CN102630338A - 空气张力装置 - Google Patents

空气张力装置 Download PDF

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CN102630338A
CN102630338A CN2010800538847A CN201080053884A CN102630338A CN 102630338 A CN102630338 A CN 102630338A CN 2010800538847 A CN2010800538847 A CN 2010800538847A CN 201080053884 A CN201080053884 A CN 201080053884A CN 102630338 A CN102630338 A CN 102630338A
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gas
inserting hole
siphunculus
metal wire
compressed gas
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CN102630338B (zh
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沟口英孝
齐藤利男
照井广己
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Adamant Namiki Precision Jewel Co Ltd
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Adamant Kogyo Co Ltd
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Abstract

一种空气张力装置，其具有插通管(4)、支撑体(6)以及压缩气体供给装置(7)，所述插通管(4)具有可插通引线接合用金属线(2)的插通孔(3)；所述支撑体(6)插入并支撑该插通管(4)；所述压缩气体供给装置(7)通过设在插通管(4)上的气体导入通路(18)对插通孔(3)供给压缩气体；插通孔(3)由第一插通孔(10)以及第二插通孔(11)构成，所述第二插通孔(11)位于第一插通孔(10)的下方，并具有比第一插通孔(10)的孔径更小的细孔部(17)；细孔部(17)的孔径为0.100～0.070mm，且第一插通孔(10)的孔径与细孔部(17)的孔径之比为3.00以上小于6.00。据此可防止金属线(2)的损伤，且赋予规定的适当张力。

Description

空气张力装置
技术领域
本发明涉及一种空气张力装置，其用于使半导体芯片连线的引线接合装置。
背景技术
现有技术中，作为在电路基板上载置半导体芯片，将该半导体芯片的端子与电路基板上的引脚之间用金属线连线的装置，已知有引线接合装置。如图3A至图3C所示，引线接合装置101由空气张力装置102、夹持器103以及毛细管104构成。金属线106卷绕在图中未示出的卷轴上，从该卷轴拉出的金属线106的前端插入形成于上述空气张力装置102、夹持器103以及毛细管104上的图中未示出的插通孔中，使其位于毛细管104的前端部分。
夹持器103及毛细管104构成在上下方向上连动移动的结构。在通过引线接合装置101(下面仅称为装置101)进行接合操作的情况下，首先使夹持器103及毛细管104下降。此时，夹持器103的图中未示出的夹持部夹持金属线106，金属线106随着夹持器103的下降，从卷轴上仅拉出规定长度。然后，如图3A所示，装置101将金属线106接合到安装在引线框110上的半导体芯片111的端子。
然后，装置101在解除利用夹持器103的夹持部对金属线106的夹持后，如图3B所示，使夹持器103及毛细管104上升至规定位置。
然后，使图中未示出的载置了引线框110的平台向水平方向移动，如图3C所示，使引线框110上的导线112位于毛细管104的下方。然后，在夹持器103的夹持部夹持了金属线106的状态下，使夹持器103及毛细管104下降，将金属线106接合到导线112上。
