JPS5952195B2 - 熱伝導性シリコ−ン組成物 - Google Patents

熱伝導性シリコ−ン組成物

Info

Publication number
JPS5952195B2
JPS5952195B2 JP49144124A JP14412474A JPS5952195B2 JP S5952195 B2 JPS5952195 B2 JP S5952195B2 JP 49144124 A JP49144124 A JP 49144124A JP 14412474 A JP14412474 A JP 14412474A JP S5952195 B2 JPS5952195 B2 JP S5952195B2
Authority
JP
Japan
Prior art keywords
oxide
composition
compositions
amount
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49144124A
Other languages
English (en)
Japanese (ja)
Other versions
JPS50105573A (enExample
Inventor
ハロルド ライト ジヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS50105573A publication Critical patent/JPS50105573A/ja
Publication of JPS5952195B2 publication Critical patent/JPS5952195B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Organic Insulating Materials (AREA)
JP49144124A 1973-12-18 1974-12-17 熱伝導性シリコ−ン組成物 Expired JPS5952195B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US425815 1973-12-18
US425815A US3885984A (en) 1973-12-18 1973-12-18 Methyl alkyl silicone thermoconducting compositions

Publications (2)

Publication Number Publication Date
JPS50105573A JPS50105573A (enExample) 1975-08-20
JPS5952195B2 true JPS5952195B2 (ja) 1984-12-18

Family

ID=23688151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49144124A Expired JPS5952195B2 (ja) 1973-12-18 1974-12-17 熱伝導性シリコ−ン組成物

Country Status (5)

Country Link
US (1) US3885984A (enExample)
JP (1) JPS5952195B2 (enExample)
DE (1) DE2458507A1 (enExample)
FR (1) FR2254622B1 (enExample)
GB (1) GB1480931A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093052A1 (ja) 2017-11-09 2019-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
EP3575363A1 (en) 2018-05-31 2019-12-04 Shin-Etsu Chemical Co., Ltd. Low heat resistance silicone composition
WO2024024498A1 (ja) 2022-07-29 2024-02-01 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法
WO2024209958A1 (ja) 2023-04-07 2024-10-10 信越化学工業株式会社 シリコーン組成物

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092192A (en) * 1977-03-10 1978-05-30 Douglas Magyari High temperature caulking composition and method
JPS5549803A (en) * 1978-10-03 1980-04-10 Toray Silicone Co Electric insulating composition
US4265775A (en) * 1979-08-16 1981-05-05 International Business Machines Corporation Non-bleeding thixotropic thermally conductive material
DE3366648D1 (en) * 1983-01-11 1986-11-06 Ferranti Plc Thermally conducting filler for enclosing electrical components
FR2570383B1 (fr) * 1984-09-20 1988-03-18 Nec Corp Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
DE3707320A1 (de) * 1987-03-07 1988-09-15 Messerschmitt Boelkow Blohm Einrichtung zur kuehlung eines sensors
US4803100A (en) * 1987-10-21 1989-02-07 International Business Machines Corporation Suspension and use thereof
US5094769A (en) * 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
JPH0619027B2 (ja) * 1989-02-13 1994-03-16 信越化学工業株式会社 熱伝導性シリコーンオイルコンパウンド
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
JP2580348B2 (ja) * 1989-11-20 1997-02-12 信越化学工業 株式会社 放熱用グリ―ス組成物
US5008593A (en) * 1990-07-13 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Coaxial liquid cooling of high power microwave excited plasma UV lamps
US5055741A (en) * 1990-07-13 1991-10-08 The United States Of America As Represented By The Secretary Of The Air Force Liquid coolant for high power microwave excited plasma tubes
US5250209A (en) * 1991-04-22 1993-10-05 Thermoset Plastics, Inc. Thermal coupling with water-washable thermally conductive grease
US5235251A (en) * 1991-08-09 1993-08-10 The United States Of America As Represented By The Secretary Of The Air Force Hydraulic fluid cooling of high power microwave plasma tubes
US5232693A (en) * 1992-03-09 1993-08-03 Dow Corning Corporation Method of treating dry skin
CA2090793A1 (en) * 1992-10-09 1994-04-10 Ronald Sinclair Nohr Nonwoven webs having improved tensile strength characteristics
JP3504882B2 (ja) * 1999-05-24 2004-03-08 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーン組成物及びこれを用いたシリコーン成形物
US7396872B2 (en) 2001-03-09 2008-07-08 Dow Corning Toray Silicone Co. Greasy silicone composition
JP3762675B2 (ja) * 2001-09-12 2006-04-05 富士高分子工業株式会社 熱軟化シート
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
TWI385246B (zh) * 2004-05-21 2013-02-11 信越化學工業股份有限公司 聚矽氧烷潤滑油組成物
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
JP2011140566A (ja) 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
WO2015022998A1 (en) 2013-08-14 2015-02-19 Dow Corning Toray Co., Ltd. Novel organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same
JP6159016B2 (ja) 2013-08-14 2017-07-05 東レ・ダウコーニング株式会社 新規なオルガノポリシロキサン、それを含む表面処理剤、それを含む樹脂組成物、及びそのゲル状物又は硬化物
CN106414613B (zh) 2014-04-09 2019-12-27 陶氏东丽株式会社 导热有机硅组合物和电气电子设备
JPWO2022210781A1 (enExample) * 2021-03-31 2022-10-06
WO2022210780A1 (ja) * 2021-03-31 2022-10-06 積水化学工業株式会社 側鎖型アルキル変性シリコーン樹脂
JPWO2022210782A1 (enExample) * 2021-03-31 2022-10-06
WO2024254770A1 (en) * 2023-06-13 2024-12-19 Dow Silicones Corporation Dispersion of a wax in an alkyl methyl siloxane fluid

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2900338A (en) * 1956-05-01 1959-08-18 Postelnck William Glass fiber-thickened grease compositions

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093052A1 (ja) 2017-11-09 2019-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US11186798B2 (en) 2017-11-09 2021-11-30 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
EP3575363A1 (en) 2018-05-31 2019-12-04 Shin-Etsu Chemical Co., Ltd. Low heat resistance silicone composition
US10870786B2 (en) 2018-05-31 2020-12-22 Shin-Etsu Chemical Co., Ltd. Low heat resistance silicone composition
WO2024024498A1 (ja) 2022-07-29 2024-02-01 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法
WO2024209958A1 (ja) 2023-04-07 2024-10-10 信越化学工業株式会社 シリコーン組成物

Also Published As

Publication number Publication date
FR2254622B1 (enExample) 1979-10-12
US3885984A (en) 1975-05-27
DE2458507A1 (de) 1975-06-19
GB1480931A (en) 1977-07-27
JPS50105573A (enExample) 1975-08-20
FR2254622A1 (enExample) 1975-07-11

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