JPS5965494A - 電子回路基板の実装方法 - Google Patents
電子回路基板の実装方法Info
- Publication number
- JPS5965494A JPS5965494A JP17552382A JP17552382A JPS5965494A JP S5965494 A JPS5965494 A JP S5965494A JP 17552382 A JP17552382 A JP 17552382A JP 17552382 A JP17552382 A JP 17552382A JP S5965494 A JPS5965494 A JP S5965494A
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit
- flexible wiring
- circuit board
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000004020 conductor Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 241001481833 Coryphaena hippurus Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17552382A JPS5965494A (ja) | 1982-10-05 | 1982-10-05 | 電子回路基板の実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17552382A JPS5965494A (ja) | 1982-10-05 | 1982-10-05 | 電子回路基板の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5965494A true JPS5965494A (ja) | 1984-04-13 |
JPS6230720B2 JPS6230720B2 (en, 2012) | 1987-07-03 |
Family
ID=15997546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17552382A Granted JPS5965494A (ja) | 1982-10-05 | 1982-10-05 | 電子回路基板の実装方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5965494A (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0529114U (ja) * | 1991-09-27 | 1993-04-16 | 株式会社トーキン | フエライトコア |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822747U (en, 2012) * | 1971-07-23 | 1973-03-15 | ||
JPS5146622U (en, 2012) * | 1974-09-30 | 1976-04-06 | ||
JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
JPS5426671U (en, 2012) * | 1977-07-26 | 1979-02-21 | ||
JPS5665696U (en, 2012) * | 1979-10-23 | 1981-06-01 |
-
1982
- 1982-10-05 JP JP17552382A patent/JPS5965494A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822747U (en, 2012) * | 1971-07-23 | 1973-03-15 | ||
JPS5146622U (en, 2012) * | 1974-09-30 | 1976-04-06 | ||
JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
JPS5426671U (en, 2012) * | 1977-07-26 | 1979-02-21 | ||
JPS5665696U (en, 2012) * | 1979-10-23 | 1981-06-01 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0529114U (ja) * | 1991-09-27 | 1993-04-16 | 株式会社トーキン | フエライトコア |
Also Published As
Publication number | Publication date |
---|---|
JPS6230720B2 (en, 2012) | 1987-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860000188B1 (ko) | 혼성집적회로 부품 및 그 부착 방법 | |
JP2019145765A (ja) | プリント回路基板 | |
JPS5965494A (ja) | 電子回路基板の実装方法 | |
JP4078723B2 (ja) | コンデンサを備えたフレキシブル両面プリント回路板及びコンデンサの形成方法。 | |
JPS61168990A (ja) | プリント回路基板 | |
JPS58210686A (ja) | 電子回路装置 | |
JPS58105587A (ja) | 回路基板 | |
JP2792958B2 (ja) | 混成集積回路装置 | |
JPS5848496A (ja) | 小型電子回路部品構体 | |
JPS6163081A (ja) | 電子回路部品およびその実装方法 | |
JPS6230719B2 (en, 2012) | ||
JPS60254695A (ja) | 高密度実装構造 | |
JPS58216495A (ja) | プリント配線基板 | |
JPS6010799A (ja) | 電子回路装置 | |
JPS60240185A (ja) | 電子回路装置 | |
JPS5976493A (ja) | 小型電子回路部品 | |
JP2003168852A (ja) | 電子部品の実装方法 | |
JPS5846689A (ja) | 電子回路装置 | |
JPS59171190A (ja) | プリント基板装置 | |
JPS60140785A (ja) | ハイブリッドicの実装構造 | |
JPH09199669A (ja) | プリント配線基板モジュール | |
JPH04181792A (ja) | 印刷配線板の接続装置 | |
JPS5943593A (ja) | 電子回路モジユ−ルの製造方法 | |
JPH01184984A (ja) | 電子回路装置 | |
JPS60110190A (ja) | 混成集積回路 |