对导线112的接合完成后，用毛细管104的前端擦过导线112，切断金属线106，然后使夹持器103及毛细管104上升，返回规定位置，接合作业完成。
引线接合操作多为对一个半导体芯片111接合多根金属线106的情况，在这种情况下，装置101反复进行上述工序同时每次接合一根金属线。因此，夹持器103及毛细管104反复进行上下运动，金属线106也从卷轴顺次送出。其结果，在进行接合操作期间，金属线106松弛，在半导体芯片111与导线112之间接合了的相互邻接的金属线之间相互接触，可能会发生短路。
为了防止金属线106的松弛，金属线106通过空气张力装置102向空气张力装置102侧拉伸。通过该作用，金属线106可在不松弛的状态下接合到半导体芯片111与导线112上，但需要去除接合操作后的半导体芯片111与导线112之间的金属线的松弛，消除由连续的接合操作引起金属线的松弛而导致的金属线之间相互接触的问题。
空气张力装置通常为如下结构的装置，其使金属线插入被称为张力发生管的筒状部件的插通孔中，使该插通孔内的气体流动，从而将规定的张力附加到金属线上。作为这种空气张力装置的实例，例如有将插通孔内的气体用真空装置通过真空排气作用使插通孔内的气体流动，将规定张力附加到金属线上的装置(以下称为真空式装置)(专利文献1)以及向插入了金属线的插通孔内供给规定压力的压缩气体，将规定张力附加到金属线上的装置(以下称为加压式装置)。
作为加压式装置，例如已知有将插通管的全长(L)与插通孔的直径(d)之间的关系设为30≤(L/d)≤200的装置。
现有技术文献
专利文献1：日本实用新型公开平2-7468号公报
专利文献2：日本专利第3503700号公报
发明内容
本发明要解决的技术问题
但是，专利文献1所述的真空式装置，由于通过使插通孔内的气体真空排气，从而使插通孔下部内的气体向与金属线抽出方向的反方向流动，因此，虽然张力附加到插通孔内的金属线上，但与加压式装置相比，附加到金属线上的张力小，可能会因吸引力的改变导致金属线出现松弛。
此外，专利文献2所述的加压式装置，由于通过向插通孔内供给规定压力的压缩气体，从而使插通孔内的气体向与金属线抽出方向的反方向流动，因此能够在金属线上附加上比真空式装置更大的张力。但是，专利文献2所述的加压式装置，如果不加长插通管的全长或不减小插通孔的直径，则不能增加附加到金属线上的张力。
但是，插通管的插通孔使用的是直径数百微米左右的产品，即使将插通孔的直径变得更小，也存在难以大幅增加张力的问题。因此，专利文献2所述的加压式装置中，为了增加附加到金属线上的张力，不得不加长插通管的全长，这种情况下会出现空气张力装置大型化的其他问题。此外，专利文献的张力发生管的前端形成与横方向的空气供给孔相对的尖细的锥形，从空气供给孔喷出的空气从该尖细的锥面流向接合引线的抽出方向(下方)，然后流入张力发生管5侧的空气流通孔中，即，成为与接合引线的抽出方向反方向的上升气流。因此，由于在上述尖细的前端部沿锥面向下方喷出的气流与在该前端部朝向反方向即上方的空气的反转作用，负荷会附加到上述尖细部分的接合引线上，可能会导致损伤。
进而，近年来，伴随着半导体芯片的小型化，希望使用比现有产品直径更细的金属线。通常，在插通孔的孔径相同的情况下，若金属线的直径变细，存在附加到金属线上的张力变小的问题。因此，在专利文献2所述的加压式装置的情况下，必须使插通管的全长进一步变长，将张力附加到金属线上，进而存在装置自身大型化的问题。
此外，通过调节在插通孔内流动的压缩气体的流量，也能增加附加到金属线上的张力，但该方法中，由于在插通管内流动的压缩气体的流量变化，从而附加到金属线上的张力发生大的变化，因此难以通过调节压缩气体的流量来给金属线附加适当的张力，有时还存在可能切断金属线的问题。
本发明是鉴于上述问题而完成的，其目的在于提供一种空气张力装置，该空气张力装置即使在更少的气体流量下，也能够不损伤细径的金属线，并附加适当的张力，且该张力的调节也能够非常简单且容易地进行。
解决技术问题的技术手段
本发明的要点是：
