981-06-25 1983-01-07 Shinkawa Ltd マガジン移送装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218124A (ja) * 1992-02-05 1993-08-27 Kaijo Corp ボンダー及びこれを装備した自動ボンディング装置
KR20000043743A (ko) * 1998-12-29 2000-07-15 정동용 점용접을 이용한 릴타입 리드프레임 자재의 연속공급방법

Also Published As

Publication number Publication date
JPH0150099B2 (enExample) 1989-10-27

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