JPS5950596A - チツプ状電子部品およびその製造方法 - Google Patents
チツプ状電子部品およびその製造方法Info
- Publication number
- JPS5950596A JPS5950596A JP57161275A JP16127582A JPS5950596A JP S5950596 A JPS5950596 A JP S5950596A JP 57161275 A JP57161275 A JP 57161275A JP 16127582 A JP16127582 A JP 16127582A JP S5950596 A JPS5950596 A JP S5950596A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode material
- electronic component
- shaped electronic
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000007772 electrode material Substances 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5950596A true JPS5950596A (ja) | 1984-03-23 |
| JPH0312446B2 JPH0312446B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-02-20 |
Family
ID=15732003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57161275A Granted JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950596A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291391A (ja) * | 1985-06-18 | 1986-12-22 | 山陽海運株式会社 | パレツト荷役用吊具装置 |
| JPS63190273U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1987-05-26 | 1988-12-07 | ||
| JPH01231795A (ja) * | 1988-12-02 | 1989-09-18 | Nippon Steel Corp | 自動玉掛け吊り具 |
| US8373535B2 (en) | 2001-01-26 | 2013-02-12 | Quality Thermistor, Inc. | Thermistor and method of manufacture |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101219003B1 (ko) * | 2011-04-29 | 2013-01-04 | 삼성전기주식회사 | 칩형 코일 부품 |
-
1982
- 1982-09-16 JP JP57161275A patent/JPS5950596A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291391A (ja) * | 1985-06-18 | 1986-12-22 | 山陽海運株式会社 | パレツト荷役用吊具装置 |
| JPS63190273U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1987-05-26 | 1988-12-07 | ||
| JPH01231795A (ja) * | 1988-12-02 | 1989-09-18 | Nippon Steel Corp | 自動玉掛け吊り具 |
| US8373535B2 (en) | 2001-01-26 | 2013-02-12 | Quality Thermistor, Inc. | Thermistor and method of manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312446B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-02-20 |