(1)一种空气张力装置，其具有插通管、支撑体、气体导入通路以及压缩气体供给装置，所述插通管具有可插入引线接合用金属线的插通孔；所述支撑体插入并支撑该插通管；所述气体导入通路朝向插通孔形成；所述压缩气体供给装置具有通过气体导入通路对插通孔供给压缩气体的开口部；
所述插通孔由第一插通孔以及第二插通孔构成，所述第二插通孔连通该第一插通孔并具有比第一插通孔的孔径更小的细孔部；
细孔部的孔径为0.100～0.070mm，且第一插通孔的孔径与细孔部的孔径之比为3.00以上小于6.00，防止直接向引线接合用金属线的侧部喷出压缩气体；通过向比第二插通孔的细孔的孔径更宽的第一插通孔流入压缩气体，从而赋予金属线张力。
(2)如上述(1)所述的空气张力装置，第一插通孔与第二插通孔整合在一起并连通。
(3)如上述(1)所述的空气张力装置，气体导入通路的通道相对于插通管的插通孔形成为十字形。
(4)如上述(1)所述的空气张力装置，含有由插通管及支撑体划定的气体室，连通气体室的压缩气体供给装置的开口部设置在偏离气体导入通路的开口部的位置上，由此实现压缩流入气体对金属线的压力均等化，防止金属线损伤且赋予规定的张力。
发明效果
本发明的空气张力装置中，与上部插通管本体的第一插通孔在轴方向上整合的下部插通管的第二插通孔的细孔部的孔径为0.100～0.070mm，且上部插通管本体的第一插通孔的孔径与细孔部的孔径之比为3.00以上且小于6.00，从而形成插入金属线的插通孔；压缩气体难以流入第二插通孔，压缩气体易流入第一插通孔，因此从压缩气体供给装置供给的压缩气体大部分都能够流入第一插通孔内。此时，压缩气体在第一插通孔内向金属线供给的供给源方向流动，因此对与现有技术相同直径的金属线自不必说，即使对更细径的金属线也能够附加更大的张力。
这样一来，由于本发明即使对更细径的金属线也能够附加适当的张力而进行接合，因此金属线不会发生松弛或弯折，能够防止相邻的金属线之间的接触，防止电路基板的品质降低。
附图说明
图1为表示本发明的空气张力装置的一个实施例的纵截面图。
图2为表示气体导入通路结构的水平截面图。
图3A为表示引线接合工序的一个实例的侧面略示图。
图3B为表示引线接合工序的一个实例的侧面略示图。
图3C为表示引线接合工序的一个实例的侧面略示图。
具体实施方式
如图1所示，本发明的空气张力装置1具有插通管4和支撑体6，所述插通管4具有插通金属线2的插通孔3，所述支撑体6具有插通管4的通孔5，插通管4被插入并支撑于支撑体6的通孔5中。此外，支撑体6具有压缩气体供给部7，所述压缩气体供给部7作为对插通孔3供给压缩了的气体的压缩气体供给装置。以下，对各部的结构进行详细说明。
并且，金属线2一般多使用20μm～40μm直径的金线，但本发明的金属线并不限于此，也可以使用20μm～40μm以外直径的金属线。此外，金属线的材质也并不限于金线，还可以使用铝、铜等材质或以该材质为主要成分的合金等的金属线。
此外，在本说明书中，所谓空气张力装置的上下左右方向表示如图1所示那样观察空气张力装置的情况下的上下左右方向。
如图1所示，插通管4由上部插通管8和下部插通管9构成，插通孔3由设在上部插通管8上的第一插通孔10和设在下部插通管9上的第二插通孔11构成。上部插通管8的结构为具有第一插通孔10的上部插通管本体12被压入到上部套筒13内部，在该上部套筒13的上部压入连接固定上部帽14。此外，下部插通管9的结构为具有第二插通孔11的下部插通管本体15被压入固定于下部套筒16的内部。
第一插通孔10及第二插通孔11为形成为能够插入金属线2的大小的通孔。这些第一插通孔10及第二插通孔11在上部插通管8及下部插通管9安装到通孔5上时，孔的中心形成为相同位置。此外，第二插通孔11的上部形成有细孔部17。细孔部17的孔的内径形成为比第一插通孔10的内径及第二插通孔11(除细孔部17外)的内径细的孔径。该细孔部的孔径优选为0.100～0.070mm，从对金属线2附加张力的观点来看，更优选0.090～0.080mm。
如图1所示，细孔部17与第一插通孔10的关系中，若以第一插通孔10的孔径(内径)为φA，细孔部17的孔径(内径)为φB，则第一插通孔10的孔径(φA)与细孔部17的孔径(φB)的比(φA/φB)为3.00以上且小于6.00。当该比值小于3.00的情况下，细孔部17的内径变大，因此压缩气体不仅易流入第一插通孔10中，还易流入第二插通孔11中，难以在少量气体流量下对金属线2附加规定的张力。另一方面，当上述比值在6.00以上时，压缩气体难以流入第二插通孔11，几乎都流入第一插通孔10中，因此对金属线2附加过大的张力，不令人满意。
