JPS59213155A - 半導体集積回路装置 - Google Patents
半導体集積回路装置Info
- Publication number
- JPS59213155A JPS59213155A JP58087893A JP8789383A JPS59213155A JP S59213155 A JPS59213155 A JP S59213155A JP 58087893 A JP58087893 A JP 58087893A JP 8789383 A JP8789383 A JP 8789383A JP S59213155 A JPS59213155 A JP S59213155A
- Authority
- JP
- Japan
- Prior art keywords
- diode
- input
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58087893A JPS59213155A (ja) | 1983-05-17 | 1983-05-17 | 半導体集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58087893A JPS59213155A (ja) | 1983-05-17 | 1983-05-17 | 半導体集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59213155A true JPS59213155A (ja) | 1984-12-03 |
| JPH0348662B2 JPH0348662B2 (enrdf_load_stackoverflow) | 1991-07-25 |
Family
ID=13927559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58087893A Granted JPS59213155A (ja) | 1983-05-17 | 1983-05-17 | 半導体集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59213155A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015023177A (ja) * | 2013-07-19 | 2015-02-02 | 富士通セミコンダクター株式会社 | 半導体装置 |
| CN115356606A (zh) * | 2022-08-03 | 2022-11-18 | 北京芯可鉴科技有限公司 | 隔离器件耐压测试的装置、制造方法及耐压测试的方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4975280A (enrdf_load_stackoverflow) * | 1972-11-24 | 1974-07-19 | ||
| JPS4982279A (enrdf_load_stackoverflow) * | 1972-12-11 | 1974-08-08 | ||
| JPS5879735A (ja) * | 1981-11-06 | 1983-05-13 | Nec Corp | 半導体集積回路 |
-
1983
- 1983-05-17 JP JP58087893A patent/JPS59213155A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4975280A (enrdf_load_stackoverflow) * | 1972-11-24 | 1974-07-19 | ||
| JPS4982279A (enrdf_load_stackoverflow) * | 1972-12-11 | 1974-08-08 | ||
| JPS5879735A (ja) * | 1981-11-06 | 1983-05-13 | Nec Corp | 半導体集積回路 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015023177A (ja) * | 2013-07-19 | 2015-02-02 | 富士通セミコンダクター株式会社 | 半導体装置 |
| CN115356606A (zh) * | 2022-08-03 | 2022-11-18 | 北京芯可鉴科技有限公司 | 隔离器件耐压测试的装置、制造方法及耐压测试的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0348662B2 (enrdf_load_stackoverflow) | 1991-07-25 |
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