JPS59211565A - 無電解はんだめつき浴 - Google Patents

無電解はんだめつき浴

Info

Publication number
JPS59211565A
JPS59211565A JP8424783A JP8424783A JPS59211565A JP S59211565 A JPS59211565 A JP S59211565A JP 8424783 A JP8424783 A JP 8424783A JP 8424783 A JP8424783 A JP 8424783A JP S59211565 A JPS59211565 A JP S59211565A
Authority
JP
Japan
Prior art keywords
plating
borofluoride
bath
solder plating
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8424783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS622630B2 (https=
Inventor
Hidekatsu Kotanino
小谷野　英勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO MEKKI KK
Original Assignee
TOKYO MEKKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO MEKKI KK filed Critical TOKYO MEKKI KK
Priority to JP8424783A priority Critical patent/JPS59211565A/ja
Publication of JPS59211565A publication Critical patent/JPS59211565A/ja
Publication of JPS622630B2 publication Critical patent/JPS622630B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP8424783A 1983-05-16 1983-05-16 無電解はんだめつき浴 Granted JPS59211565A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8424783A JPS59211565A (ja) 1983-05-16 1983-05-16 無電解はんだめつき浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8424783A JPS59211565A (ja) 1983-05-16 1983-05-16 無電解はんだめつき浴

Publications (2)

Publication Number Publication Date
JPS59211565A true JPS59211565A (ja) 1984-11-30
JPS622630B2 JPS622630B2 (https=) 1987-01-21

Family

ID=13825130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8424783A Granted JPS59211565A (ja) 1983-05-16 1983-05-16 無電解はんだめつき浴

Country Status (1)

Country Link
JP (1) JPS59211565A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process

Also Published As

Publication number Publication date
JPS622630B2 (https=) 1987-01-21

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