并且，从引线接合时向金属线2附加张力或设置金属线2时的操作的难易的观点来看，上述比值更优选为3.00～5.00的范围。
此外，从对金属线2附加张力的观点来看，优选设置成第一插通孔10与细孔部17在轴心方向上整合并连续。
此外，在上部插通管本体12的下端面上，为了将压缩气体导入到插通孔3内，形成有气体导入通路18，所述气体导入通路18具有朝向插通孔3形成的多条通道18b。如图2所示，该气体导入通路18在从平面观察的情况下形成为十字形。
并且，气体导入通路18只要能实现上述要旨即可，不必将气体导入通路18的形状限定为十字形，例如，可以以120°的间隔设置导入通路。此外，为了避免将来自压缩气体供给装置的压缩空气从横方向对金属线直接喷射，气体导入通路18只要能防止将来自压缩气体供给装置7的压缩气体从横方向对金属线2的侧部直接喷射，且能通过多条通道18b将压缩气体导入插通孔3内即可，气体导入通路18可以设置在上部插通管本体12的下端面以外的位置。例如，可以设置从上部插通管12的外周面向插通孔3贯通的孔作为导入通路。
通孔5的内径形成为比上部插通管本体12及下部插通管本体15的外径更大。该通孔5中，上部插通管8以螺丝止固于上端部，下部插通管9以螺丝止固于下端部。上部插通管8及下部插通管9安装到支撑体6上时，在通孔5与上部插通管本体12及下部插通管本体15之间，至少设有以通孔5的内周面与上部插通管本体12及下部插通管本体15的外周面划定并形成的空间部，即气体室21。
压缩气体供给部7的开口部7a与气体室21连通，作为一个实例，其形成在比气体导入通路18的开口部18a更上方的位置上，作为压缩气体向多条气体导入通路18流入的结构，形成在不对金属线2产生过度应力的位置上，以避免来自压缩气体供给部的压缩气体向金属线的横方向直接喷射。
并且，压缩气体供给装置7只要形成在不对金属线2产生过度应力的位置上即可，可以在比气体导入通路18的开口部18a更下方的位置上形成。此外，即使将压缩气体供给装置7的开口部7a与气体导入通路18的开口部18a设在相同高度上，只要开口部7a配置在不与金属线2直接对置的位置上，两开口部7a、18a设在水平错开的位置上，就能够避免压缩气体的压力直接施加于金属线2。
此外，第一插通孔10的内径优选为0.300mm～0.600mm，更优选为0.300mm～0.400mm。当内径为0.300mm以下的情况下，在与金属线2的外径的关系中，压缩气体的流量变化会对附加到金属线2上的张力影响大，过量的张力急剧附加到金属线2上，切断金属线2的可能性变高。另一方面，当内径为0.600mm以上的情况下，虽然减少了附加到金属线2上的张力的急剧变动，但附加到金属线2上的张力变得过小，必须增加压缩气体的流量，可能变得难以调节附加到金属线2上的张力。
上部插通管本体12及下部插通管本体15，从插通管的强度、硬度或防止出现成为配线短路原因的导通垃圾、灰尘等方面考虑，优选使用陶瓷等材料。此外，上部套筒13及下部套筒16可以适当使用能够将上部插通管本体12、下部插通管本体15压入固定，且安装固定于支撑体6上的材料，但从加工性、强度方面来看，优选使用不锈钢等金属材料等。
并且，在上述实施例中，其结构是向上部套筒13的内部压入上部插通管本体12，向下部套筒16的内部压入下部插通管15，但套筒与内插管本体间的固定还可以使用除压入以外的适当方法。此外，还可以使用套筒与内插管本体一体化的产品。
接下来，对本发明的空气张力装置的作用进行说明。本发明的空气张力装置1由于第一插通孔10的孔径(φA)与第二插通孔11的细孔部17的孔径(φB)的比(φA/φB)为3.00以上且小于6.00，因此，可使压缩气体难以向第二插通孔11流入，且压缩气体易于向第一插通孔10流入，能够使流入第一插通孔10的压缩气体的流量与流入第二插通孔11的压缩气体的流量之间产生差异。
