JPS594635U - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS594635U
JPS594635U JP1982099791U JP9979182U JPS594635U JP S594635 U JPS594635 U JP S594635U JP 1982099791 U JP1982099791 U JP 1982099791U JP 9979182 U JP9979182 U JP 9979182U JP S594635 U JPS594635 U JP S594635U
Authority
JP
Japan
Prior art keywords
bonding
bonding equipment
stage
bonding apparatus
directions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982099791U
Other languages
English (en)
Other versions
JPH0121560Y2 (ja
Inventor
徹 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1982099791U priority Critical patent/JPS594635U/ja
Publication of JPS594635U publication Critical patent/JPS594635U/ja
Application granted granted Critical
Publication of JPH0121560Y2 publication Critical patent/JPH0121560Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は基板上のチップのボンディング状態を説明する
図、第２図は従来のボンディング装置によるチップのボ
ンディングの様子を説明する図、第３図は本発明に係る
ボンディング装置の構成図、第４図は同要部斜視図、第
５図は同装置によるチップのボンディングの位置関係を
示す図である。 １は基板、２．　３はステッピングモータ、４゜５・は
Ｌ字板、６は可動板、７は摺動杆、８は蝶棒、９はボン
ディングヘッド、１０はアーム、１１は制御部、１３は
真空ホース。

Claims (1)

    【実用新案登録請求の範囲】
  1. ボンディングステージに載置した基板上に一個づつ半導
    体チップをボンディングする装置において、前記ボンデ
    ィングステージをｘＹ方向に一定ピッチで適宜移動させ
    る手段を備えたことを特徴とするボンディング装置。
JP1982099791U 1982-06-30 1982-06-30 ボンデイング装置 Granted JPS594635U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982099791U JPS594635U (ja) 1982-06-30 1982-06-30 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982099791U JPS594635U (ja) 1982-06-30 1982-06-30 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS594635U true JPS594635U (ja) 1984-01-12
JPH0121560Y2 JPH0121560Y2 (ja) 1989-06-27

Family

ID=30236337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982099791U Granted JPS594635U (ja) 1982-06-30 1982-06-30 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS594635U (ja)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NATIONAL TECHNICAL REPORT=1978 *

Also Published As

Publication number Publication date
JPH0121560Y2 (ja) 1989-06-27

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