JPS5968937A - ワイヤボンダ−におけるワイヤテンシヨン方法 - Google Patents

ワイヤボンダ−におけるワイヤテンシヨン方法

Info

Publication number
JPS5968937A
JPS5968937A JP57179111A JP17911182A JPS5968937A JP S5968937 A JPS5968937 A JP S5968937A JP 57179111 A JP57179111 A JP 57179111A JP 17911182 A JP17911182 A JP 17911182A JP S5968937 A JPS5968937 A JP S5968937A
Authority
JP
Japan
Prior art keywords
wire
tension
bonder
spool
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57179111A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141025B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hiroshi Ushiki
博 丑木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57179111A priority Critical patent/JPS5968937A/ja
Publication of JPS5968937A publication Critical patent/JPS5968937A/ja
Publication of JPH0141025B2 publication Critical patent/JPH0141025B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Wire Bonding (AREA)
JP57179111A 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法 Granted JPS5968937A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57179111A JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57179111A JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Publications (2)

Publication Number Publication Date
JPS5968937A true JPS5968937A (ja) 1984-04-19
JPH0141025B2 JPH0141025B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-09-01

Family

ID=16060201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57179111A Granted JPS5968937A (ja) 1982-10-14 1982-10-14 ワイヤボンダ−におけるワイヤテンシヨン方法

Country Status (1)

Country Link
JP (1) JPS5968937A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685044B1 (ko) 2005-11-29 2007-02-20 주식회사 포스코 에어 가이드형 선재 가이더
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置
CN102658344A (zh) * 2012-05-29 2012-09-12 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN105304223A (zh) * 2015-12-03 2016-02-03 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
CN113070417A (zh) * 2021-04-22 2021-07-06 中国空气动力研究与发展中心设备设计与测试技术研究所 一种极细铝丝自动绷直切割装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685044B1 (ko) 2005-11-29 2007-02-20 주식회사 포스코 에어 가이드형 선재 가이더
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置
CN102630338A (zh) * 2009-12-25 2012-08-08 Adamant工业株式会社 空气张力装置
JP5750644B2 (ja) * 2009-12-25 2015-07-22 アダマンド株式会社 エアーテンション装置
CN102630338B (zh) * 2009-12-25 2015-08-19 Adamant工业株式会社 空气张力装置
CN102658344A (zh) * 2012-05-29 2012-09-12 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN105304223A (zh) * 2015-12-03 2016-02-03 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
CN113070417A (zh) * 2021-04-22 2021-07-06 中国空气动力研究与发展中心设备设计与测试技术研究所 一种极细铝丝自动绷直切割装置

Also Published As

Publication number Publication date
JPH0141025B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-09-01

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