JPS5989316A - 紫外線硬化ソルダ−レジストインク組成物 - Google Patents

紫外線硬化ソルダ−レジストインク組成物

Info

Publication number
JPS5989316A
JPS5989316A JP57197640A JP19764082A JPS5989316A JP S5989316 A JPS5989316 A JP S5989316A JP 57197640 A JP57197640 A JP 57197640A JP 19764082 A JP19764082 A JP 19764082A JP S5989316 A JPS5989316 A JP S5989316A
Authority
JP
Japan
Prior art keywords
meth
acrylate
parts
resist ink
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57197640A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0414151B2 (enrdf_load_stackoverflow
Inventor
Kunio Nishihara
邦夫 西原
Takefumi Shibuya
渋谷　武文
Shigeo Makino
繁男 牧野
Sumio Hirose
純夫 広瀬
Kazuyoshi Ono
小野　一良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP57197640A priority Critical patent/JPS5989316A/ja
Publication of JPS5989316A publication Critical patent/JPS5989316A/ja
Publication of JPH0414151B2 publication Critical patent/JPH0414151B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP57197640A 1982-11-12 1982-11-12 紫外線硬化ソルダ−レジストインク組成物 Granted JPS5989316A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197640A JPS5989316A (ja) 1982-11-12 1982-11-12 紫外線硬化ソルダ−レジストインク組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197640A JPS5989316A (ja) 1982-11-12 1982-11-12 紫外線硬化ソルダ−レジストインク組成物

Publications (2)

Publication Number Publication Date
JPS5989316A true JPS5989316A (ja) 1984-05-23
JPH0414151B2 JPH0414151B2 (enrdf_load_stackoverflow) 1992-03-11

Family

ID=16377844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197640A Granted JPS5989316A (ja) 1982-11-12 1982-11-12 紫外線硬化ソルダ−レジストインク組成物

Country Status (1)

Country Link
JP (1) JPS5989316A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007974A (ja) * 1998-06-22 2000-01-11 Taiyo Ink Mfg Ltd ハロゲンフリーの着色顔料を用いたプリント配線板用緑色インキ組成物
WO2002048794A1 (fr) * 2000-12-13 2002-06-20 Goo Chemical Co., Ltd. Encre resistant au soudage
JP2010270186A (ja) * 2009-05-20 2010-12-02 National Printing Bureau インキ組成物
JP2011066376A (ja) * 2009-09-16 2011-03-31 Korea Electronics Telecommun プラスチック基板及びその製造方法
WO2013151001A1 (ja) * 2012-04-03 2013-10-10 東亞合成株式会社 活性エネルギー線硬化型組成物、並びに、硬化膜を有する金属基材及びその製造方法
CN108504172A (zh) * 2018-05-31 2018-09-07 丰顺县三和电子材料有限公司 低能量uv光固化字符油墨及其制备方法
CN108976899A (zh) * 2018-05-31 2018-12-11 丰顺县三和电子材料有限公司 低能量uv光固化阻焊油墨及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626916A (en) * 1979-08-10 1981-03-16 Mitsubishi Petrochem Co Ltd Polymerizable composition
JPS5765712A (en) * 1980-10-11 1982-04-21 Suriibondo:Kk Curable composition
JPS57143367A (en) * 1981-02-28 1982-09-04 Sony Corp Photo-setting coating film composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626916A (en) * 1979-08-10 1981-03-16 Mitsubishi Petrochem Co Ltd Polymerizable composition
JPS5765712A (en) * 1980-10-11 1982-04-21 Suriibondo:Kk Curable composition
JPS57143367A (en) * 1981-02-28 1982-09-04 Sony Corp Photo-setting coating film composition

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007974A (ja) * 1998-06-22 2000-01-11 Taiyo Ink Mfg Ltd ハロゲンフリーの着色顔料を用いたプリント配線板用緑色インキ組成物
WO2002048794A1 (fr) * 2000-12-13 2002-06-20 Goo Chemical Co., Ltd. Encre resistant au soudage
JPWO2002048794A1 (ja) * 2000-12-13 2004-04-15 互応化学工業株式会社 ソルダーレジストインク
JP2010270186A (ja) * 2009-05-20 2010-12-02 National Printing Bureau インキ組成物
JP2011066376A (ja) * 2009-09-16 2011-03-31 Korea Electronics Telecommun プラスチック基板及びその製造方法
WO2013151001A1 (ja) * 2012-04-03 2013-10-10 東亞合成株式会社 活性エネルギー線硬化型組成物、並びに、硬化膜を有する金属基材及びその製造方法
JPWO2013151001A1 (ja) * 2012-04-03 2015-12-17 東亞合成株式会社 活性エネルギー線硬化型組成物、並びに、硬化膜を有する金属基材及びその製造方法
CN108504172A (zh) * 2018-05-31 2018-09-07 丰顺县三和电子材料有限公司 低能量uv光固化字符油墨及其制备方法
CN108976899A (zh) * 2018-05-31 2018-12-11 丰顺县三和电子材料有限公司 低能量uv光固化阻焊油墨及其制备方法
CN108976899B (zh) * 2018-05-31 2022-03-29 丰顺县三和电子材料有限公司 低能量uv光固化阻焊油墨及其制备方法

Also Published As

Publication number Publication date
JPH0414151B2 (enrdf_load_stackoverflow) 1992-03-11

Similar Documents

Publication Publication Date Title
JP3254572B2 (ja) 光重合性熱硬化性樹脂組成物
CN100482752C (zh) 一种感光防焊油墨组合物、其应用及含有其的线路板
JPS6148800B2 (enrdf_load_stackoverflow)
KR20130050361A (ko) 잉크젯용 경화성 조성물 및 전자 부품의 제조 방법
EP2278396A1 (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
US7910631B2 (en) Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition
JPH0639518B2 (ja) 耐熱性感光性樹脂組成物
KR20190122865A (ko) 감광성 수지 조성물, 그것을 이용한 드라이 필름, 프린트 배선판 및 프린트 배선판의 제조 방법
JPS5989316A (ja) 紫外線硬化ソルダ−レジストインク組成物
KR20220116721A (ko) 감광성 수지 조성물
CN108535959B (zh) 感光胶黏剂及其制备方法和应用
JPH0655794B2 (ja) 紫外線硬化樹脂組成物
JPH08272095A (ja) ソルダーフォトレジストインキ用組成物
JP6066559B2 (ja) インクジェット用硬化性組成物及び電子部品の製造方法
JPS647631B2 (enrdf_load_stackoverflow)
JPS62226145A (ja) ソルダ−レジスト
KR100499836B1 (ko) 광중합성열경화성수지조성물
JP2528349B2 (ja) ソルダ―レジストインキ組成物
JP2001264977A (ja) 感光性樹脂組成物
JPH09114096A (ja) ソルダーレジスト組成物
JPS59213780A (ja) 紫外線硬化型ソルダレジストインキ
JPS62241979A (ja) 樹脂組成物及びソルダ−レジストインキ組成物
JPS63120715A (ja) ソルダーレジストインキ組成物
JPS5844743B2 (ja) ホトエツチング法による食刻製品の製造方法
JPS607427A (ja) 感光性樹脂組成物