JPS5928352A - 位置決め装置 - Google Patents

位置決め装置

Info

Publication number
JPS5928352A
JPS5928352A JP57137268A JP13726882A JPS5928352A JP S5928352 A JPS5928352 A JP S5928352A JP 57137268 A JP57137268 A JP 57137268A JP 13726882 A JP13726882 A JP 13726882A JP S5928352 A JPS5928352 A JP S5928352A
Authority
JP
Japan
Prior art keywords
bonding
signals
acceleration
wire bonder
positioning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57137268A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231861B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Ryuichi Kyomasu
隆一 京増
Nobuhiro Takasugi
高杉　信博
Toshihiro Sato
佐藤　利博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP57137268A priority Critical patent/JPS5928352A/ja
Publication of JPS5928352A publication Critical patent/JPS5928352A/ja
Publication of JPH0231861B2 publication Critical patent/JPH0231861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57137268A 1982-08-09 1982-08-09 位置決め装置 Granted JPS5928352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57137268A JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Publications (2)

Publication Number Publication Date
JPS5928352A true JPS5928352A (ja) 1984-02-15
JPH0231861B2 JPH0231861B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-07-17

Family

ID=15194697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57137268A Granted JPS5928352A (ja) 1982-08-09 1982-08-09 位置決め装置

Country Status (1)

Country Link
JP (1) JPS5928352A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0532164A3 (en) * 1991-07-12 1994-07-20 Matsushita Electric Ind Co Ltd Parabolic signal generator
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0532164A3 (en) * 1991-07-12 1994-07-20 Matsushita Electric Ind Co Ltd Parabolic signal generator
KR100604307B1 (ko) * 2000-05-27 2006-07-24 삼성테크윈 주식회사 와이어 본딩 시스템의 속도 프로파일 설계 방법

Also Published As

Publication number Publication date
JPH0231861B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-07-17

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