JPS5978578A - ダイヤフラム製造方法 - Google Patents

ダイヤフラム製造方法

Info

Publication number
JPS5978578A
JPS5978578A JP57187471A JP18747182A JPS5978578A JP S5978578 A JPS5978578 A JP S5978578A JP 57187471 A JP57187471 A JP 57187471A JP 18747182 A JP18747182 A JP 18747182A JP S5978578 A JPS5978578 A JP S5978578A
Authority
JP
Japan
Prior art keywords
diaphragm
grinding
round hole
single crystal
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57187471A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410111B2 (enExample
Inventor
Nobuo Ochiai
落合　信夫
Takashi Tsumagari
津曲　孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57187471A priority Critical patent/JPS5978578A/ja
Priority to GB08327236A priority patent/GB2130435B/en
Priority to DE19833338384 priority patent/DE3338384A1/de
Publication of JPS5978578A publication Critical patent/JPS5978578A/ja
Priority to US06/820,598 priority patent/US4622098A/en
Publication of JPS6410111B2 publication Critical patent/JPS6410111B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
JP57187471A 1982-10-27 1982-10-27 ダイヤフラム製造方法 Granted JPS5978578A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57187471A JPS5978578A (ja) 1982-10-27 1982-10-27 ダイヤフラム製造方法
GB08327236A GB2130435B (en) 1982-10-27 1983-10-12 Semiconductor strain sensor and method for manufacturing the same
DE19833338384 DE3338384A1 (de) 1982-10-27 1983-10-21 Halbleiter-dehnungssensor und verfahren zu seiner herstellung
US06/820,598 US4622098A (en) 1982-10-27 1986-01-21 Method for manufacturing semiconductor strain sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57187471A JPS5978578A (ja) 1982-10-27 1982-10-27 ダイヤフラム製造方法

Publications (2)

Publication Number Publication Date
JPS5978578A true JPS5978578A (ja) 1984-05-07
JPS6410111B2 JPS6410111B2 (enExample) 1989-02-21

Family

ID=16206658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57187471A Granted JPS5978578A (ja) 1982-10-27 1982-10-27 ダイヤフラム製造方法

Country Status (1)

Country Link
JP (1) JPS5978578A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173487A (ja) * 2005-12-21 2007-07-05 Disco Abrasive Syst Ltd ウエーハの加工方法および装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173487A (ja) * 2005-12-21 2007-07-05 Disco Abrasive Syst Ltd ウエーハの加工方法および装置

Also Published As

Publication number Publication date
JPS6410111B2 (enExample) 1989-02-21

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