JPS5967660A - 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 - Google Patents

封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Info

Publication number
JPS5967660A
JPS5967660A JP57177613A JP17761382A JPS5967660A JP S5967660 A JPS5967660 A JP S5967660A JP 57177613 A JP57177613 A JP 57177613A JP 17761382 A JP17761382 A JP 17761382A JP S5967660 A JPS5967660 A JP S5967660A
Authority
JP
Japan
Prior art keywords
resin
epoxy
epoxy resin
semiconductor device
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57177613A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0379370B2 (enrdf_load_stackoverflow
Inventor
Hirotoshi Iketani
池谷　裕俊
Michiya Azuma
東　道也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57177613A priority Critical patent/JPS5967660A/ja
Publication of JPS5967660A publication Critical patent/JPS5967660A/ja
Publication of JPH0379370B2 publication Critical patent/JPH0379370B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP57177613A 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 Granted JPS5967660A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57177613A JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177613A JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7180550A Division JP2654376B2 (ja) 1995-06-26 1995-06-26 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5967660A true JPS5967660A (ja) 1984-04-17
JPH0379370B2 JPH0379370B2 (enrdf_load_stackoverflow) 1991-12-18

Family

ID=16034063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177613A Granted JPS5967660A (ja) 1982-10-12 1982-10-12 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5967660A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105018A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPS59105019A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPH01168781A (ja) * 1987-12-25 1989-07-04 Nok Corp 加硫接着剤配合物
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JPH0841176A (ja) * 1995-06-26 1996-02-13 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
US7637336B2 (en) 2005-03-22 2009-12-29 Aisin Aw Co., Ltd. Hydraulic circuit device and hybrid drive system using that hydraulic circuit device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123800A (enrdf_load_stackoverflow) * 1974-03-08 1975-09-29
JPS51132267A (en) * 1975-04-18 1976-11-17 Hitachi Ltd An epoxy resin composition for sealing semi-conductor elements
JPS52132100A (en) * 1976-04-28 1977-11-05 Hitachi Ltd Epoxy resin molding materials for sealing semiconductors
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Preparation of curing agent for epoxy resin
JPS54110297A (en) * 1978-02-17 1979-08-29 Hitachi Ltd Epoxy resin composition for encapsulating semiconductor device
JPS5645491A (en) * 1979-08-08 1981-04-25 M & T Chemicals Inc Novel organosilicon compound and manufacture thereof
JPS5659841A (en) * 1979-10-19 1981-05-23 Hitachi Ltd Epoxy resin composition
JPS5684717A (en) * 1979-12-14 1981-07-10 Hitachi Ltd Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS57153022A (en) * 1981-03-18 1982-09-21 Toshiba Corp Resin-sealed semiconductor device
JPS57153454A (en) * 1981-03-18 1982-09-22 Toshiba Corp Resin molded type semiconductor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123800A (enrdf_load_stackoverflow) * 1974-03-08 1975-09-29
JPS51132267A (en) * 1975-04-18 1976-11-17 Hitachi Ltd An epoxy resin composition for sealing semi-conductor elements
JPS52132100A (en) * 1976-04-28 1977-11-05 Hitachi Ltd Epoxy resin molding materials for sealing semiconductors
JPS5458795A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Preparation of curing agent for epoxy resin
JPS54110297A (en) * 1978-02-17 1979-08-29 Hitachi Ltd Epoxy resin composition for encapsulating semiconductor device
JPS5645491A (en) * 1979-08-08 1981-04-25 M & T Chemicals Inc Novel organosilicon compound and manufacture thereof
JPS5659841A (en) * 1979-10-19 1981-05-23 Hitachi Ltd Epoxy resin composition
JPS5684717A (en) * 1979-12-14 1981-07-10 Hitachi Ltd Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type
JPS57153022A (en) * 1981-03-18 1982-09-21 Toshiba Corp Resin-sealed semiconductor device
JPS57153454A (en) * 1981-03-18 1982-09-22 Toshiba Corp Resin molded type semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105018A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPS59105019A (ja) * 1982-12-07 1984-06-18 Toshiba Chem Corp 封止用樹脂組成物
JPH01168781A (ja) * 1987-12-25 1989-07-04 Nok Corp 加硫接着剤配合物
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JPH0841176A (ja) * 1995-06-26 1996-02-13 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
US7637336B2 (en) 2005-03-22 2009-12-29 Aisin Aw Co., Ltd. Hydraulic circuit device and hybrid drive system using that hydraulic circuit device

Also Published As

Publication number Publication date
JPH0379370B2 (enrdf_load_stackoverflow) 1991-12-18

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