JPS5936953A - 半導体用リ−ドフレ−ム - Google Patents

半導体用リ−ドフレ−ム

Info

Publication number
JPS5936953A
JPS5936953A JP57147317A JP14731782A JPS5936953A JP S5936953 A JPS5936953 A JP S5936953A JP 57147317 A JP57147317 A JP 57147317A JP 14731782 A JP14731782 A JP 14731782A JP S5936953 A JPS5936953 A JP S5936953A
Authority
JP
Japan
Prior art keywords
plating layer
nickel plating
lead frame
plated layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57147317A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347343B2 (enExample
Inventor
Osamu Yoshioka
修 吉岡
Norio Okabe
則夫 岡部
Sadao Nagayama
長山　定夫
Yoshinori Bando
坂東　良則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57147317A priority Critical patent/JPS5936953A/ja
Publication of JPS5936953A publication Critical patent/JPS5936953A/ja
Publication of JPS6347343B2 publication Critical patent/JPS6347343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP57147317A 1982-08-25 1982-08-25 半導体用リ−ドフレ−ム Granted JPS5936953A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57147317A JPS5936953A (ja) 1982-08-25 1982-08-25 半導体用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57147317A JPS5936953A (ja) 1982-08-25 1982-08-25 半導体用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5936953A true JPS5936953A (ja) 1984-02-29
JPS6347343B2 JPS6347343B2 (enExample) 1988-09-21

Family

ID=15427449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57147317A Granted JPS5936953A (ja) 1982-08-25 1982-08-25 半導体用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5936953A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245448B1 (en) * 1988-03-28 2001-06-12 Texas Instruments Incorporated Lead frame with reduced corrosion

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245448B1 (en) * 1988-03-28 2001-06-12 Texas Instruments Incorporated Lead frame with reduced corrosion

Also Published As

Publication number Publication date
JPS6347343B2 (enExample) 1988-09-21

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