JPS5986645U - チツプ型ヒユ−ズ - Google Patents

チツプ型ヒユ−ズ

Info

Publication number
JPS5986645U
JPS5986645U JP1982182601U JP18260182U JPS5986645U JP S5986645 U JPS5986645 U JP S5986645U JP 1982182601 U JP1982182601 U JP 1982182601U JP 18260182 U JP18260182 U JP 18260182U JP S5986645 U JPS5986645 U JP S5986645U
Authority
JP
Japan
Prior art keywords
fuse
type fuse
chip
base
chip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982182601U
Other languages
English (en)
Other versions
JPS6022538Y2 (ja
Inventor
浩雄 蟻川
Original Assignee
三王株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三王株式会社 filed Critical 三王株式会社
Priority to JP1982182601U priority Critical patent/JPS6022538Y2/ja
Priority to GB08331805A priority patent/GB2132831B/en
Priority to US06/556,689 priority patent/US4559514A/en
Priority to NL8304097A priority patent/NL8304097A/nl
Priority to BR8306651A priority patent/BR8306651A/pt
Priority to DE19833343698 priority patent/DE3343698A1/de
Publication of JPS5986645U publication Critical patent/JPS5986645U/ja
Application granted granted Critical
Publication of JPS6022538Y2 publication Critical patent/JPS6022538Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411Miniature fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411Miniature fuses
    • H01H2085/0414Surface mounted fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0013Means for preventing damage, e.g. by ambient influences to the fuse
    • H01H85/0021Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
    • H01H85/003Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices casings for the fusible element
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fuses (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は、従来のチップ型ヒユーズの斜視図で1  あ
る。第2図は、この考案のチップ型ヒユーズの、  斜
視図であり、第3図は、第2図A−A面での断−面図で
ある。第4図は、この考案のもう一つの実;  施例の
斜視図であり、第5図は、第4図をB方向から、第6図
はC方向から見た側面図である。 11・・・・・・ヒユーズ本体、2・・・・・・蓋、3
・・・・・・端子部、萱  4・・・・・・ベース、5
・川・・本体底面、6. 7. 8・・・・・・1  
半田付着防止膜処理面、9・・・・・・可溶体、1o・
・・・・・彊  タガ状固定具。

Claims (2)

    【実用新案登録請求の範囲】
  1. (1)ベースと蓋からなるヒユーズ本体両端に端9部を
    有するチップ型ヒユーズにおいて、ソノ端子部をヒユー
    ズ本体底面より下に位置させることにより、プリント基
    板上へ実装する際、ヒユーズ本体が直接、基板と接触す
    ることがないJう、端子部を配設したチップ型ヒユーズ
  2. (2)前記、ヒユーズ本体底面より下に位置した箱。 子部が、そのベースと蓋からなるヒユーズ重付両端部分
    で、そのベースと端とをタガ状に係長することを特徴と
    する実用新案登録請求の範mM1項記載のチップ型ヒユ
    ーズ。
JP1982182601U 1982-12-03 1982-12-03 チツプ型ヒユ−ズ Expired JPS6022538Y2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1982182601U JPS6022538Y2 (ja) 1982-12-03 1982-12-03 チツプ型ヒユ−ズ
GB08331805A GB2132831B (en) 1982-12-03 1983-11-29 Chip-type microfuse
US06/556,689 US4559514A (en) 1982-12-03 1983-11-29 Chip type fuse having connecting legs
NL8304097A NL8304097A (nl) 1982-12-03 1983-11-30 Microsmeltveiligheid van het chip-type.
BR8306651A BR8306651A (pt) 1982-12-03 1983-12-02 Micro-fusivel tipo microplaqueta
DE19833343698 DE3343698A1 (de) 1982-12-03 1983-12-02 Chip-mikro(schmelz)sicherung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982182601U JPS6022538Y2 (ja) 1982-12-03 1982-12-03 チツプ型ヒユ−ズ

Publications (2)

