JPS5944875A - 梁構造体を有する半導体装置 - Google Patents
梁構造体を有する半導体装置Info
- Publication number
- JPS5944875A JPS5944875A JP57154826A JP15482682A JPS5944875A JP S5944875 A JPS5944875 A JP S5944875A JP 57154826 A JP57154826 A JP 57154826A JP 15482682 A JP15482682 A JP 15482682A JP S5944875 A JPS5944875 A JP S5944875A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- movable beam
- film
- semiconductor device
- polysilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/66—Conductor-insulator-semiconductor capacitors, e.g. MOS capacitors
Landscapes
- Pressure Sensors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154826A JPS5944875A (ja) | 1982-09-06 | 1982-09-06 | 梁構造体を有する半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57154826A JPS5944875A (ja) | 1982-09-06 | 1982-09-06 | 梁構造体を有する半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5944875A true JPS5944875A (ja) | 1984-03-13 |
JPH0472190B2 JPH0472190B2 (enrdf_load_stackoverflow) | 1992-11-17 |
Family
ID=15592720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57154826A Granted JPS5944875A (ja) | 1982-09-06 | 1982-09-06 | 梁構造体を有する半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5944875A (enrdf_load_stackoverflow) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100627A (ja) * | 1984-10-24 | 1986-05-19 | Yokogawa Hokushin Electric Corp | 振動式歪センサ |
JPH01320470A (ja) * | 1988-06-21 | 1989-12-26 | Fujikura Ltd | 半導体加速度センサ |
JPH04192370A (ja) * | 1990-11-26 | 1992-07-10 | Nissan Motor Co Ltd | 半導体加速度センサ |
WO1994006024A1 (en) * | 1992-09-04 | 1994-03-17 | Murata Manufacturing Co., Ltd. | Acceleration sensor |
JP2007121107A (ja) * | 2005-10-27 | 2007-05-17 | Nec Lcd Technologies Ltd | 圧力センサー |
USRE40347E1 (en) | 1992-04-27 | 2008-06-03 | Denso Corporation | Acceleration sensor and process for the production thereof |
US7578162B2 (en) | 1989-12-28 | 2009-08-25 | Kazuhiro Okada | Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus |
JP2009294225A (ja) * | 2009-09-17 | 2009-12-17 | Denso Corp | 半導体力学量センサ |
US7866210B2 (en) | 1992-08-21 | 2011-01-11 | Denso Corporation | Semiconductor mechanical sensor |
-
1982
- 1982-09-06 JP JP57154826A patent/JPS5944875A/ja active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100627A (ja) * | 1984-10-24 | 1986-05-19 | Yokogawa Hokushin Electric Corp | 振動式歪センサ |
JPH01320470A (ja) * | 1988-06-21 | 1989-12-26 | Fujikura Ltd | 半導体加速度センサ |
US7578162B2 (en) | 1989-12-28 | 2009-08-25 | Kazuhiro Okada | Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus |
JPH04192370A (ja) * | 1990-11-26 | 1992-07-10 | Nissan Motor Co Ltd | 半導体加速度センサ |
USRE41047E1 (en) | 1992-04-27 | 2009-12-22 | Denso Corporation | Acceleration sensor and process for the production thereof |
USRE40347E1 (en) | 1992-04-27 | 2008-06-03 | Denso Corporation | Acceleration sensor and process for the production thereof |
USRE40561E1 (en) | 1992-04-27 | 2008-11-04 | Denso Corporation | Acceleration sensor and process for the production thereof |
USRE41213E1 (en) | 1992-04-27 | 2010-04-13 | Denso Corporation | Dynamic amount sensor and process for the production thereof |
USRE42083E1 (en) | 1992-04-27 | 2011-02-01 | Denso Corporation | Acceleration sensor and process for the production thereof |
US7866210B2 (en) | 1992-08-21 | 2011-01-11 | Denso Corporation | Semiconductor mechanical sensor |
WO1994006024A1 (en) * | 1992-09-04 | 1994-03-17 | Murata Manufacturing Co., Ltd. | Acceleration sensor |
JP2007121107A (ja) * | 2005-10-27 | 2007-05-17 | Nec Lcd Technologies Ltd | 圧力センサー |
JP2009294225A (ja) * | 2009-09-17 | 2009-12-17 | Denso Corp | 半導体力学量センサ |
Also Published As
Publication number | Publication date |
---|---|
JPH0472190B2 (enrdf_load_stackoverflow) | 1992-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5616514A (en) | Method of fabricating a micromechanical sensor | |
US5578755A (en) | Accelerometer sensor of crystalline material and method for manufacturing the same | |
EP0102069B1 (en) | Vibration analyzing device | |
JP3430771B2 (ja) | 半導体力学量センサの製造方法 | |
EP0591554B1 (en) | Acceleration sensor and its manufacture | |
JP2582229B2 (ja) | シリコンダイアグラムおよびシリコン圧力センサーの製造方法 | |
KR100348177B1 (ko) | 단결정 실리콘의 마이크로머시닝 기법에서의 깊은 트렌치절연막을 이용한 절연 방법 | |
KR100414570B1 (ko) | 삼중막을 이용한 단결정 실리콘 미세 구조물의 절연 방법 | |
JP3762928B2 (ja) | マイクロメカニックセンサおよびその製造方法 | |
USRE41889E1 (en) | Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced | |
CN108217581A (zh) | 一种mems压电传感器及其制作方法 | |
JPS5944875A (ja) | 梁構造体を有する半導体装置 | |
JP4271751B2 (ja) | 電子装置および電子装置のためのメンブレンを形成する方法 | |
CN102976263B (zh) | 一种mems压阻式多轴力传感器的制备方法 | |
JP2000155030A (ja) | 角速度センサの製造方法 | |
JP4081868B2 (ja) | 微小装置の製造方法 | |
JPH02303048A (ja) | 半導体装置およびその製造方法 | |
JPH0830718B2 (ja) | 半導体加速度センサ | |
JPH02218172A (ja) | 半導体加速度センサの製造方法 | |
JP4220582B2 (ja) | センサの製造方法 | |
JPH01222489A (ja) | 半導体装置の製造方法 | |
JPH11186566A (ja) | 微小装置の製造方法 | |
JPS6267880A (ja) | 半導体装置の製造方法 | |
JP2002148278A (ja) | 半導体力学量センサとその製造方法 | |
JP4122572B2 (ja) | 半導体力学量センサの製造方法 |