JPS592137U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS592137U
JPS592137U JP5906683U JP5906683U JPS592137U JP S592137 U JPS592137 U JP S592137U JP 5906683 U JP5906683 U JP 5906683U JP 5906683 U JP5906683 U JP 5906683U JP S592137 U JPS592137 U JP S592137U
Authority
JP
Japan
Prior art keywords
circuit board
insulating
conductive path
chip
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5906683U
Other languages
Japanese (ja)
Other versions
JPS5930535Y2 (en
Inventor
西村　嚴彦
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP5906683U priority Critical patent/JPS5930535Y2/en
Publication of JPS592137U publication Critical patent/JPS592137U/en
Application granted granted Critical
Publication of JPS5930535Y2 publication Critical patent/JPS5930535Y2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の方法に依る半導体の接続方法を示す断面
図である。第２図は本考案に依る半導体の接続方法の一
例を示す鳥敞図であり、２３は接続を為す可撓金属片で
ある。第３図は同様に第２図の平面図である。第４図は
本考案に依る他の実施例を示し、第５図はその部分拡大
図である。第６図は本考案に依る他の実施例を示す。第
７図は本考案の他の実施例である。第８図は本考案に依
るさらに他の実施例を示す。FIG. 1 is a cross-sectional view showing a conventional method for connecting semiconductors. FIG. 2 is a schematic diagram showing an example of the method for connecting semiconductors according to the present invention, and numeral 23 indicates a flexible metal piece for making connections. FIG. 3 is a plan view of FIG. 2 as well. FIG. 4 shows another embodiment according to the present invention, and FIG. 5 is a partially enlarged view thereof. FIG. 6 shows another embodiment according to the invention. FIG. 7 shows another embodiment of the present invention. FIG. 8 shows yet another embodiment according to the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面にわたり導電路を設置された絶縁性回路基板、さち
に上記回路基板の定められた位置に配置される半導体集
積回路ＩＣチップに於いて該ＩＣチップの外部接続端子
と前記導電路とが弾性を与えられた金属片で電気接続さ
れ、かつ複数の上記金属片を完全固定する絶縁性の保持
枠が該絶縁性回路基板に載置されてなる半導体装置。In an insulating circuit board having a conductive path across its surface, and a semiconductor integrated circuit IC chip placed at a predetermined position on the circuit board, the external connection terminals of the IC chip and the conductive path have elasticity. A semiconductor device in which an insulating holding frame is placed on the insulating circuit board and is electrically connected to a given metal piece and completely fixes the plurality of metal pieces.
JP5906683U 1983-04-20 1983-04-20 semiconductor equipment Expired JPS5930535Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5906683U JPS5930535Y2 (en) 1983-04-20 1983-04-20 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5906683U JPS5930535Y2 (en) 1983-04-20 1983-04-20 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS592137U true JPS592137U (en) 1984-01-09
JPS5930535Y2 JPS5930535Y2 (en) 1984-08-31

Family

ID=30189326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5906683U Expired JPS5930535Y2 (en) 1983-04-20 1983-04-20 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5930535Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312788A (en) * 1993-04-26 1994-11-08 Mitsubishi Heavy Ind Ltd Automatically detachable cleaning cap device of filling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312788A (en) * 1993-04-26 1994-11-08 Mitsubishi Heavy Ind Ltd Automatically detachable cleaning cap device of filling apparatus

Also Published As

Publication number Publication date
JPS5930535Y2 (en) 1984-08-31

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