JPS5963737A - 布線の接続方法 - Google Patents

布線の接続方法

Info

Publication number
JPS5963737A
JPS5963737A JP57173230A JP17323082A JPS5963737A JP S5963737 A JPS5963737 A JP S5963737A JP 57173230 A JP57173230 A JP 57173230A JP 17323082 A JP17323082 A JP 17323082A JP S5963737 A JPS5963737 A JP S5963737A
Authority
JP
Japan
Prior art keywords
wire
diameter
bonding
pad
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57173230A
Other languages
English (en)
Japanese (ja)
Inventor
Masao Sekihashi
関端　正雄
Kanji Otsuka
寛治 大塚
Yoshiyuki Osawa
大沢　義幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57173230A priority Critical patent/JPS5963737A/ja
Priority to US06/535,055 priority patent/US4580713A/en
Priority to DE19833335848 priority patent/DE3335848A1/de
Publication of JPS5963737A publication Critical patent/JPS5963737A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H01R4/625—Soldered or welded connections
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07554—
    • H10W72/522—
    • H10W72/5363—
    • H10W72/5473—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/553—
    • H10W72/555—
    • H10W72/59—
    • H10W72/952—
    • H10W72/953—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP57173230A 1982-10-04 1982-10-04 布線の接続方法 Pending JPS5963737A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57173230A JPS5963737A (ja) 1982-10-04 1982-10-04 布線の接続方法
US06/535,055 US4580713A (en) 1982-10-04 1983-09-23 Method for bonding an aluminum wire
DE19833335848 DE3335848A1 (de) 1982-10-04 1983-10-03 Verfahren zum verbinden eines aluminiumdrahtes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57173230A JPS5963737A (ja) 1982-10-04 1982-10-04 布線の接続方法

Publications (1)

Publication Number Publication Date
JPS5963737A true JPS5963737A (ja) 1984-04-11

Family

ID=15956553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57173230A Pending JPS5963737A (ja) 1982-10-04 1982-10-04 布線の接続方法

Country Status (3)

Country Link
US (1) US4580713A (enExample)
JP (1) JPS5963737A (enExample)
DE (1) DE3335848A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217507A (ja) * 1986-02-06 1987-09-25 アルカン・インタ−ナシヨナル・リミテツド 絶縁アルミニウム線及びその製法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3537551A1 (de) * 1985-10-22 1987-04-23 Delvotec S A Bondkapillare sowie verfahren zum bonden unter verwendung einer derartigen bondkapillare
US4860941A (en) * 1986-03-26 1989-08-29 Alcan International Limited Ball bonding of aluminum bonding wire
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
US4928384A (en) * 1987-03-24 1990-05-29 Cooper Industries, Inc. Method of making a wire bonded microfuse
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5277356A (en) * 1992-06-17 1994-01-11 Rohm Co., Ltd. Wire bonding method
US20040124545A1 (en) * 1996-12-09 2004-07-01 Daniel Wang High density integrated circuits and the method of packaging the same
US6056185A (en) * 1998-03-18 2000-05-02 Ga-Tek Inc. Method of connecting batteries to electronic circuits
US6884393B2 (en) * 2001-07-13 2005-04-26 Ethicon, Inc. Surface treatment of aluminum alloys to improve sterilization process compatibility
US6641027B2 (en) 2001-12-18 2003-11-04 Ngk Spark Plug Co., Ltd. Method of connecting electric leads to battery tabs
KR100762873B1 (ko) * 2003-06-10 2007-10-08 주식회사 하이닉스반도체 내부 전압 발생기
DE102013104933A1 (de) * 2012-06-06 2013-12-12 Hanning Elektro-Werke Gmbh & Co. Kg Verfahren zur elektrischen Kontaktierung eines Aluminiumdrahts
WO2017066638A1 (en) 2015-10-14 2017-04-20 General Cable Technologies Corporation Cables and wires having conductive elements formed from improved aluminum-zirconium alloys

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754456A (en) * 1956-07-10 Madelung
US2021477A (en) * 1933-08-05 1935-11-19 Aluminum Co Of America Resistance welding
NL274733A (enExample) * 1961-02-15
BE621898A (enExample) * 1961-08-30 1900-01-01
US3459355A (en) * 1967-10-11 1969-08-05 Gen Motors Corp Ultrasonic welder for thin wires
NL162580B (nl) * 1970-12-17 1980-01-15 Philips Nv Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager.
US3717842A (en) * 1971-02-26 1973-02-20 Perfection Electrical Prod Inc Method of connecting aluminum wire to electrical terminals
US3791028A (en) * 1971-09-17 1974-02-12 Ibm Ultrasonic bonding of cubic crystal-structure metals
US4056681A (en) * 1975-08-04 1977-11-01 International Telephone And Telegraph Corporation Self-aligning package for integrated circuits
DE2748239A1 (de) * 1977-10-27 1979-05-03 Siemens Ag Verfahren zum kontaktieren eines elektrischen kaltleiter-widerstandes mit einem anschlusselement
US4279666A (en) * 1979-11-28 1981-07-21 General Motors Corporation Oxidized aluminum overcoat for solid electrolyte sensor
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217507A (ja) * 1986-02-06 1987-09-25 アルカン・インタ−ナシヨナル・リミテツド 絶縁アルミニウム線及びその製法

Also Published As

Publication number Publication date
US4580713A (en) 1986-04-08
DE3335848C2 (enExample) 1992-06-25
DE3335848A1 (de) 1984-04-05

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