JPH0125224B2 - - Google Patents
Info
- Publication number
- JPH0125224B2 JPH0125224B2 JP57188560A JP18856082A JPH0125224B2 JP H0125224 B2 JPH0125224 B2 JP H0125224B2 JP 57188560 A JP57188560 A JP 57188560A JP 18856082 A JP18856082 A JP 18856082A JP H0125224 B2 JPH0125224 B2 JP H0125224B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- conductor lead
- contact
- metallized layer
- semiconductor region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 12
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57188560A JPS5976458A (ja) | 1982-10-25 | 1982-10-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57188560A JPS5976458A (ja) | 1982-10-25 | 1982-10-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976458A JPS5976458A (ja) | 1984-05-01 |
| JPH0125224B2 true JPH0125224B2 (enrdf_load_stackoverflow) | 1989-05-16 |
Family
ID=16225822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57188560A Granted JPS5976458A (ja) | 1982-10-25 | 1982-10-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976458A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770552B2 (ja) * | 1986-03-29 | 1995-07-31 | 三菱電機株式会社 | 半導体装置 |
| CN101738088B (zh) | 2008-11-20 | 2011-09-07 | 中芯国际集成电路制造(上海)有限公司 | 炉管隔热装置及利用该装置的炉管预防维护保养方法 |
| JP7117309B2 (ja) * | 2017-01-17 | 2022-08-12 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 半導体スイッチングデバイス |
-
1982
- 1982-10-25 JP JP57188560A patent/JPS5976458A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976458A (ja) | 1984-05-01 |
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