JPS5976454A - 竪形集積回路 - Google Patents
竪形集積回路Info
- Publication number
- JPS5976454A JPS5976454A JP57186863A JP18686382A JPS5976454A JP S5976454 A JPS5976454 A JP S5976454A JP 57186863 A JP57186863 A JP 57186863A JP 18686382 A JP18686382 A JP 18686382A JP S5976454 A JPS5976454 A JP S5976454A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- conductors
- layers
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 abstract description 15
- 230000010354 integration Effects 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 4
- 239000010408 film Substances 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57186863A JPS5976454A (ja) | 1982-10-26 | 1982-10-26 | 竪形集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57186863A JPS5976454A (ja) | 1982-10-26 | 1982-10-26 | 竪形集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976454A true JPS5976454A (ja) | 1984-05-01 |
| JPH04392B2 JPH04392B2 (enExample) | 1992-01-07 |
Family
ID=16195975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57186863A Granted JPS5976454A (ja) | 1982-10-26 | 1982-10-26 | 竪形集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976454A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04128021U (ja) * | 1991-05-17 | 1992-11-20 | 河村電器産業株式会社 | 電線外被剥離装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5119953A (en) * | 1974-08-08 | 1976-02-17 | Motorola Inc | Haipuritsudo sutoritsupurainkairo oyobi gaikairono seizohoho |
| JPS526148U (enExample) * | 1975-06-30 | 1977-01-17 | ||
| JPS5643716A (en) * | 1979-09-18 | 1981-04-22 | Tdk Electronics Co Ltd | Solid*layerrbuilt electronic circuit parts |
-
1982
- 1982-10-26 JP JP57186863A patent/JPS5976454A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5119953A (en) * | 1974-08-08 | 1976-02-17 | Motorola Inc | Haipuritsudo sutoritsupurainkairo oyobi gaikairono seizohoho |
| JPS526148U (enExample) * | 1975-06-30 | 1977-01-17 | ||
| JPS5643716A (en) * | 1979-09-18 | 1981-04-22 | Tdk Electronics Co Ltd | Solid*layerrbuilt electronic circuit parts |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04128021U (ja) * | 1991-05-17 | 1992-11-20 | 河村電器産業株式会社 | 電線外被剥離装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04392B2 (enExample) | 1992-01-07 |
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