Publication Number Publication Date
JPS5986645U true JPS5986645U (ja) 1984-06-12
JPS6022538Y2 JPS6022538Y2 (ja) 1985-07-04

Family

ID=16121135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982182601U Expired JPS6022538Y2 (ja) 1982-12-03 1982-12-03 チツプ型ヒユ−ズ

Country Status (6)

Country Link
US (1) US4559514A (ja)
JP (1) JPS6022538Y2 (ja)
BR (1) BR8306651A (ja)
DE (1) DE3343698A1 (ja)
GB (1) GB2132831B (ja)
NL (1) NL8304097A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175958A (ja) * 2010-01-28 2011-09-08 Kyocera Corp ヒューズ装置、ヒューズ装置用部品および電子装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447502A1 (de) * 1984-12-27 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Platte als schaltungstraeger mit schichtfoermiger leiterbahn
JPS6456135U (ja) * 1987-10-01 1989-04-07
NL8802872A (nl) * 1988-11-21 1990-06-18 Littelfuse Tracor Smeltveiligheid.
JPH0720828Y2 (ja) * 1989-06-14 1995-05-15 エス・オー・シー株式会社 超小型電流ヒューズ
JPH06342623A (ja) * 1993-06-01 1994-12-13 S O C Kk チップヒューズ
JP2706625B2 (ja) * 1994-10-03 1998-01-28 エス・オー・シー株式会社 超小型チップヒューズ
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US6948070B1 (en) 1995-02-13 2005-09-20 Intertrust Technologies Corporation Systems and methods for secure transaction management and electronic rights protection
US7095854B1 (en) * 1995-02-13 2006-08-22 Intertrust Technologies Corp. Systems and methods for secure transaction management and electronic rights protection
CN101303717B (zh) 1995-02-13 2015-04-29 英特特拉斯特技术公司 用于安全交易管理和电子权利保护的系统和方法
JP2717076B2 (ja) * 1995-08-30 1998-02-18 エス・オー・シー株式会社 表面実装超小型電流ヒューズ
US7000894B2 (en) * 2003-04-25 2006-02-21 Pur Water Purification Products, Inc. Fluidic cartridges and end pieces thereof
US8368502B2 (en) * 2006-03-16 2013-02-05 Panasonic Corporation Surface-mount current fuse
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse
CN104137217B (zh) * 2012-02-20 2016-10-19 松尾电机株式会社 芯片型保险丝
US10283304B2 (en) * 2016-01-21 2019-05-07 Littelfuse, Inc. Surface mounted protection device
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3280019A (en) * 1963-07-03 1966-10-18 Ibm Method of selectively coating semiconductor chips
DE2555708A1 (de) * 1975-12-11 1977-06-23 Grote & Hartmann Elektrischer zentralverteiler
US4047143A (en) * 1976-07-09 1977-09-06 Western Electric Company, Inc. Fused resistive electrical protection device
DE2928479A1 (de) * 1979-07-14 1981-01-15 Wickmann Werke Ag Gehaeuse fuer elektrische bauelemente
AT371946B (de) * 1979-09-06 1983-08-10 Wickmann Werke Ag Schmelzsicherung, insbesondere fuer gedruckte schaltungen
JPS5852289B2 (ja) * 1979-09-08 1983-11-21 エス・オ−・シ−株式会社 超速断型小型ヒユ−ズ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175958A (ja) * 2010-01-28 2011-09-08 Kyocera Corp ヒューズ装置、ヒューズ装置用部品および電子装置

Also Published As

Publication number Publication date
GB8331805D0 (en) 1984-01-04
GB2132831A (en) 1984-07-11
JPS6022538Y2 (ja) 1985-07-04
DE3343698C2 (ja) 1987-02-12
BR8306651A (pt) 1984-07-10
NL8304097A (nl) 1984-07-02
GB2132831B (en) 1987-01-14
US4559514A (en) 1985-12-17
DE3343698A1 (de) 1984-06-14

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