JPS5934693A - 両面実装ハイブリツドicの製造方法 - Google Patents
両面実装ハイブリツドicの製造方法Info
- Publication number
- JPS5934693A JPS5934693A JP14515382A JP14515382A JPS5934693A JP S5934693 A JPS5934693 A JP S5934693A JP 14515382 A JP14515382 A JP 14515382A JP 14515382 A JP14515382 A JP 14515382A JP S5934693 A JPS5934693 A JP S5934693A
- Authority
- JP
- Japan
- Prior art keywords
- board
- bent
- double
- sided mounting
- copper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 2
- 210000004899 c-terminal region Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14515382A JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドicの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14515382A JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドicの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5934693A true JPS5934693A (ja) | 1984-02-25 |
JPS6354238B2 JPS6354238B2 (enrdf_load_stackoverflow) | 1988-10-27 |
Family
ID=15378643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14515382A Granted JPS5934693A (ja) | 1982-08-20 | 1982-08-20 | 両面実装ハイブリツドicの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5934693A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004138704A (ja) * | 2002-10-16 | 2004-05-13 | Seiko Epson Corp | 表示体構造、表示体構造の製造方法および電子機器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5437299A (en) * | 1977-08-30 | 1979-03-19 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of filamental piezo-electric material |
JPS57120391A (en) * | 1981-01-19 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method of producing circuit board |
-
1982
- 1982-08-20 JP JP14515382A patent/JPS5934693A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5437299A (en) * | 1977-08-30 | 1979-03-19 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of filamental piezo-electric material |
JPS57120391A (en) * | 1981-01-19 | 1982-07-27 | Matsushita Electric Ind Co Ltd | Method of producing circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004138704A (ja) * | 2002-10-16 | 2004-05-13 | Seiko Epson Corp | 表示体構造、表示体構造の製造方法および電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JPS6354238B2 (enrdf_load_stackoverflow) | 1988-10-27 |
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