JPS5922955A - 半導体封止用樹脂組成物 - Google Patents
半導体封止用樹脂組成物Info
- Publication number
- JPS5922955A JPS5922955A JP13274782A JP13274782A JPS5922955A JP S5922955 A JPS5922955 A JP S5922955A JP 13274782 A JP13274782 A JP 13274782A JP 13274782 A JP13274782 A JP 13274782A JP S5922955 A JPS5922955 A JP S5922955A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- particle size
- average particle
- filler
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 11
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000007789 sealing Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 96
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 40
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 229910002026 crystalline silica Inorganic materials 0.000 claims abstract description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000005350 fused silica glass Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 9
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13274782A JPS5922955A (ja) | 1982-07-29 | 1982-07-29 | 半導体封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13274782A JPS5922955A (ja) | 1982-07-29 | 1982-07-29 | 半導体封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922955A true JPS5922955A (ja) | 1984-02-06 |
| JPH021184B2 JPH021184B2 (enExample) | 1990-01-10 |
Family
ID=15088633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13274782A Granted JPS5922955A (ja) | 1982-07-29 | 1982-07-29 | 半導体封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922955A (enExample) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627143A (ja) * | 1985-07-04 | 1987-01-14 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS6261350A (ja) * | 1985-09-11 | 1987-03-18 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS62128159A (ja) * | 1985-11-29 | 1987-06-10 | Hitachi Ltd | 高集積ｌｓｉプラスチツクパツケ−ジ |
| JPS62149743A (ja) * | 1985-12-25 | 1987-07-03 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS63160256A (ja) * | 1986-12-23 | 1988-07-04 | Nitto Electric Ind Co Ltd | 半導体装置の製法 |
| JPS6462362A (en) * | 1987-09-03 | 1989-03-08 | Seitetsu Kagaku Co Ltd | Filler and polymer composition containing same |
| JPH01161065A (ja) * | 1987-12-18 | 1989-06-23 | Tokuyama Soda Co Ltd | シリカおよびその製造方法 |
| JPH01263131A (ja) * | 1988-04-15 | 1989-10-19 | Nippon Steel Chem Co Ltd | 封止樹脂充填用シリカ |
| JPH02228354A (ja) * | 1989-03-01 | 1990-09-11 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPH03247635A (ja) * | 1990-12-31 | 1991-11-05 | Sumitomo Seika Chem Co Ltd | シリカ微粉末 |
| JPH0726120A (ja) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | 半導体封止装置 |
| JPH08239557A (ja) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | 半導体封止装置 |
| JPH08239556A (ja) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | 半導体封止装置 |
| JP2003012895A (ja) * | 2001-06-27 | 2003-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
-
1982
- 1982-07-29 JP JP13274782A patent/JPS5922955A/ja active Granted
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627143A (ja) * | 1985-07-04 | 1987-01-14 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS6261350A (ja) * | 1985-09-11 | 1987-03-18 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS62128159A (ja) * | 1985-11-29 | 1987-06-10 | Hitachi Ltd | 高集積ｌｓｉプラスチツクパツケ−ジ |
| JPS62149743A (ja) * | 1985-12-25 | 1987-07-03 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS63160256A (ja) * | 1986-12-23 | 1988-07-04 | Nitto Electric Ind Co Ltd | 半導体装置の製法 |
| JPS6462362A (en) * | 1987-09-03 | 1989-03-08 | Seitetsu Kagaku Co Ltd | Filler and polymer composition containing same |
| JPH01161065A (ja) * | 1987-12-18 | 1989-06-23 | Tokuyama Soda Co Ltd | シリカおよびその製造方法 |
| JPH01263131A (ja) * | 1988-04-15 | 1989-10-19 | Nippon Steel Chem Co Ltd | 封止樹脂充填用シリカ |
| JPH02228354A (ja) * | 1989-03-01 | 1990-09-11 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPH03247635A (ja) * | 1990-12-31 | 1991-11-05 | Sumitomo Seika Chem Co Ltd | シリカ微粉末 |
| JPH0726120A (ja) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | 半導体封止装置 |
| JPH08239557A (ja) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | 半導体封止装置 |
| JPH08239556A (ja) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | 半導体封止装置 |
| JP2003012895A (ja) * | 2001-06-27 | 2003-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021184B2 (enExample) | 1990-01-10 |
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