JPS5951519A - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPS5951519A JPS5951519A JP16259782A JP16259782A JPS5951519A JP S5951519 A JPS5951519 A JP S5951519A JP 16259782 A JP16259782 A JP 16259782A JP 16259782 A JP16259782 A JP 16259782A JP S5951519 A JPS5951519 A JP S5951519A
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- air vent
- lead
- resin material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 21
- 239000007787 solid Substances 0.000 description 6
- 239000005355 lead glass Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16259782A JPS5951519A (ja) | 1982-09-17 | 1982-09-17 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16259782A JPS5951519A (ja) | 1982-09-17 | 1982-09-17 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5951519A true JPS5951519A (ja) | 1984-03-26 |
| JPS6258649B2 JPS6258649B2 (enrdf_load_html_response) | 1987-12-07 |
Family
ID=15757612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16259782A Granted JPS5951519A (ja) | 1982-09-17 | 1982-09-17 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5951519A (enrdf_load_html_response) |
-
1982
- 1982-09-17 JP JP16259782A patent/JPS5951519A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258649B2 (enrdf_load_html_response) | 1987-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3885304A (en) | Electric circuit arrangement and method of making the same | |
| US8053684B2 (en) | Mounting structure and method for mounting electronic component onto circuit board | |
| US3773628A (en) | Method of making a lead assembly | |
| KR920000076B1 (ko) | 반도체장치 | |
| JPS5951519A (ja) | 電子部品 | |
| US3618200A (en) | Method of manufacturing chip-shaped passive electronic components | |
| EP0358504A3 (en) | Electrical components | |
| CN203719674U (zh) | 一种接触非磨擦型传感器电阻板 | |
| JP2875562B2 (ja) | 半導体装置及びその製造方法 | |
| JPH0262297A (ja) | 集積回路装置およびそれを用いたｉｃカード | |
| JPH04177753A (ja) | 樹脂封止型半導体装置 | |
| JP2782870B2 (ja) | リードフレーム | |
| JPS61237403A (ja) | 電子部品 | |
| JP2002086487A (ja) | 基板の電極パターンへのモールド樹脂による端子板接続固定方法及び端子板付き電子部品 | |
| JPH11186010A (ja) | 抵抗器とその製造方法並びにその製造装置 | |
| JP3355482B2 (ja) | 部材の導電部へのモールド樹脂による金属板接続方法 | |
| JPS6212101A (ja) | 樹脂封止電子部品用端子フ−プ | |
| JPH01210393A (ja) | 集積回路装置 | |
| JPS59108335A (ja) | 半導体装置の製造方法 | |
| JPH01209194A (ja) | 集積回路装置 | |
| GB1320124A (en) | Micro electronic circuits | |
| JPH07231060A (ja) | 電子部品およびその製造方法 | |
| JPH0262294A (ja) | 集積回路装置およびそれを用いたｉｃカード | |
| JPH0276798A (ja) | 集積回路装置の製造方法 | |
| JPS6390808A (ja) | 電子部品 |