JPS598361Y2 - Ｉｃパツケ−ジ - Google Patents

Ｉｃパツケ−ジ

Info

Publication number
JPS598361Y2
JPS598361Y2 JP1978113193U JP11319378U JPS598361Y2 JP S598361 Y2 JPS598361 Y2 JP S598361Y2 JP 1978113193 U JP1978113193 U JP 1978113193U JP 11319378 U JP11319378 U JP 11319378U JP S598361 Y2 JPS598361 Y2 JP S598361Y2
Authority
JP
Japan
Prior art keywords
layer
aluminum
lead
pellet
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978113193U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5529562U (https=
Inventor
明良 桑野
恭次 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP1978113193U priority Critical patent/JPS598361Y2/ja
Publication of JPS5529562U publication Critical patent/JPS5529562U/ja
Application granted granted Critical
Publication of JPS598361Y2 publication Critical patent/JPS598361Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/759—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent discrete passive device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1978113193U 1978-08-17 1978-08-17 Ｉｃパツケ−ジ Expired JPS598361Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978113193U JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978113193U JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5529562U JPS5529562U (https=) 1980-02-26
JPS598361Y2 true JPS598361Y2 (ja) 1984-03-15

Family

ID=29062776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978113193U Expired JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS598361Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104675U (ja) * 1982-01-09 1983-07-16 キング商事株式会社 連続伝票発行器

Also Published As

Publication number Publication date
JPS5529562U (https=) 1980-02-26

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