JPS5992188A - 低融点材と高融点材の接合方法 - Google Patents

低融点材と高融点材の接合方法

Info

Publication number
JPS5992188A
JPS5992188A JP57200681A JP20068182A JPS5992188A JP S5992188 A JPS5992188 A JP S5992188A JP 57200681 A JP57200681 A JP 57200681A JP 20068182 A JP20068182 A JP 20068182A JP S5992188 A JPS5992188 A JP S5992188A
Authority
JP
Japan
Prior art keywords
melting point
low melting
point materials
high melting
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57200681A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332433B2 (instruction
Inventor
Takeshi Mizutani
武 水谷
Koichi Kawada
耕一 河田
Naoya Horiuchi
直也 堀内
Takafumi Ohara
大原　尊文
Reiji Sano
佐野　令而
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57200681A priority Critical patent/JPS5992188A/ja
Publication of JPS5992188A publication Critical patent/JPS5992188A/ja
Publication of JPH0332433B2 publication Critical patent/JPH0332433B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/28—Seam welding of curved planar seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP57200681A 1982-11-15 1982-11-15 低融点材と高融点材の接合方法 Granted JPS5992188A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57200681A JPS5992188A (ja) 1982-11-15 1982-11-15 低融点材と高融点材の接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57200681A JPS5992188A (ja) 1982-11-15 1982-11-15 低融点材と高融点材の接合方法

Publications (2)

Publication Number Publication Date
JPS5992188A true JPS5992188A (ja) 1984-05-28
JPH0332433B2 JPH0332433B2 (instruction) 1991-05-13

Family

ID=16428472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57200681A Granted JPS5992188A (ja) 1982-11-15 1982-11-15 低融点材と高融点材の接合方法

Country Status (1)

Country Link
JP (1) JPS5992188A (instruction)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7540845B2 (en) 2003-09-05 2009-06-02 Boston Scientific Scimed, Inc Medical device coil
US7833175B2 (en) 2003-09-05 2010-11-16 Boston Scientific Scimed, Inc. Medical device coil
CN113199141A (zh) * 2020-02-03 2021-08-03 日本电产株式会社 激光接合方法及接合结构体
CN113275744A (zh) * 2020-02-03 2021-08-20 日本电产株式会社 激光接合方法及接合结构体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7540845B2 (en) 2003-09-05 2009-06-02 Boston Scientific Scimed, Inc Medical device coil
US7833175B2 (en) 2003-09-05 2010-11-16 Boston Scientific Scimed, Inc. Medical device coil
CN113199141A (zh) * 2020-02-03 2021-08-03 日本电产株式会社 激光接合方法及接合结构体
CN113275744A (zh) * 2020-02-03 2021-08-20 日本电产株式会社 激光接合方法及接合结构体

Also Published As

Publication number Publication date
JPH0332433B2 (instruction) 1991-05-13

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