JPS5980767A - 周期系の第１ｂ族、第２ｂ族、第４ｂ族、第５ｂ族及び第８族の金属の金属層を無電流で析出させる方法 - Google Patents

周期系の第１ｂ族、第２ｂ族、第４ｂ族、第５ｂ族及び第８族の金属の金属層を無電流で析出させる方法

Info

Publication number
JPS5980767A
JPS5980767A JP58179460A JP17946083A JPS5980767A JP S5980767 A JPS5980767 A JP S5980767A JP 58179460 A JP58179460 A JP 58179460A JP 17946083 A JP17946083 A JP 17946083A JP S5980767 A JPS5980767 A JP S5980767A
Authority
JP
Japan
Prior art keywords
metal
base
complex
group
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58179460A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0152474B2 (OSRAM
Inventor
ハンス−ゲオルク・フオン・シユネ−リング
ヘルム−ト・クヴアスト
ゲルト・コレンツ
カ−ル・ペ−タ−ス
ゲオルク・ウ−ライ
ヴアルタ−・オツト−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Original Assignee
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max Planck Gesellschaft zur Foerderung der Wissenschaften eV filed Critical Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Publication of JPS5980767A publication Critical patent/JPS5980767A/ja
Publication of JPH0152474B2 publication Critical patent/JPH0152474B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
JP58179460A 1982-09-29 1983-09-29 周期系の第１ｂ族、第２ｂ族、第４ｂ族、第５ｂ族及び第８族の金属の金属層を無電流で析出させる方法 Granted JPS5980767A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823236115 DE3236115A1 (de) 1982-09-29 1982-09-29 Verfahren zur stromlosen abscheidung von metallschichten auf oberflaechen von metallen
DE3236115.7 1982-09-29

Publications (2)

Publication Number Publication Date
JPS5980767A true JPS5980767A (ja) 1984-05-10
JPH0152474B2 JPH0152474B2 (OSRAM) 1989-11-08

Family

ID=6174496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58179460A Granted JPS5980767A (ja) 1982-09-29 1983-09-29 周期系の第１ｂ族、第２ｂ族、第４ｂ族、第５ｂ族及び第８族の金属の金属層を無電流で析出させる方法

Country Status (5)

Country Link
EP (1) EP0107801B1 (OSRAM)
JP (1) JPS5980767A (OSRAM)
AT (1) ATE27468T1 (OSRAM)
CA (1) CA1209412A (OSRAM)
DE (2) DE3236115A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60245797A (ja) * 1984-05-18 1985-12-05 Nippon Steel Corp 非水溶媒系電気メツキ液およびその製造法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217779B1 (en) 1995-08-02 2001-04-17 Astaris Llc Dehalogenation of halogenated hydrocarbons in aqueous compositions
DE19740908C1 (de) * 1997-09-17 1999-08-05 Vacuumschmelze Gmbh Anzeigeelement für die Verwendung in einem magnetischen Diebstahlsicherungssystem und Verfahren zur Herstellung eines Aktivierungsstreifens hierfür
US6818313B2 (en) 2002-07-24 2004-11-16 University Of Dayton Corrosion-inhibiting coating
US7412791B2 (en) 2004-12-20 2008-08-19 Lsi Industries, Inc. Adjustable menu panel
CN114990533B (zh) * 2022-04-13 2023-06-16 江苏富乐华半导体科技股份有限公司 一种改善陶瓷基板表面电镀铜结合力的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
GB1411971A (en) * 1972-04-07 1975-10-29 Ici Ltd Process for the immersion plating of copper on iron or steel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60245797A (ja) * 1984-05-18 1985-12-05 Nippon Steel Corp 非水溶媒系電気メツキ液およびその製造法

Also Published As

Publication number Publication date
ATE27468T1 (de) 1987-06-15
DE3371799D1 (en) 1987-07-02
DE3236115A1 (de) 1984-03-29
CA1209412A (en) 1986-08-12
EP0107801A1 (de) 1984-05-09
JPH0152474B2 (OSRAM) 1989-11-08
EP0107801B1 (de) 1987-05-27

Similar Documents

Publication Publication Date Title
US5894038A (en) Direct deposition of palladium
JPS58104168A (ja) 卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴
DE1446149B2 (de) Verfahren zum Abscheiden einer Bimetallschicht auf einem Grundmetall in einer gedruckten Schaltung
JPS6049717B2 (ja) メツキ処理に先立つプラスチツク性被メツキ基質の前処理方法
US5696384A (en) Composition for formation of electrode pattern
JPS5980767A (ja) 周期系の第１ｂ族、第２ｂ族、第４ｂ族、第５ｂ族及び第８族の金属の金属層を無電流で析出させる方法
US2891871A (en) Tin immersion plating composition and process for using the same
JPH0544052A (ja) コバルト化成皮膜の形成方法
JP5474092B2 (ja) 金属又は金属合金表面のハンダ付け性及び耐食性を増加するための溶液及び方法
DE647334C (de) Elektrolyt zur Erzeugung elektrolytischer Niederschlaege von Ruthenium
TWI638821B (zh) 金屬觸媒及其製備與應用
US4832808A (en) Polyimides reaction products and use in electrophoretic deposition
GB2229452A (en) Preparing metal for melt-coating
JP2834885B2 (ja) 銅及び銅合金の表面処理方法
EP1520060B1 (en) Metallisation
JP2686168B2 (ja) 銅及び銅合金の表面処理方法並びにはんだ付用表面処理剤
SU1315407A1 (ru) Способ металлизации изделий из диэлектриков
US3535129A (en) Metal treating process
JP2834770B2 (ja) 銅及び銅合金の表面処理方法
JPH03215677A (ja) 無電解金めつき液
WO1991009151A1 (en) Method of metallizing substrates by chemical redox
JP3819944B2 (ja) 亜鉛又は亜鉛合金上にセラミックス皮膜を形成する方法
JPH0480375A (ja) 銅及び銅合金の表面処理方法
JPH04165083A (ja) 銅及び銅合金の表面処理方法
JPS6134185A (ja) 金属，無機質物の基体表面に着色する方法