JPS5984448A - 樹脂封止型半導体装置およびその製造方法 - Google Patents

樹脂封止型半導体装置およびその製造方法

Info

Publication number
JPS5984448A
JPS5984448A JP57194547A JP19454782A JPS5984448A JP S5984448 A JPS5984448 A JP S5984448A JP 57194547 A JP57194547 A JP 57194547A JP 19454782 A JP19454782 A JP 19454782A JP S5984448 A JPS5984448 A JP S5984448A
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
semiconductor device
circuit element
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57194547A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049381B2 (https=
Inventor
Ken Ogura
謙 小椋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP57194547A priority Critical patent/JPS5984448A/ja
Publication of JPS5984448A publication Critical patent/JPS5984448A/ja
Publication of JPH049381B2 publication Critical patent/JPH049381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Read Only Memory (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57194547A 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法 Granted JPS5984448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS5984448A true JPS5984448A (ja) 1984-05-16
JPH049381B2 JPH049381B2 (https=) 1992-02-20

Family

ID=16326346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57194547A Granted JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS5984448A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894707A (en) * 1987-02-12 1990-01-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a light transparent window and a method of producing same
US5037779A (en) * 1989-05-19 1991-08-06 Whalley Peter D Method of encapsulating a sensor device using capillary action and the device so encapsulated
US5079190A (en) * 1988-02-09 1992-01-07 Canon Kabushiki Kaisha Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device
US5424249A (en) * 1992-01-23 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Method of making mold-packaged pressure sensing semiconductor device
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894707A (en) * 1987-02-12 1990-01-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a light transparent window and a method of producing same
US5079190A (en) * 1988-02-09 1992-01-07 Canon Kabushiki Kaisha Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device
US5037779A (en) * 1989-05-19 1991-08-06 Whalley Peter D Method of encapsulating a sensor device using capillary action and the device so encapsulated
US5424249A (en) * 1992-01-23 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Method of making mold-packaged pressure sensing semiconductor device
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window

Also Published As

Publication number Publication date
JPH049381B2 (https=) 1992-02-20

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