即，从图中未示出的给气装置通过压缩气体供给装置7，从气体导入通路18对通孔5内供给压缩气体，供给到通孔5内的压缩气体的大部分，以上述比例流入形成比细孔部17的孔径更大孔径的第一插通孔10内。此时，压缩气体从第一插通孔10的下端，朝为供给金属线的供给源方向的上端侧向上方流动，因此，能够通过该压缩气体对金属线2附加张力。
因此，本发明的空气张力装置1对与现有技术相同直径的金属线自不必说，即使对比现有技术直径细的金属线，也总能够附加更大的张力，因此能够防止由于松弛的金属线之间相接触而产生的电路基板的品质下降。
此外，图1所示的空气张力装置1由于至少在通孔5内形成有气体室21，因此从压缩气体供给装置7供给的压缩气体一旦流入该气体室21后，就会向第一插通孔10及第二插通孔11流入而流动，所述气体室21是由通孔5的内周面与上部插通管8和下部插通管9的外周面划定并形成的空间部。因此，从图中未示出的给气装置供给的压缩气体出现压力变动的情况下，使压缩气体暂时流入发挥作为缓冲箱功能的气体室21，从而能够大幅降低压力变动带来的影响，总是能够供给均压的压缩气体。因此，能够防止受到因压力变动导致张力的急剧变动的影响，使金属线2被切断或受到损伤等问题。
此外，上述空气张力装置1，为了避免从压缩气体供给装置7供给的压缩气体从横方向直接喷射到插入上部插通管12的金属线2，在上下套筒间，使与第一插通孔10垂直相交的、在水平方向呈十字形的气体导入通路18及开口部7a在上下方向上错开并连通，因此气体室21的压缩气体，围绕在气体室21内的上部插通管本体12的周围，从四个开口部18a，即从四个方向流入气体导入通路18内，压缩气体在气体导入通路18相交叉的位置上相交流动，该气流分散，能够使均压的压缩气体朝第一插通孔10的中心轴上方纵向流入。因此，能够将压缩气体高效地送入第一插通孔10。进而，作为其他实例，压缩气体供给装置的开口部也可以在与插通管本体12的气体导入通路间的外侧壁部相对应的气体室上开口，由此，该开口部及气体导入通路没有直接对置，从压缩气体供给装置喷出的压缩气体接触到外侧壁部的同时在气体室内环绕，从气体导入通路的开口部以均等的气体压力流入，因此，来自压缩气体导入装置的压缩气体通过气体室，能够防止对金属线2的侧部直接喷射。能够实现压缩流入气体对金属线2的压力均等化，防止金属线2的损伤且赋予规定的适当张力。
此外，如图1所示，本实施例的空气张力装置1将压缩气体供给装置7的开口部7a的位置与气体导入通路18的开口部18a的位置错开设置，因此，压缩气体不会从压缩气体供给装置7直接对金属线2喷射供给，所以，不会对金属线2施加过度的应力，切实防止金属线2的切断等情况。
实施例1
下面，用具体实施例对本发明进行详细说明，但本发明并不限于该实施例。
在图1所示的装置中，使用第一插通孔的内径(φA)为0.300mm及0.400mm的两种上部插通管本体，和细孔部的内径(φB)为0.080mm、0.090mm、0.100mm、0.110mm、0.120mm及0.130mm六种下部插通管本体。此时，第一插通孔的内径与细孔部的内径之比(φA/φB)，在第一插通孔的内径(φA)为0.300mm的情况下，分别为3.75、3.33、3.00、2.73、2.50及2.31；在第一插通孔的内径(φA)为0.400mm的情况下，分别为5.00、4.44、4.00、3.64、3.33及3.08。此外，使用上部插通管本体的全长(L1)为30.0mm的上部插通管，和下部插通管本体的细孔部的全长(L2)为1.50mm的下部插通管。
然后，细孔部的内径(φB)为0.此外，插入第一插通孔及细孔部内的金属线，从各种金属线中使用20μm直径的金线。该金线从上部插通管的上端面供给，从下部插通管的下端面伸出。此外，从下部插通管的下端面伸出的金线，插入夹持器及毛细管内，从毛细管的前端伸出。
作为压缩气体，用流量调节阀调节一次压(进口压力)为0.5MPa的压缩气体，将二次侧(排气侧)的气体流量调节为1L/min，将调节后的压缩气体供给给空气张力装置。并且，该二次侧的气体流量用设在流量调节阀的下游侧的质量流量计测定。
(试验方法)
