JPS5976458A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5976458A
JPS5976458A JP57188560A JP18856082A JPS5976458A JP S5976458 A JPS5976458 A JP S5976458A JP 57188560 A JP57188560 A JP 57188560A JP 18856082 A JP18856082 A JP 18856082A JP S5976458 A JPS5976458 A JP S5976458A
Authority
JP
Japan
Prior art keywords
gate
lead
metallized layer
contact
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57188560A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0125224B2 (enrdf_load_stackoverflow
Inventor
Futoshi Tokuno
徳能　太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57188560A priority Critical patent/JPS5976458A/ja
Publication of JPS5976458A publication Critical patent/JPS5976458A/ja
Publication of JPH0125224B2 publication Critical patent/JPH0125224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP57188560A 1982-10-25 1982-10-25 半導体装置 Granted JPS5976458A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57188560A JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57188560A JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS5976458A true JPS5976458A (ja) 1984-05-01
JPH0125224B2 JPH0125224B2 (enrdf_load_stackoverflow) 1989-05-16

Family

ID=16225822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57188560A Granted JPS5976458A (ja) 1982-10-25 1982-10-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS5976458A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229847A (ja) * 1986-03-29 1987-10-08 Mitsubishi Electric Corp 半導体装置
CN101738088B (zh) 2008-11-20 2011-09-07 中芯国际集成电路制造(上海)有限公司 炉管隔热装置及利用该装置的炉管预防维护保养方法
JP2020516049A (ja) * 2017-01-17 2020-05-28 アーベーベー・シュバイツ・アーゲー 半導体スイッチングデバイス

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229847A (ja) * 1986-03-29 1987-10-08 Mitsubishi Electric Corp 半導体装置
CN101738088B (zh) 2008-11-20 2011-09-07 中芯国际集成电路制造(上海)有限公司 炉管隔热装置及利用该装置的炉管预防维护保养方法
JP2020516049A (ja) * 2017-01-17 2020-05-28 アーベーベー・シュバイツ・アーゲー 半導体スイッチングデバイス

Also Published As

Publication number Publication date
JPH0125224B2 (enrdf_load_stackoverflow) 1989-05-16

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