JPS59208722A - 半導体集積回路装置用合せマ−ク - Google Patents
半導体集積回路装置用合せマ−クInfo
- Publication number
- JPS59208722A JPS59208722A JP58082507A JP8250783A JPS59208722A JP S59208722 A JPS59208722 A JP S59208722A JP 58082507 A JP58082507 A JP 58082507A JP 8250783 A JP8250783 A JP 8250783A JP S59208722 A JPS59208722 A JP S59208722A
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- island
- integrated circuit
- alignment mark
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 239000013078 crystal Substances 0.000 claims abstract description 26
- 238000000926 separation method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229940095676 wafer product Drugs 0.000 description 2
- 235000014121 butter Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Element Separation (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58082507A JPS59208722A (ja) | 1983-05-13 | 1983-05-13 | 半導体集積回路装置用合せマ−ク |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58082507A JPS59208722A (ja) | 1983-05-13 | 1983-05-13 | 半導体集積回路装置用合せマ−ク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59208722A true JPS59208722A (ja) | 1984-11-27 |
JPS6347331B2 JPS6347331B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=13776417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58082507A Granted JPS59208722A (ja) | 1983-05-13 | 1983-05-13 | 半導体集積回路装置用合せマ−ク |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59208722A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077421A (ja) * | 1983-10-05 | 1985-05-02 | Fujitsu Ltd | 位置合わせ方法 |
JPS60160122A (ja) * | 1984-01-30 | 1985-08-21 | Rohm Co Ltd | サーマルプリントヘッドの製造方法 |
JPH025508A (ja) * | 1988-06-24 | 1990-01-10 | Sony Corp | 半導体基板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153862U (enrdf_load_stackoverflow) * | 1974-06-07 | 1975-12-20 |
-
1983
- 1983-05-13 JP JP58082507A patent/JPS59208722A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153862U (enrdf_load_stackoverflow) * | 1974-06-07 | 1975-12-20 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077421A (ja) * | 1983-10-05 | 1985-05-02 | Fujitsu Ltd | 位置合わせ方法 |
JPS60160122A (ja) * | 1984-01-30 | 1985-08-21 | Rohm Co Ltd | サーマルプリントヘッドの製造方法 |
JPH025508A (ja) * | 1988-06-24 | 1990-01-10 | Sony Corp | 半導体基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6347331B2 (enrdf_load_stackoverflow) | 1988-09-21 |
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