在本实施例中，首先，使用第一插通孔的内径(φA)为0.300mm的上部插通管本体与细孔部内径(φB)为0.080mm的下部插通管本体，对10个边长3mm的正方形半导体芯片，各进行50条引线接合，使用倍率为20倍的光学显微镜，用目测确认接合了的金线是否发生了为缺陷主因的松弛。通过该试验，对出现了为缺陷主因的松弛的金线，在10个半导体芯片中为3条以下的记为合格，4条以上的记为不合格。090mm、0.100mm、0.110mm、0.120mm及0.130mm的各下部插通管本体的组合，用同样的方法进行了试验。然后，使用第一插通孔的内径(φA)为0.400mm的上部插通管本体，用与上述同样的方法进行试验，判定是否合格。
进行上述试验的结果表明，无论使用上部插通管本体的第一插通孔的内径(φA)为0.300mm及0.400mm的任一种装置，下部插通管本体的细孔部的内径(φB)为0.080mm、0.090mm、0.100mm，且当第一插通孔的内径(φA)为0.300mm时，上述第一插通孔的内径与细孔部的内径之比(φA/φB)的值为3.75、3.33、3.00的情况下；当第一插通孔的内径(φA)为0.400mm时，上述第一插通孔的内径与细孔部的内径之比(φA/φB)的值为5.00、4.44、4.00的情况下，在10个半导体芯片中，出现为缺陷主因的松弛的金线为0～2条，判定为合格。
由此可知，通过将下部插通管本体的细孔部的孔径设为0.100mm～0.070mm，且将上述比值设为3.00以上且小于6.00，能够消除金线的松弛。
附图标记说明
1空气张力装置；2金属线；3插通孔；4插通管；5通孔；6支撑体；7压缩气体供给装置；7a开口部；8上部插通管；9下部插通管；10第一插通孔；11第二插通孔；15上部插通管本体；16下部插通管本体；17细孔部；18气体导入通路；18a开口部；18b通道；21气体室。

Claims (9)

1.一种空气张力装置，其特征在于，其具有插通管、支撑体、气体导入通路以及压缩气体供给装置，所述插通管具有可插通引线接合用金属线的插通孔；所述支撑体插入并支撑该插通管；所述气体导入通路朝向插通孔形成；所述压缩气体供给装置具有通过气体导入通路对插通孔供给压缩气体的开口部；
所述插通孔由第一插通孔以及第二插通孔构成，所述第二插通孔连通该第一插通孔并具有比第一插通孔的孔径更小的细孔部；
细孔部的孔径为0.100～0.070mm，且第一插通孔的孔径与细孔部的孔径之比为3.00以上小于6.00，防止直接向引线接合用金属线的侧部喷出压缩气体；通过向比第二插通孔的细孔部的孔径更宽的第一插通孔流入压缩气体，从而赋予金属线张力。
2.如权利要求1所述的空气张力装置，其特征在于，将第一插通孔与第二插通孔整合在一起并连通。
3.如权利要求1所述的空气张力装置，其特征在于，气体导入通路的通道相对于插通管的插通孔形成为十字形。
4.如权利要求1所述的空气张力装置，其特征在于，还含有由插通管及支撑体划定的气体室，连通气体室的压缩气体供给装置的开口部设置在偏离气体导入通路的开口部的位置上，由此实现压缩流入气体对金属线的压力均等化，防止金属线损伤且赋予规定的张力。
5.如权利要求1所述的空气张力装置，其特征在于，气体导入通路含有多条通道，上述插通管由第一插通管及第二插通管构成，第一插通管具有第一插通孔，第二插通管具有第二插通孔，所述空气张力装置含有由第一插通管的外面、第二插通管的外面以及支撑体的内周面划定形成并连通气体导入通路的通道的气体室。
6.如权利要求5所述的空气张力装置，其特征在于，压缩气体供给装置的开口部在气体导入通路的上方部分的气体室上开口。
7.如权利要求5所述的空气张力装置，其特征在于，压缩气体供给装置的开口部在气体导入通路的下方部分的气体室上开口。
8.如权利要求5所述的空气张力装置，其特征在于，压缩气体供给装置的开口部在与气体导入通路间的第一插通管的外侧壁部相对应的气体室上开口，该开口部及气体导入通路的位置错开，不直接对置。
9.如权利要求8所述的空气张力装置，其特征在于，来自压缩气体供给装置的压缩气体接触到第一插通管的外侧壁部，沿侧壁部在气体室内环绕，流入气体导入通路，气体导入通路的多条通道间的侧壁部防止从压缩气体导入装置通过气体室喷出的压缩气体对金属线的侧部直接喷射。
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